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 SEMICONDUCTOR
TECHNICAL DATA
General Description
KHB4D0N80P1/F1/F2
N CHANNEL MOS FIELD EFFECT TRANSISTOR
KHB4D0N80P1
A O C F E G B Q I K M L J D N N H P
DIM A B C D E F G H I J K L M N O
1 2 3
This planar stripe MOSFET has better characteristics, such as fast switching time, low on resistance, low gate charge and excellent avalanche characteristics. It is mainly suitable for electronic ballast and switch mode power supplies.
MILLIMETERS
FEATURES
VDSS=800V, ID=4A Drain-Source ON Resistance : RDS(ON)=3.6 Qg(typ.)=25nC @VGS = 10V
_ 9.9 + 0.2 15.95 MAX 1.3+0.1/-0.05 _ 0.8 + 0.1 _ 3.6 + 0.2 _ 2.8 + 0.1 3.7 0.5+0.1/-0.05 1.5 _ 13.08 + 0.3 1.46 _ 1.4 + 0.1 _ 1.27 + 0.1 _ 2.54 + 0.2 _ 4.5 + 0.2 _ 2.4 + 0.2 _ 9.2 + 0.2
1. GATE 2. DRAIN 3. SOURCE
P Q
MAXIMUM RATING (Tc=25
)
RATING
TO-220AB
KHB4D0N80F1
CHARACTERISTIC
SYMBOL
KHB4D0N80F1 UNIT KHB4D0N80P1 KHB4D0N80F2 800 30 4.0 16 460 13 4.0 130 43 0.34 150 -55 150 4.0* A 16* mJ mJ
Q K
L
A
C
F
B
Drain-Source Voltage Gate-Source Voltage Drain Current @TC=25 Pulsed (Note1) Single Pulsed Avalanche Energy (Note 2) Repetitive Avalanche Energy (Note 1) Peak Diode Recovery dv/dt (Note 3) Drain Power Dissipation Tc=25 Derate above25
VDSS VGSS ID IDP EAS EAR dv/dt PD 1.04 Tj Tstg
V V
O
E
DIM
MILLIMETERS
M
R
D N N
H
V/ns W W/
1
2
3
A B C D E F G H J K L M N O Q R
_ 10.16 + 0.2 _ 15.87 + 0.2 _ 2.54 + 0.2 _ 0.8 + 0.1 _ 3.18 + 0.1 _ 3.3 + 0.1 _ 12.57 + 0.2 _ 0.5 + 0.1 13.0 MAX _ 3.23 + 0.1 1.47 MAX 1.47 MAX _ 2.54 + 0.2 _ 6.68 + 0.2 _ 4.7 + 0.2 _ 2.76 + 0.2
G J
1. GATE 2. DRAIN 3. SOURCE
TO-220IS (1)
KHB4D0N80F2
A C
Maximum Junction Temperature Storage Temperature Range Thermal Characteristics
S
Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-toAmbient
RthJC RthJA
0.96 62.5
2.9 62.5
/W /W
F
P
E
DIM
MILLIMETERS
* : Drain current limited by maximum junction temperature.
K
L L R
PIN CONNECTION
D
M D
D
N N H
G
1
2
3
A B C D E F G H J K L M N P Q R S
_ 10.0 + 0.3 _ 15.0 + 0.3 _ 0.3 2.70 + 0.76+0.09/-0.05 _ 3.2 + 0.2 _ 3.0 + 0.3 _ 12.0 + 0.3 0.5+0.1/-0.05 _ 13.6 + 0.5 _ 3.7 + 0.2 1.2+0.25/-0.1 1.5+0.25/-0.1 _ 2.54 + 0.1 _ 6.8 + 0.1 _ 4.5 + 0.2 _ 2.6 + 0.2 0.5 Typ
G Q J
1. GATE 2. DRAIN 3. SOURCE
S
TO-220IS
2007. 9. 10
Revision No : 0
B
1/7
KHB4D0N80P1/F1/F2
ELECTRICAL CHARACTERISTICS (Tc=25
CHARACTERISTIC
)
TEST CONDITION MIN. TYP. MAX. UNIT
SYMBOL
Static
Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Gate Threshold Voltage Drain Cut-off Current Gate Leakage Current Drain-Source ON Resistance Forward Transconductance BVDSS BVDSS/ Tj Vth IDSS IGSS RDS(ON) gFS ID=250 A, VGS=0V ID=250 A, Referenced to 25 VDS=VGS, ID=250 A VDS=800V, VGS=0V, VGS= 30V, VDS=0V VGS=10V, ID=2.0A VDS=50V, ID=2.0A (Note4) 800 2.0 0.95 3.0 3.8 4.0 10 100 3.6 S V V/ V A nA
Dynamic
Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-on Delay time Turn-on Rise time Turn-off Delay time Turn-off Fall time Input Capacitance Output Capacitance Reverse Transfer Capacitance Source-Drain Diode Ratings Continuous Source Current Pulsed Source Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge IS VGSNote 1) Repetivity rating : Pulse width limited by junction temperature. Note 2) L =54mH, IS=4A, VDD=50V, RG=25 , Starting Tj=25 Note 3) IS 4.0A, dI/dt 200A/ , VDD 300 Note 4) Pulse Test : Pulse width , Duty Cycle 2%. . BVDSS, Starting Tj=25 .
