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FPF2174 IntelliMAXTM Advanced Load Management Products
August 2008
FPF2174 IntelliMAXTM Advanced Load Management Products
Features
1.8 to 5.5V Input Voltage Range Controlled Turn-On 200mA Current Limit Option Undervoltage Lockout Thermal Shutdown <1 A Shutdown Current Fast Current limit Response Time 3 s to Moderate Over Currents 20ns to Hard Shorts Integrated very low VF Schottky Diode for Reverse Current Blocking Integrated Zener Diode for Output Clamp RoHS Compliant
tm
General Description
The FPF2174 is a load switch which combines the functionality of the IntelliMAXTM series load switch with a very low forward voltage drop Schottky barrier rectifier and a zener clamp at the output. The integrated solution provides full protection to systems and loads which may encounter large current conditions in a very compact MLP 3x3 package. This device contain a 0.125 current-limited P-channel MOSFET which can operate over an input voltage range of 1.8-5.5V. The Schottky diode acts as a barrier so that no reverse current can flow when the MOSFET is off and the output voltage is higher than the input voltage. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signals. Each part contains thermal shutdown protection which shuts off the switch to prevent damage to the part when a continuous over-current condition causes excessive heating. When the switch current reaches the current limit, the part operates in a constant-current mode to prohibit excessive currents from causing damage. If the constant current condition still persists after 10ms, these parts will shut off the switch and pull the fault signal pin (FLAGB) low. The switch will remain off until the ON pin is cycled. The minimum current limit is 200mA. These parts are available in a space-saving 6L MLP 3x3 package.
Applications
PDAs Cell Phones GPS Devices MP3 Players Digital Cameras Peripheral Ports Hot Swap Supplies
Typical Application Circuit
TO LOAD VIN VOUT
FPF2174
OFF ON ON GND FLAGB
Ordering Information
Part
FPF2174
Current Limit [mA]
200
Current Limit Blanking Time [ms]
10
Auto-Restart Time [ms]
NA
ON Pin Activity
Active HI
Top Mark
2174
(c)2008 Fairchild Semiconductor Corporation
FPF2174 Rev. D
1
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FPF2174 IntelliMAXTM Advanced Load Management Products
Functional Block Diagram
VIN VOUT
UVLO
ON
CONTROL LOGIC
CURRENT LIMIT THERMAL SHUTDOWN
FLAGB
GND
Pin Configuration
1 2 3
8
7
6
5
4
3x3 MLP BOTTOM VIEW
Pin Description
Pin
1 2 3, 7 4 5 6 8
Name
VIN NC VOUT GND FLAGB ON PAD1 No Connect
Function
Supply Input: Input to the power switch and the supply voltage for the IC Switch Output: Output of the power switch Ground Fault Output: Active LO, open drain output which indicates an over current supply, under voltage or over temperature state. ON Control Input IC substrate. Can be connected to GND. Do not connect to other pins.
FPF2174 Rev. D
2
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FPF2174 IntelliMAXTM Advanced Load Management Products
Absolute Maximum Ratings
Parameter
VIN, ON, FLAGB to GND VOUT to GND Power Dissipation @ TA = 25C (note 1) Operating Temperature Range Storage Temperature Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection HBM MM
Min
-0.3 -0.3 -40 -65 4000 400
Max
6 20 1.4 85 150 70 -
Unit
V V W C C C/W V V
Recommended Operating Range
Parameter
VIN Ambient Operating Temperature, TA
Min
1.8 -40
Max
5.5 85
Unit
V C
Electrical Characteristics
VIN = 1.8 to 5.5V, TA = -40 to +85C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25 C.
Parameter
Basic Operation Operating Voltage Quiescent Current Shutdown Current Latch-off Current Reverse Block Leakage Current Reverse Breakdown Voltage Dropout Voltage
Symbol
VIN IQ ISHDN ILATCHOFF IR
Conditions
Min
1.8
Typ
95 110 50 15 0.3 0.23 0.36 -
Max
5.5 200 1 10 0.4 0.5 1.0 1 1
Units
V A A A A V
IOUT = 0mA VON ACTIVE
VIN = 1.8 to 3.3V VIN = 3.3 to 5.5V
0.75 1.3 -
VON = 0V, IOUT = 0mA VON =VIN, after an overcurrent fault VOUT = 12V, VIN = VON = 0V, TA = 25C IOUT = 1mA TA = 25C, IOUT = 150mA
VDROP
TA = 85C, IOUT = 150mA TA = -40C, IOUT = 150mA VIN = 1.8V VIN = 5.5V VIN = 1.8V VIN = 5.5V VON = VIN or GND VON = 0V, VOUT = 0V @ VIN = 5.5V, TA = 85C VON = 0V, VOUT = 0V @ VIN = 3.3V, TA = 25C VIN = 5V, ISINK = 10mA VIN = 1.8V, ISINK = 10mA VIN = 5V, Switch on -
V
ON Input Logic High Voltage (ON) ON Input Logic Low Voltage ON Input Leakage
VIH VIL
V V A A nA V A
Off Switch Leakage
ISWOFF
10 -
100 0.2 0.3 1
FLAGB Output Logic Low Voltage FLAGB Output High Leakage Current
FPF2174 Rev. D
3
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FPF2174 IntelliMAXTM Advanced Load Management Products
Electrical Characteristics Cont.
