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 High Power LED Driver
Features
n n n n n n n n n n n n
PAM2842
Description
The PAM2842 is a high power LED driver, capable of driving up to 10 high power LEDs in series. The PAM2842 supports buck, boost and sepic topology. The PAM2842 features over current protection , over voltage protection , under voltage lockout and over temperature protection, which prevent the device from damage. LED dimming can be done by using a PWM signal to the COMP pin. The PAM2842 is available in 40-Pin QFN6x6 and TSSOP-20 packages.
Output Power up to 30W Chip Enable with Soft-start Analog and PWM Dimming Peak Efficiency up to 97% Low Quiescent Current Switching Frequency Adjustable Support Buck/Boost/Sepic Topology Over Current Protection Over Voltage Protection Thermal Protection UVLO Tiny Pb-Free Packages : 40-Pin QFN6x6 and TSSOP-20
Applications
n Home Lighting n Automotive Lighting n Monitor Backlighting
Typical Application Circuit
Boost with Low Side Current Sense
Vin
1F
L1
Boost with High Side Current Sense
Vin
L1 33 H 1F 0.14
33 H
PGND PGND HVIN EN
SW SW OV VDD-5V
1F 1k 10nF 10 F 0.14 1F 130k 430k
PGND PGND HVIN
15k
SW SW OV
VDD-5V
1F 430k
PAM2842
COMP Sense+ Sense-
EN
15k 10nF
PAM2842
COMP
Sense+ Sense-
1k
VDD-DR
10 F 1F 130k
VDD-DR
RT AGND
RT AGND
Power Analog Microelectronics , Inc
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High Power LED Driver
Typical Application Circuit
Buck/Boost (Sepic) with Low Side Current Sense
Vin
L1
PAM2842
Buck/Boost (Sepic) with High Side Current Sense
Vin
1F
L1
10 F
56k
0.14
47 H 1F 47 H
L2
47 H 47 H
L2
PGND PGND HVIN EN
10 F 1F 130k
SW SW OV VDD-5V
1F 220k
PGND PGND HVIN
12k
SW SW OV
VDD-5V
1F 220k
12k 10nF
PAM2842
COMP Sense+ Sense-
EN
1k 10nF 10 F
PAM2842
COMP
Sense+ Sense-
1k
VDD-DR
VDD-DR
1F 0.14 130k
RT AGND
RT AGND
Buck with High Side Current Sense
Vin
0.14
1F
10 F
PGND PGND HVIN EN
SW
L
SW OV
47 H 1nF NC
VDD-5V
PAM2842
COMP
Sense+ Sense-
VDD-DR
10 F 1F 130k
1k
100nF
12k
RT AGND
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High Power LED Driver
Block Diagram
VDD_5V COMP OV SW SW
PAM2842
HVIN
LDO1
Comparator
PWM +
PWM Logic And Driver
LDO2
VDD-DR
100mV Reference
+
CS
+ GM -
Ramp Generator
Sense+ SenseEN
FB
Shutdown And Soft-start
Adjustable Oscillator
AGND
RT
PGND PGND
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High Power LED Driver
Pin Configuration & Marking Information
Top View 6mm*6mm QFN
NC NC NC NC NC NC NC NC NC NC
PAM2842
TOP View TSSOP-20
40
PGND
PGND PGND PGND PGND PGND NC HVIN EN
39
38
37
36
35
34
33
32
31 30 29 28
SW SW SW SW SW SW NC
PGND PGND
PGND PGND HVIN EN
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
NC SW SW SW OV VDD_5V COMP Sense+ Sense-
1 2 3 4 5 6 7 8 9 10
PAM2842 XXXYWWLL
PAM2842 XXXYWWLL
27 26 25 24 23 22 21
VDD-DR
RT
AGND OV NC VDD_5V PGND
PGND
VDD-DR
11
12
13
AGND
14
Sense-
15
Sense+
16
NC
17
COMP
18
NC
19
NC
20
NC
X: Internal Code Y: Year WW: Week LL: Internal Code
NC
RT
Pin Number QFN 6x6-40 1-6 8 9 10 12 13 14 15 17 21 23 25-30 7,11,16,18-20,22,24,31-40 TSSOP-20 1,2,3,4,10,11 5 6 7 8 9 12 13 14 15 16 17,18,19 20
Name PGND HVIN EN VDD-DR RT AGND SenseSense+ COMP VDD_5V OV SW NC
