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| Wire Bondable Resistor Network Arrays Chip Network Array Series * Absolute tolerances to 0.1% * Tight TCR tracking to 5ppm/C * Ratio match tolerances to 0.05% * Ultra-stable tantalum nitride resistors IRC's TaNSil(R) network array resistors are ideally suited for applications that demand a small footprint. The small wire bondable chip package provides higher component density, lower resistor cost and high reliability. The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking and low cost. Excellent performance in harsh, humid environments is a trademark of IRC's self-passivating TaNSil(R) resistor film. For applications requiring high performance resistor networks in a low cost, wire bondable package, specify IRC network array die. Electrical Data Isolated Resistance Range Absolute Tolerance Ratio Tolerance to R1 Absolute TCR Tracking TCR Element Power Rating Package Power Rating Rated Operating Voltage (not to exceed P x R) Operating Temperature Noise Substrate Material Substrate Thickness Bond Pad Metallization Backside Passivation General Note TCR/Inspection Code Table Bussed 10 to 1.25M 300ppm/C to 0.1% 100ppm/C 50ppm/C 25ppm/C Absolute TCR 10 to 2.5M Commercial Code 00 01 02 03 MIL Inspection Code* 04 05 06 07 to 0.1% to 0.05% to 25ppm/C to 5ppm/C 100mW @ 70C 50mW @ 70C 8-Pad 400mW @ 70C 16-Pad 800mW @ 70C 24-Pad 1.0W @ 70C 100V -55C to +150C <-30dB Oxidized Silicon (10KA SiO2 minimum) 0.016 0.001 (0.406mm 0.01) 10KA minimum 15KA minimum Silicon (gold available) Silicon Dioxide or Silicon Nitride *Notes: Product supplied to Class H of MIL-PRF 38534 include 100% visual inspection Power Derating Data Aluminum Gold IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC's own data and is considered accurate at time of going to print. (c) IRC Advanced Film Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com A subsidiary of TT electronics plc WBC Series Issue January 2009 Sheet 1 of 4 Wire Bondable Resistor Network Arrays Manufacturing Capabilities Data Isolated schematic A Bussed schematic B Absolute TCR (ppm/C) Ohmic range () 10 - 25 26 - 50 51 - 200 Available tolerances Available ratio tolerances FG CDF CDFG ABCDFG Best TCR tracking (ppm/C) 50 10 5 5 Ohmic range () 10 - 25 26 - 50 51 - 100 101 - 200 201 - 500 Available tolerances Available ratio tolerances FG DFG CDFG BCDFG BCDFG Best TCR tracking (ppm/C) 200 100 50 25 20 5 100 50 25 20 5 50 25 20 5 20 5 FGJ DFGJ CDFGJ BCDFGJ FGJ FGJ DFGJ DFGJ BCDFGJ 300 201 - 2.5M 501 - 1.25M B C D F G J A B C D F G 26 - 50 51 - 200 100 201 - 2.5M DFGJ CDFGJ BCDFGJ CDFG CDFG ABFG 10 5 5 26 - 50 51 - 100 101 - 200 201 - 500 501 - 350K 26 - 50 51 - 200 50 201 - 2.5M BCDFGJ ABFG 5 201 - 500 BCDFGJ BCDFG DFGJ CDFGJ CDFG CDFG 10 5 51 - 100 101 - 200 FGJ DFGJ DFGJ BCDFGJ DFG CDFG BCDFG BCDFG BCDFGJ ABCDFG DFGJ DFGJ CDFG BCDFG 501 - 1.25M B C D F G J A B C D F G 51 - 200 25 201 - 2.5M BCDFGJ ABFG 5 501 - 1.25M B C D F G J A B C D F G CDFGJ CDFG 5 201 - 500 BCDFGJ BCDFG (c) IRC Advanced Film Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com WBC Series Issue January 2009 Sheet 2 of 4 Wire Bondable Resistor Network Arrays Physical Data DSS4X 8 DSS4A 7 6 5 0.070 0.001 (1.778mm 0.025) R1 0.070 0.001 (1.778mm 0.025) 1 2 3 4 Pad 1 8 DSS4B 7 6 5 0.004 min Bond Pads R1 1 2 3 4 DSS8X DSS8A 16 15 14 13 12 11 10 9 0.140 0.001 (3.556mm 0.025) 0.080 0.001 (2.032mm 0.025) R1 1 2 3 4 5 6 7 8 Pad 1 16 15 14 DSS8B 13 12 11 10 9 0.004 min Bond Pads R1 1 2 3 4 5 6 7 8 (c) IRC Advanced Film Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com WBC Series Issue January 2009 Sheet 3 of 4 Wire Bondable Resistor Network Arrays Physical Data DQSCX 0.115 0.001 (2.921mm 0.025) 24 23 22 21 20 DQSCA 19 18 17 16 15 14 13 R1 0.086 0.001 (2.184mm 0.025) 1 2 3 4 5 6 7 8 9 10 11 12 DQSCB 24 23 22 21 20 19 18 17 16 15 14 13 Pad 1 R1 0.004 min Bond Pads 1 2 3 4 5 6 7 8 9 10 11 12 Environmental Data Test Method MIL-STD-202 Method 107 Test condition F MIL-STD-883 Method 1008 150C, 1000 hours -55C, 1000 hours MIL-STD-202 Method 108 70C, 1000 hours MIL-STD-202 Method 108 125C, 1000 hours Max R Typical R Ordering Data Prefix Style DSS4 = 8-pad Network DSS8 = 6-pad Network DQSC = 24-pad Network WBD DSS8 - B - 01 - 1002 - F - B Thermal Shock 0.1% 0.02% Schematic and Termination A = Isolated; B = Bussed TCR/Inspection Code Reference TCR/Inspection Code Table High Temperature Exposure Low Temperature Storage 0.1% 0.05% Resistance Code 4-Digit Resistance Code Ex: 1002 = 10K, 50R1 = 50.1 0.03% 0.01% Absolute Tolerance Code J = 5%; G = 2%; F = 1%; D = 0.5%; C = 0.25%; B = 0.1% G = 2%; F = 1%; D = 0.5%; C = 0.25%; B = 0.1%; A = 0.05% Ratio Tolerance Code (optional) Life Life at Elevated Temperature 0.5% 0.01% Packaging 0.5% 0.05% Standard packaging is 2 x 2 chip tray. For additional information or to discuss your specific requirements, please contact our Applications Team using the contact details below. (c) IRC Advanced Film Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com WBC Series Issue January 2009 Sheet 4 of 4 |
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