VIN = 1.8 to 5.5V, TA = -40 to +85C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25 C.
Parameter
Protections Current Limit Thermal Shutdown Under Voltage Shutdown Under Voltage Shutdown Hysteresis Zener Clamp Voltage Zener Leakage Dynamic Turn on time Turn off time VOUT Rise Time VOUT Fall Time Over Current Blanking Time Short Circuit Response Time
Symbol
ILIM
Conditions
VIN = 3.3V, VOUT = 2.0V Shutdown Threshold Return from Shutdown Hysteresis
Min
200 1.5 5
Typ
300 140 130 10 1.6 47 15 25 20 14 126 10 3 20
Max
400 1.7 10 50 40 30 250 20 -
Units
mA C V mV V A s s s s ms s ns
UVLO VZ IZ tON tOFF tR tF tBLANK
VIN Increasing IZ = 1mA VZ = 12V RL = 500 , CL = 0.1 F RL = 500 , CL = 0.1 F RL = 500 , CL = 0.1 F RL = 500 , CL = 0.1 F VIN = VON = 3.3V. Moderate Over-Current Condition. VIN = VON = 3.3V. Hard Short.
-
Note 1: Package power dissipation on 1 square inch pad, 2 oz. copper board.
FPF2174 Rev. D
4
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FPF2174 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
120
SUPPLY CURRENT (uA)
SUPPLY CURRENT (uA)
120
VON = VIN
VIN = 5.5V
110 100 90 80 70 60 1.5
110 100 90 80 70 60 -40
VIN = 3.3V
VIN = 1.8V
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
-15
10
35
60
oC
85
SUPPLY VOLTAGE (V)
TJ, JUNCTION TEMPERATURE
Figure 1. Quiescent Current vs. Input Voltage
Figure 2. Quiescent Current vs. Temperature
2.0 1.8
SUPPLY CURRENT (uA)
0.6
SUPPLY CURRENT (uA)
1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -15 10 35
VIN = 5.5V VIN = 3.3V
0.5 0.4 0.3 0.2 0.1 0.0 -40
VIN = 5.5V VIN = 3.3V
60
85
TJ, JUNCTION TEMPERATURE oC
-15 10 35 60 TJ, JUNCTION TEMPERATURE oC
85
Figure 3. ISHUTDOWN Current vs. Temperature
Figure 4. ISWITCH-OFF Current vs. Temperature
60
SUPPLY CURRENT (uA)
VIN = 3.3V
1.8 1.6
ON THRESHOLD (V)
50
1.4 1.2 1.0 0.8 0.6
40
30
20 -40
-15
10
35
oC
60
85
0.4 1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
TJ, JUNCTION TEMPERATURE
VIN,INUT VOLTAGE (V)
Figure 5. Latchoff current vs. Temperature
Figure 6. Input Voltage vs. On Threshold Voltage
FPF2174 Rev. D
5
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FPF2174 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
400
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
400
375 350 325 300 275 250 225 200 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
350
300
250
200 -40
-15
10
35
60
o
85
V IN ,INUT VO LTAGE (V)
TJ, JUNCTION TEMPERATURE
C
Figure 7. Current Limit vs. Output Voltage
Figure 8. Current Limit vs. Temperature
345
DROPOUT VOLTAGE (mV)
330 315 300 285 270
DROPOUT VOLTAGE (mV)
IOUT = 150mA
500 450 400 350 300 250 200 150 100 -40
VIN = 3.3V IOUT = 150mA
1
2
3
4
5
6
-15
10
35
60
o
85
VIN, INPUT VOLTAGE (V)
TJ,JUNCTION TEMPERATURE
C
Figure 9. Drop Voltage vs. Input Voltage
Figure 10. Drop Voltage vs. Temperature
16.0
0.12 0.10 0.08 0.06 0.04 0.02 0.00 15 16 17 18 19 20 21
ZENER VOLTAGE (V)
15.8 15.7 15.6 15.5 15.4
0
5
10
15
20
ZENER CURRENT (mA)
ZENER CURRENT (A)
15.9
ZENER VOLTAGE (V)
Figure 11. Zener Voltage vs. Zener Current
Figure 12. Zener Diode Safe Operating Area
FPF2174 Rev. D
6
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FPF2174 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
40 35 30 25 20 15 10 -40 -15 10 35 60
o
1000
T ON
DELAY TIMES (uS)
DELAY TIMES (uS)
TFALL 100 TRISE 10
TOFF
85
1 -40
-15
10
35
60
o
85
TJ, JUNCTION TEMPERATURE
C
TJ, JUNCTION TEMPERATURE
C
Figure 13. TON/TOff vs. Temperature
Figure 14. TRise/TFall vs. Temperature
14
FLAG-BLANKING TIME (mS)
13 12 11 10 9 8 -40
V IN = 3.3V
V DRV 2V/DIV VIN = VON = 3.3V CIN = 10 F CL = 0.1 F
FLAGB 2V/DIV IOUT 200mA/DIV VOUT 2V/DIV
-15 10 35 60
o
85
T J , JUNCTION TEM PERATURE
C
5ms/DIV Figure 16. TBLANK Response
Figure 15. TBLANK vs. Temperature
VON 2V/DIV
VIN = 3.3V CIN = 10 F CL = 0.1 F RL = 500
VON 2V/DIV
VIN = 3.3V CIN = 10 F CL = 0.1 F RL = 500
IOUT 10mA/DIV
IOUT 10mA/DIV
100us/DIV Figure 17. TON Response
200ns/DIV Figure 18. TOFF Response
FPF2174 Rev. D
7
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FPF2174 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
VOUT 2V/DIV IOUT 5A/DIV VIN 2V/DIV
CIN = 10 F CL = 0.1 F
VIN 2V/DIV
CIN = 10 F CL = 0.1 F
IOUT 200mA/DIV 20 s/DIV 50 s/DIV
Figure 19. Short Circuit Response Time (Output Shorted to GND)
Figure 20. Current Limit Response Time (Switch power up to hard short)
VIN 2V/DIV
CIN = 10 F CL = 0.1 F RL = 4.7
VON 2V/DIV
IOUT 200mA/DIV 50 S/DIV
Figure 21. Current Limit Response Time (Output has a 4.7 load)