Description Power Ground Input Chip Enable, Active High Internal LDO Output Frequency Adjustment Pin Analog Ground Sense resistor Sense resistor +
Compensation Node
Internal LDO Output Over Voltage Drain of Main Switch. No Connect
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High Power LED Driver
Absolute Maximum Ratings
PAM2842
These are stress ratings only and functional operation is not implied . Exposure to absolute maximum ratings for prolonged time periods may affect device reliability . All voltages are with respect to ground . Supply Voltage.............................................40V Output Current................................................1A I/O Pin Voltage Range.........GND-0.3V to V DD+0.3V Storage Temperature................ .....-40 OC to 125 OC Maximum Junction Temperature..................150 OC Soldering Temperature.......................300 OC, 5sec
Recommended Operating Conditions
Supply Voltage Range.........................5.5V to 40V O O Operation Temperature Range..........-40 C to 85 C Junction Temperature Range......... .-40 C to 150 C
O O
Thermal Information
Parameter Thermal Resistance (Junction to Case) Thermal Resistance (Junction to Ambient) Symbol JC JA Package TSSOP QFN 6mm*6mm TSSOP QFN 6mm*6mm Maximum 20 7.6* 90 18.1* C/W Unit
*The Exposed PAD must be soldered to a thermal land on the PCB.
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High Power LED Driver
Electrical Characteristic
PARAMETER Input Voltage Range ENA=high (no switching) ENA =high (1M switching frequency) Quiescent Current ENA =high (500k switching frequency) ENA =high (200k switching frequency) ENA =low Feedback Voltage, Low Side Feedback Voltage, High Side LED Current Line Regulation LED Current Load Regulation LDO Stage VDD_5V VDD_5V current_limit VDD_5V UVLO Threshold VDD_5V UVLO Hysteresis VDD_DR VDD_DR current_limit VDD_DR UVLO Threshold VDD_DR UVLO Hysteresis Switch Rdson Switch Current Limit Switch Leakage Current RT Voltage Switching Frequency* R RT =71k R RT =30k R RT =71k R RT =180k F SW =1MHz Min Duty Cycle F SW =500kHz F SW =200kHz Max Duty Cycle Vc Source Current Vc Sink Current Low Side Sense High Side Sense Feedback voltage=0 Feedback voltage=0 1.1 800k 400 160 No switching No switching No switching No switching No switching No switching No switching No switching Switch Stage VDD_5V=5V 0.1 3.5 50 1.2 1M 500 200 10 5 2.5 95 100 30 30 1.3 1.2M 600 240 A A V Hz kHz kHz % % % % % A A 4.5 14 3.7 4.5 14 3.7 5 74 4.0 200 5 50 4.0 200 5.5 90 4.3 5.5 90 4.3 V mA V mV V mA V mV V FB =VSENSE+ -AGND, VSE NSE-=AGND V FB =VSENSE+ - V SENS EIO=350mA 95 95
PAM2842
V EN=V DD=24V, 1Wx10 LEDs, T A=25C, unless otherwise noted .
Conditions Min 5.5 1 6 3 1.6 5 100 100 0.02 1.0 10 105 105 Typ Max 40 2 Units V mA mA mA mA A mV mV %/V %
* Switching Frequency FSW =
10 , reference value 24 (RRT + 12k )
12
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High Power LED Driver
Electrical Characteristic
PARAMETER OV threshold Voltage OV Hysteresis Thermal-Shutdown Thermal-Shutdown Hysteresis Control Interface EN High EN Low 1.5 0.4 V V
PAM2842
V EN=V DD=24V, 1Wx10 LEDs, T A=25 C , unless otherwise noted .
