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SO-DIMM Socket for Memory Expansion
Comforming to JEDEC Standard DMM3 Series, 144 Contacts, 0.8mm Pitch
Notebook computers, palmtop computers and handheld devices
FEATURE
Applicable to 144-position SO-DIMM module
board per JEDEC standard
Easy mating and unmating with unique locking
and ejecting system Surface mount design Voltage keying design for 3.3V modules
DMM3(144)
SPECIFICATION
Voltage rating Current rating Dielectric withstanding voltage Insulation resistance Contact resistance 100V AC (rms) 0.5A/contact 250V AC (rms) for 1 minute 250M min. at 250V DC 40mmax.
MATERIAL/FINISH
Contact/Finish Insulator Locking Tab Copper alloy/Gold over Nickel plating (mating), Tin-Lead (tail) LCP resin (UL94V-O)/Ivory Copper alloy/Solder plating
1
DMM3 Series (144 Contacts)
Unit : mm
DMM3-RS144A2B-13
63.00
31.50 1.45 0.9 2.0 5.2 2.10 23.20 30.50 2.50 30.10 32.80 72.00 67.85
62.80 (1.00) (1.10) 30.10 23.20 20.00 2.10 2.50 30.50 32.80 29.00
DMM3(144)
7.50
1.5
69.60 72.00
0.7 2.0 4.00
2
5.0
DMM3 Series (144 Contacts)
Unit : mm
PCB Mounting Dimensions
63 0.05 60.6 0.03 31.5 0.10 4.6 0.10 4.5 0.10 30.3 60.6 0.05 4.8 0.05 23.2 0.8 0.03
0.03
2.1 0.10 16.1 32.8 0.03 3.1 0.05 3.1 0.05
1.
1.6
0.
10
0.5 0.03
DMM3(144)
1 0.03
4.6 0.03 60.6 0.03
32.8 0.03
PCB Connector Mounting Space (Reference)
.. 74
25.4
4.3
4.7
25. 4
25
15.4
3.4
3
5.2
30.4
29
2 0.05
23.2 0.03
2.5 0.10
2 0.05
1
0. 10
DMM3 Series (144 Contacts)
Unit : mm
Module Dimensions
3 4 0.10 3 3.8MAX.
25.4
20
3.2
6
1 3.3 0.10
23.2 0.05 2.1 0.05
143 1.5 0.10 2.5 0.05 32.8 0.05 4.8 0.05 4MIN. 4 0.10 2
67.6 0.10
DMM3(144)
63.6 2 3.7
0.10
1.5 0.10 4.8 0.05
Detail "C"
23.2 0.05 2.5 0.05
2.1
0.10
32.8 0.05 144 2.5MAX. 0.6 0.05
2
30
1 0.10 2 2 33.8
Detail "D"
63.6 2.55 0.8 0.10 67.6
Detail "E"
4

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