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Ball / Land Grid Array Sockets Screw Lock Type
EP patents 0829188, 0897655 Patents pending in other countries.
E-tec
the Swiss connection
E-tec is now the leading BGA socket manufacturer. Sockets range from 5 x 5 upwards contacts with even larger parts currently in design. Some of the existing patterns are shown on the following pages, many more exist and your exact requirements can easily be added to our extensive product library. The SMD socket is simply placed and reflowed onto the PCB in the same way as the chip and occupies only a small amount of additional board space. The screw lock socket extends 6,00 mm beyond the outer ballrow with no fixing holes. We aim to solve your requirements - many different terminals and configurations are available. Your custom sets our standards!
Please note, we will always request the chip data to ensure we offer a compatible socket. SMT Style
PCB Pad Layout
O 0,70mm/.028" if pitch 1,27mm O 0,60mm/.023" if pitch 1,00mm O 0,50mm/.019" if pitch 0,80mm
dimensions if BGA Socket pitch 1,27mm with contact type 30
Soldertail Style
Soldertail:
O 0,45mm/.017" if pitch 1,27mm O 0,45mm/.017" if pitch 1,00mm O 0,40mm/.015" if pitch 0,80mm
Specifications
Mechanical data
Contact life Retention System life Solderability Individual contact force Max. torque for retention screws 100000 cycles min. 100 cycles min. exceeds MIL-STD-202 Method 208 40 grams max. 7 cN per meter, or 10oz per inch Glass Epoxy FR 4 Brass BeCu < 30 m 1 A max. >104 M 1 KV min. < 5 nH -55C to +130C ; 220C for 10 sec.
PCB Hole Layaut PCB Hole:
O 0,60mm/.024" if pitch 1,27mm O 0,60mm/.024" if pitch 1,00mm O 0,55mm/.021" if pitch 0,80mm
Material
Insulator Terminal Contact
Electrical data
Contact resistance Current rating Insulation resistance at 500V DC Breakdown voltage at 60 Hz Inductance
The pitch dimension depends on your Ball Grid Array
Operating temperature
How to order
X X W xxxx - xx xx - xx XX xx
Device Type
B = Ball Grid L = Land Grid C = Column Grid
Device Material C P
= = Ceramic Plastic
Pitch
07 08 10 12 15
= = = = = 0,75mm 0,80mm 1,00mm 1,27mm 1,50mm
Grid Code Config Code
please refer to the footprint pages 42 to 50 will be given by the factory after receipt of the chip datasheet
Plating
01 = tin/gold
Nbr of contacts
refer to the next pages
Contact Type
30 = standard SMD 29 = raised SMD 70 = solder tail
( A" = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm & 0,80mm pitch ) ( A" = 5,00mm; other dim. on request ) ( A" = 3,30mm if 1,27mm pitch; 2,80mm if 1,00mm & 0,80mm pitch )
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