Conditions Fault Protection 1.1 1.2 70 150 30 1.3 V mV C C Min Typ Max Units
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High Power LED Driver
Typical Performance Characteristic
1. Efficiency vs Input Voltage (Po=30W, 10X3W LEDs)
98%
PAM2842
Boost mode, V EN=V DD=24V, 3W LED, Fsw=200kHz, T A=25 C, unless otherwise noted . 2. Shutdown Current vs Input Voltage
6 5
Shutdown Current (uA)
97%
4 3 2 1 0
Efficiency
96%
95%
94%
93% 10 15 20 Input Voltage (V) 25 30
0
5
10
15
20
25
30
35
Input Voltage (V)
3. Quiescent Current vs Input Voltage
1.8 1.6
800 700
4. Output Current vs Input Voltage (10X3W LEDs)
Quiescent Current (mA)
1.4 1.2 1 0.8 Switching 0.6 0 5 10 15 20 25 30 35 Input Voltage (V) No Switching
Output Current (mA)
600 500 400 300 200 100 0 10 15 20 Input Voltage (V) 25 30
Low side Current sense High side Current sense
5. Output Current vs Temperature (V IN=12V, Load=10X3W LEDs)
800 750
Output Current (mA)
700 650 600 550 500 450 400 0 20 40 60 80 100 Ambient Temperature ()
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High Power LED Driver
Typical Performance Characteristic
Fsw=300kHz, T A=25C, unless otherwise noted . 5. Output Current vs Input Voltage (Sepic mode, 1W LED),
400 350
Output Current (mA)
PAM2842
6. Efficiency vs Input Voltage (Sepic mode, 1W LED),
90% 89% 88% 87%
300
Efficiency
5*1W 3*1W 1*1W 4*1W 2*1W
250 200 150 100 50 0 5 10 15 20 Input Voltage (V)
86% 85% 84% 83% 82% 81% 5 7 9 11 13 15 17 19 Input Voltage (V)
5*1W 3*1W 1*1W 4*1W 2*1W
7. Output Current vs Input Voltage (Buck mode, 3W LED),
0.8 0.7
8. Efficiency vs Input Voltage (Buck mode, 3W LED),
100% 95% 90%
Output Current (A)
0.6
Efficiency
0.5 0.4 0.3 0.2 0.1 0 5 10 15 20 25 30 35 40 Input Voltage (V)
85% 80% 75%
1*3W 2*3W 3*3W
70% 5 10 15 20 25 30 35 40 Input Voltage (V)
400 350
9. LED Current vs Duty Cycle (PWM=100Hz, in Dimming State)
10. Start up and Shutdown
LED Current (mA)
300 250 200 150 100 50 0 0 20 40 60 80 100 Duty Cycle (%)
Vout EN Vcomp
Power Analog Microelectronics , Inc
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High Power LED Driver
Application Information
Topology Selection When maximum power supply voltage is below than minimum load voltage, select the boost topology. When minimum power supply voltage is high than maximum load voltage, select buck topology. When load voltage range is small and between the power supply voltage, select sepic topology. Table-1: Voltage condition Vs Topology For the large power application, if chose DCM, the peak current will be very large, it will have great electrical stress on the components, so we chose CCM. When work in CCM mode, a reasonable ripple current is chosen to I L=0.4I L For the boost topology,
PAM2842
Condition Vin max < Vo min
Topology Boost Buck Sepic
IL =
D=
IO 1- D
Vinmin > Vomax
Vo I Vin
Inductor Selection
VO - VIN VO
DIL =
VIN (VO - VIN ) LFVO
The inductance, peak current rating, series resistance, and physical size should all be considered when selecting an inductor. These factors affect the converter's operating mode, efficiency, maximum output load capability, transient response time, output voltage ripple, and cost. The maximum output current, input voltage, output voltage, and switching frequency determine the inductor value. Large inductance can minimizes the current ripple, and therefore reduces the peak current, which decreases core losses in the inductor and I2R losses in the entire power path. However, large inductor values also require more energy storage and more turns of wire, which increases physical size and I2R copper losses in the inductor. Low inductor values decrease the physical size, but increase the current ripple and peak current. Finding the best inductor involves the compromises among circuit efficiency, inductor size, and cost. When choosing an inductor, the first step is to determine the operating mode: continuous conduction mode (CCM) or discontinuous conduction mode (DCM). When CCM mode is chosen, the ripple current and the peak current of the inductor can be minimized. If a small-size inductor is required, DCM mode can be chosen. In DCM mode, the inductor value and size can be minimized but the inductor ripple current and peak current are higher than those in CCM.