FPF2174 Rev. D
8
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FPF2174 IntelliMAXTM Advanced Load Management Products
Description of Operation
The FPF2174 is a current limited switch that protects systems and loads which can be damaged or disrupted by the application of high currents. The core of the device is a 0.125 P-channel MOSFET and a controller capable of functioning over a wide input operating range of 1.8-5.5V paired with a low forward voltage drop Schottky diode for reverse blocking and a 16V zener diode for output clamp. The controller protects against system malfunctions through current limiting, undervoltage lockout and thermal shutdown. The current limit is preset for 200mA.
Thermal Shutdown
The thermal shutdown protects the die from internally or externally generated excessive temperatures. During an overtemperature condition the FLAGB is activated and the switch is turned-off. The switch automatically turns-on again if temperature of the die drops below the threshold temperature.
On/Off Control
The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state so long as there is no under-voltage on VIN or a junction temperature in excess of 150C. ON is active HI and has a low threshold making it capable of interfacing with low voltage signals. When the MOSFET is off, the Schottky diode acts as a barrier so that no reverse current can flow when VOUT is greater than VIN.
Fault Reporting
Upon the detection of an over-current, an input under-voltage, or an over-temperature condition, the FLAGB signals the fault mode by activating LO. The FLAGB goes LO at the end of the blanking time and is latched LO and ON must be toggled to release it. FLAGB is an open-drain MOSFET which requires a pull-up resistor between VIN and FLAGB. During shutdown, the pull-down on FLAGB is disabled to reduce current draw from the supply.
Current Limiting
The current limit guarantees that the current through the switch doesn't exceed a maximum value while not limiting at less than a minimum value. The minimum current is 200mA and the maximum current is 400mA. The device has a blanking time of 10ms, nominally, during which the switch will act as a constant current source. At the end of the blanking time, the switch will be turned-off and the FLAGB pin will activate to indicate that current limiting has occurred.
Under-Voltage Lockout
The under-voltage lockout turns-off the switch if the input voltage drops below the under-voltage lockout threshold. With the ON pin active the input voltage rising above the undervoltage lockout threshold will cause a controlled turn-on of the switch which limits current over-shoots.
FPF2174 Rev. D
9
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FPF2174 IntelliMAXTM Advanced Load Management Products
Application Information
Typical Application
To Load VIN VOUT R1 = 100K
FPF2174
Battery 5.5V OFF ON C1 = 4.7 F 5.5V MAX ON GND FLAGB
C2 = 0.1 F
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a discharged load capacitor or a short-circuit, a capacitor needs to be placed between VIN and GND. A 4.7 F ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop.
Output Capacitor
A 0.1uF capacitor COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductances from forcing VOUT below GND when the switch turns-off.
Power Dissipation
During normal operation as a switch, the power dissipation is small and has little effect on the operating temperature of the part. The parts with the higher current limits will dissipate the most power and that will only be typically,
P = I LIM x V DROP = 0.4 x 0.4 = 160mW
(2)
When using the part, attention must be given to the manual resetting of the part. Continuously resetting the part at a high duty cycle when a short on the output is present can cause the temperature of the part to increase. The junction temperature will only be allowed to increase to the thermal shutdown threshold. Once this temperature has been reached, toggling ON will not turn-on the switch until the junction temperature drops.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT and GND will help minimize parasitic electrical effects along with minimizing the case to ambient thermal impedance.
FPF2174 Rev. D
10
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FPF2174 IntelliMAXTM Advanced Load Management Products
Dimensional Outline and Pad Layout
Package MLP06H
FPF2174 Rev. D
11
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