Note 5) Essentially independent of operating temperature.
2007. 9. 10
Revision No : 0
2/7
KHB4D0N80P1/F1/F2
ID - VDS
10
VGS TOP : 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 0 10 Bottom:6.0 V 5.5V
ID - VGS
1
1
10
VDS = 50V 250s Pulse Test
Drain Current ID (A)
Drain Current ID (A)
10
0
150 C 25 C -55 C
10
-1
10
-2
10
-1
10
0
10
1
10
-1
2
4
6
8
10
Drain - Source Voltage VDS (V)
Gate - Source Voltage VGS (V)
BVDSS - Tj
Normalized Breakdown Voltage BVDSS
7
VGS = 0V IDS = 250A
RDS(ON) - ID
On - Resistance RDS(ON) ()
1.2
6 5
VGS = 10V
1.1
1.0
4 3 2
VGS = 20V
0.9
0.8 -100
0 -50 0 50 100 150
2
6
4
8
10
Junction Temperature Tj ( C)
Drain Current ID (A)
IS - VSD RDS(ON) - Tj
Reverse Drain Current IS (A)
10
1
VGS = 0V 250s Pulse Test
3.0
Normalized On Resistance
2.5 2.0 1.5 1.0 0.5
VGS = 10V ID = 2.0A
10
0
150 C
25 C
10
-1
0.2
0.4
0.6
0.8
1.0
1.2
0.0 -100
-50
0
50
100
150
Source - Drain Voltage VSD (V) Junction Temperture Tj ( C)
2007. 9. 10
Revision No : 0
3/7
KHB4D0N80P1/F1/F2
C - VDS
3000 Ciss 2500
Qg- VGS
Gate - Source Voltage VGS (V)
VGS = 0V Frequency = 1MHz
12 10 8 6 4 2 0 0
ID = 4.0A VDS = 160V VDS = 400V VDS = 640V
Capacitance (pF)
2000 1500
Coss
1000
Crss
500 0
10-1
100
101
5
10
15
20
25
30
Drain - Source Voltage VDS (V)
Gate - Charge Qg (nC)
Safe Operation Area
102 (KHB4D0N80P1)
Operation in this area is limited by RDS(ON)
Safe Operation Area
(KHB4D0N80F1)
Operation in this area is limited by RDS(ON)
Drain Current ID (A)
101
100s
Drain Current ID (A)
101
100s
1ms
100
1ms
10ms
100
10ms 100ms
10-1
Tc= 25 C Tj = 150 C Single nonrepetitive pulse 10-2
DC
10-1
Tc= 25 C Tj = 150 C Single nonrepetitive pulse
DC
100
101
102
103
10-2 0 10
101
102
103
Drain - Source Voltage VDS (V)
Drain - Source Voltage VDS (V)
ID - Tj
4
Drain Current ID (A)
3
2
1
0 25
50
75
100
125
150
Junction Temperature Tj ( C)
2007. 9. 10
Revision No : 0
4/7
KHB4D0N80P1/F1/F2
Rth
{KHB4D0N80P1} Transient Thermal Resistance [ C / W]
100
Duty=0.5
0.2
10-1
0.1
0.05
PDM t1 t2
0.02
0.0
1
10-2 10-5
S
le ing
Pu
lse
- Duty Factor, D= t1/t2 - RthJC = 10-3 10-2 10-1 Tj(max) - Tc PD 100 101
10-4
Square Wave Pulse Duration (sec)
Rth
{KHB4D0N80F1}
Transient Thermal Resistance [ C / W]
100
Duty=0.5
0.2
0.1
0.05
10-1
0.02
0.01
gle Sin Pu
PDM t1 t2
lse
10-2 10-5
- Duty Factor, D= t1/t2 Tj(max) - Tc - RthJC = PD 10-3 10-2 10-1 100 101
10-4
Square Wave Pulse Duration (sec)
2007. 9. 10
Revision No : 0
5/7
KHB4D0N80P1/F1/F2
- Gate Charge
VGS 10 V ID Fast Recovery Diode
0.8 VDSS 1.0 mA
ID
VDS Qgs VGS Qgd Qg
Q
- Single Pulsed Avalanche Energy
EAS= 1 LIAS2 2
BVDSS BVDSS - VDD
BVDSS
L
IAS
0.5 VDSS
25 VDS ID(t)
VDD
10 V VGS
VDS(t)
Time tp
2007. 9. 10
Revision No : 0
6/7
KHB4D0N80P1/F1/F2
- Resistive Load Switching
VDS RL 0.5 VDSS 25 VGS 10% tf 10V td(on) VGS ton tr td(off) toff 90%
VDS
- Source - Drain Diode Reverse Recovery and dv /dt
Body Diode Forword Current DUT VDS IF
ISD (DUT)
IRM
di/dt
0.8 x VDSS
driver
IS VDS (DUT)
Body Diode Reverse Current
Body Diode Recovery dv/dt VSD
10V
VGS Body Diode Forword Voltage drop
VDD
2007. 9. 10
Revision No : 0
7/7


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