D: duty cycle, Io: output current, F: switching frequency. From above equation we can get the inductance:
L=
2 2.5VIN (VO - VIN ) 2 FIO VO
The inductor's current rating should be higher than
IL +
DIL 2
VO VIN
For the buck topology, I L=I O
D=
DIL =
(VIN - VO )VO LFVIN
so
L=
2.5VO (VIN - VO ) FIO VIN
For the sepic topology, L1=L2 D IL1 = IO 1- D I L2=I O
D= VO VIN + VO
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High Power LED Driver
DIL = VIN VO LF(VIN + VO )
PAM2842
The ripple voltage is
Chose so
I L=0.4I L1
L=
2 2.5VIN FIO (VIN + VO )
IOD FCS The voltage rating must be higher than input voltage. DVCs =
Because the Cs capacitor will flow the large RMS current, so this topology is suitable for small power application. Diode Selection PAM2842 is a high switching frequency converter w h i c h d e m a n d s h i g h s p e e d r e c t i f i e r. I t ' s indispensable to use a Schottky diode rated at 3A, 40V with the PAM2842. Using a Schottky diode with a lower forward voltage drop is better to improve the power LED efficiency. In boost topology, the voltage rating should be higher than Vout and in buck topology, the voltage rating higher than Vin, the peak current is
Capacitor Selection An input capacitor is required to reduce the input ripple and noise for proper operation of the PAM2842. For good input decoupling, Low ESR (equivalent series resistance) capacitors should be used at the input. At least 10 F input capacitor is recommended for most applications. And close the IC Vin-Pin we should add a bypass capacitor, usually use a 1 F capacitor. A minimum output capacitor value of 10 F is recommended under normal operating conditions, while a 22 F or higher capacitor may be required for higher power LED current. A reasonable value of the output capacitor depends on the LED current. The total output voltage ripple has two components: the capacitive ripple caused by the charging and discharging on the output capacitor, and the ohmic ripple due to the capacitor's equivalent series resistance. The ESR of the output capacitor is the important parameter to determine the output voltage ripple of the converter, so low ESR capacitors should be used at the output to reduce the output voltage ripple. The voltage rating and temperature characteristics of the Output capacitor must also be considered. So a value of 10 F, 50V voltage rating capacitor is chosen. Consider from discharge aspect: Ix t=Cx V In boost and sepic topology, CO = In buck topology, CO =
IDMAX = IL +
DIL 2
in sepic topology, the voltage rating should be higher than Vin+Vout, the peak current is I DMAX=I L1peak+I L2peak The average current of the diode equals to Io. Work frequency selection PAM2842 working frequency is decided by resistor connect to the RT pin, it can be calculated by follow equation: 1012 FSW = (Hz) 24 (RT + 12K) From the equations, we can see when working frequency is high, the inductance can be small. It's important in some size limit application. But we should know when the working frequency is higher, the switching loss is higher too. We must pay attention to thermal dissipation in this application. Methods for Setting LED Current There are two methods for setting and adjusting the LED current: 1) Rsense only 2) PWM signal with external components a) Use the COMP pin b) Use the Sense pin
IOD FVRIPPLE
IO (1 - D) FVRIPPLE
V RIPPLE: Output voltage allowable ripple. Consider from equivalent series resistance: V ripple-esr=I co.ripplexC oesr In sepic topology, there is a series capacitor Cs between L1 and L2 (see application schematic), it flows the current: VO ICs(RMS) = IO VIN
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High Power LED Driver
l Method 1: LED Current Setting with Resistor
PAM2842
Rsense
It maybe generate the audible noise in this dimming condition.
l Method 3: LED Current Setting with PWM
The most basic means of setting the LED current is connecting a resistor between Rsense+ and Rsense-. The LED current is decided by ISET Resistor Rsense. I LED =0.1/ R sense For flowing the large current, must pay attention to power dissipation on the resistor. Rsense has two position to select: high side current sense and low side current sense. In buck topology it just has high side current sense. In other topology we recommend use low side current sense for easier PCB layout.
l Method 2: LED Current Setting with PWM Signal Using COMP Pin
Signal using Sense Pin
This method is turn PWM signal to DC voltage, the output current can be adjusted. Because the LED current is a adjustable DC value, it will cause LED color drift. Low side current sense and high side current sense circuit is different. Please see Figure 2 and 3. It use the internal reference voltage, so PWM dimming signal voltage is not considered, just meet the request of the MOSFET driving voltage.
VDD_5V
R1
D1 R2 R3
Sense+
R4
RTN
This circuit uses resistor Rsense to set the on state current and the average LED current, then proportional to the percentage of off-time when the COMP pin is logic high. Here use a invert component 2N7002 (Q1) to isolate and invert the PWM signal (See Figure 1).
Q1 PWM-DIM
C1
C2
RSense
Figure 2. PWM Dimming Use Sense Pin in Low Side Current Sense
PAM2842 COMP
Sense+ RSense Vo
Q1 2N7002 PW M signal Ton Toff
Q1
VDD_5V R3 R1 D1 SenseQ2
Figure 1. PWM Dimming Use COMP Pin Average LED current is approximately equal to: TI IAVG = OFF LED TON + TOFF Also, the recommended PWM frequency is between 100Hz and 200Hz. Frequency <100Hz can cause the LEDs to blink visibly. As the COMP pin connects to a capacitor, it needs rise time. If frequency >200Hz, the average LED current will have a large error when duty cycle is small (<50%).
PWM-DIM
R5
C1
R4
Figure 3. PWM Dimming Use Sense Pin in High Side Current Sense The RC filter (R1,R2,C1,C2) value is decided by dimming frequency, the divider resistor (R3,R4) is decided by dimming range. Because final adjusted is a DC value, this method can avoid audible noise effectively and achieve better EMI performance than the second method.
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High Power LED Driver
Setting the Output Limit Voltage The OV pin is connected to the center tap of a resistive voltage divider from the high-voltage output to ground (see application schematic). R VOUT -Limit = VOV (1 + UP ) RDOWN The recommend procedure is to choose R3 =360K and R4 =12K to set Vout_limit =37.2V. In boost and sepic circuit, when LED open or no load, the circuit will have no feedback, if no other measure be taken the switch voltage will be very high and damage the switch, so this OV pin must be set carefully. In buck circuit, the switch voltage is always small than input voltage, so the OV pin setting is not important in this condition. This OV pin is used to limit output voltage to avoid breakdown of the switch other than to regulate output voltage. The setting value must keep the switch voltage below 40V. In sepic circuit, one must notice that the switch voltage equals Vin+Vo. This OV pin has a hysteresis voltage detect function, not latch-up function, so output voltage will have a overshoot when no load or load working voltage is high than setting limit voltage. If the component parameter not match appropriately, the overshoot voltage will be too high and can demage the switch. Several methods can decrease the overshoot voltage: (1) Add a small capacitor (<100pF) parallel with the up divider resistor (See Figure 4). (2) Use external zener to clamp the output peak voltage (See Figure 5).
Vout
PAM2842
Vout COMP
ZENER
Q
R
Figure 5: Use External Zener Note: The output limit voltage must be set higher than working output voltage by a proper value, or it will work abnormal in low temperature or some other conditions. Short LED Function PAM2842 is a constant current driver. When one or more LED shorted, the circuit will still work, the output voltage is decided by LED numbers. In boost topology, make sure the output voltage is higher than input voltage; otherwise the unlimited current will directly go through supply to LED and damage the LED. Power Dissipation As PAM2842 integrates a power MOSFET, the power dissipation must be considered. To a MOSFET the power loss includes 5 sections, turn on loss, turn off loss, conduction loss, drive loss and output capacitor Coss loss. 1 Pturn-on = Iturn-on VOUT Tr f 2
1 Pturn-off = Iturn-off VOUT Tr f 2
2 PRDson = IRMSRDSon
PDrive = QgUDrive f
R3 Cf
OV
PCoss =
1 2 COSS VOUT f 2
R4
PSwitch = Pturn-on + Pturn-off + PRDSon + Pdrive + PCoss
DT = q jaPswitch
Tr: switch rise time. Tf: switch fall time. U Drive: gate drive voltage. ja is relative with IC package, heat-sink area and air flow condition etc.
Figure 4: add forward capacitor
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High Power LED Driver
Above description does not consider the IC control power, so the total power will be more than calculated value. PAM2842 has over-temperature protection. When junction temperature is over 150C, it will shut down and auto restart when junction temperature decrease below 120 C . In high temperature circumstance application, one must pay attention to heat dissipation, or it will shut down and restart. It is recommended to use external heat-sink and placed near to the IC surface. PCB Layout Guidelines Careful PCB layout is important for normal operation. Use the following guidelines for good PCB layout: (BOOST) 1) Minimize the area of the high current switching loop of the rectifier diode and output capacitor to avoid excessive switching noise. 2) Connect high-current input and output components with short and wide connections. The high-current input loop goes from the positive terminal of the input capacitor to the inductor and the SW pin. The high-current output loop is from the positive terminal of the input capacitor through the inductor, rectifier diode, and positive terminal of the output capacitors, reconnecting between the output capacitor and input capacitor ground terminals. Avoid using vias in the highcurrent paths. If vias are unavoidable, use multiple vias in parallel to reduce resistance and inductance. 3) Create a ground island (PGND) consisting of TSSOP-20 BOOST the input and output capacitor ground and PGND pin. Connect all these together with short, wide traces or a small ground plane. Maximizing the width of the power ground traces improves efficiency and reduces output-voltage ripple and noise spikes. Create an analog ground island (AGND) consisting of the output voltage detection-divider ground connection, the Sensepin connection, VCC-5V and VCC-driver capacitor connections. Connect the device's exposed backside pad to PGND. Make sure no other connections between these separate ground planes. 4) Place the output voltage setting-divider resistors as close to the OV pin as possible. The divider's center trace should be kept short. Avoid running the sensing traces near SW Pin. 5) Place the VIN pin bypass capacitor as close to the device as possible. The ground connection of the VIN bypass capacitor should be connected directly to GND pins with a wide trace. 6) Minimize the size of the SW node while keeping it wide and short. Keep the SW node away from the feedback node. If possible, avoid running the SW node from one side of the PCB to the other. 7) For the good thermal dissipation, PAM2842 has a heat dissipate pad in the bottom side, it should be soldered to PCB surface. As the copper area cannot be large in the component side, we can use multiple vias connecting to other side of the PCB. 8) R e f e r t o t h e e x a m p l e o f a PA M 2 8 4 2 Evaluation board layout below.
PAM2842
QFN6x6-40 BOOST
PCB Layout Example
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High Power LED Driver
Ordering Information
PAM2842
PAM2842 X X X
Shipping Number of Pin Package Type
Part Number PAM2842RGR PAM2842TJR Package TSSOP-20 QFN6X6-40 Shipping 1,000 units/Tape & Reel 1,000 units/Tape & Reel
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High Power LED Driver
Outline Dimensions
TSSOP-20
PAM2842
SYMBOL A A1 A2 D E1 E L R R1
MIN. 0.025 0.80 6.4 4.3 6.2 0.45 0.09 0.09
NOM. 0.90 6.5 4.4 6.4 0.60 -
MAX. 1.20 0.100 1.05 6.6 4.5 6.6 0.75 -
SYMBOL b b1 c c1 L1 e N
MIN. 0.19 0.19 0.09 0.09 0
NOM. 0.22 1.0 REF 0.65 BSC 20
MAX. 0.30 0.25 0.20 0.16 8
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High Power LED Driver
Outline Dimensions
QFN 6X6 -40
PAM2842
QFN
Unit: millimeter
Power Analog Microelectronics , Inc
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