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| EMI Filter and ESD Protection for Secure Digital Card Interfaces PROTECTION PRODUCTS - EMIClampTM Description The EClamp 2357N is a low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. They have been optimized for protection of touch screen displays, secure digital (SD) card interfaces, and color LCD panels in cellular phones and other portable electronics. TM ECLAMP2357N PRELIMINARY Features EMI/RFI filter with integrated ESD protection ESD protection to IEC 61000-4-2 (ESD) Level4, 15kV (air), 8kV (contact) Filter performance: >30dB attenuation at 1.8GHz TVS working voltage: 5V Resistor: 100 +/- 15% Component Capacitance: 10pF (VR = 0V) EMI & ESD protection for six lines Dedicated ESD protection for four lines Solid-state technology The device consists of six pi filter circuits comprised of TVS diodes for ESD protection, and a resistor capacitor network for EMI/RFI filtering. A series resistor value of 100 and a component capacitance value of 10pF are used to achieve 20dB minimum attenuation from 1.0GHz to 3GHz. The device also includes 4 discrete TVS diodes for dedicated ESD protection. All of the TVS diodes provide effective suppression of ESD voltages in excess of 15kV (air discharge) and 8kV (contact discharge) per IEC 61000-4-2, level 4. Mechanical Characteristics 16 pin QFN RoHS/WEEE Compliant Nominal Dimensions: 3.0 x 3.0 x 1.0 mm Lead Pitch: 0.5mm Lead Finish: Matte Tin Marking: Marking Code Packaging: Tape and Reel per EIA 481 Applications Touch Screen Display Interfaces Secure Digital (SD) Memory Card Interfaces Multimedia Card Interfaces (MCI) Color LCD Panel Protection Cell Phone Handsets and Accessories PIN Configuration 100 Package Configuration OUT IN 10pF 10pF 16 1 GND R = 100, C=10pF (max) 6X IN/OUT IN/OUT GND 5V TVS 2X Revision 05/16/2005 1 16 Pin QFN (Top Side View) Maximum Dimensions (in mm) www.semtech.com ECLAMP2357N PROTECTION PRODUCTS Maximum Ratings R ating ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Junction Temp erature Op erating Temp erature Storage Temp erature Symbol VESD TJ Top TSTG Value +/- 20 +/- 12 125 -40 to +85 -55 to +150 PRELIMINARY Units kV o C C C o o Electrical Characteristics P ar am et er T VS Reverse Stand-Off Voltage T VS Reverse Breakdown Voltage T VS Reverse Leakage Current Total Series Resistance Total Cap acitance S y m b ol VRWM V BR IR R Cin Con d i t i on s Mi n i mu m Ty p i c a l M ax i m u m 5 Units V V A Ohms pF It = 1mA VRWM = 3.3V Each Line Inp ut to Gnd, Each Line VR = 0V, f = 1MHz Inp ut to Gnd, Each Line VR = 2.5V, f = 1MHz 6 8 10 0.5 85 100 20 115 22 Total Cap acitance Cin 12 15 pF 2005 Semtech Corp. 2 www.semtech.com ECLAMP2357N PROTECTION PRODUCTS Typical Insertion Loss S21 (Each Filter) CH1 S21 LOG 6 dB / REF 0 dB 1: -8.5294 dB 285.697 MHz 0 dB -6 dB -12 dB -18 dB 2 1 PRELIMINARY Analog Crosstalk (Each Line) CH1 S21 LOG 6 dB / REF 0 dB 2: -18.060 dB 900 MHz 3: -31.328 dB 1.8 GHz 4: -32.019 dB 2.5 GHz -24 dB -30 dB 3 -36 dB -42 dB 1 MHz START . 030 MHz 10 MHz 100 MHz 4 3 1 GHz GHz STOP 3000. 000000 MHz START . 030 MHz . STOP 3000 000000 MHz ESD Clamping (+8kV Contact) ESD Clamping (-8kV Contact) Capacitance vs. Reverse Voltage (Normalized to 0 volts) 1.2 1.2 Series Resistance vs. Temperature (Normalized to 25 Degrees Celcius) 1 1.1 Capacitance - CJ (pF) 0.8 Series Resistance (Ohm) 1.0 0.6 0.4 0.9 0.2 f = 1 MHz 0.8 0 0 1 2 3 4 5 Reverse Voltage - VR (V) 0.7 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature (*C) 2005 Semtech Corp. 3 www.semtech.com ECLAMP2357N PROTECTION PRODUCTS Applications Information Device Connection The ECLAMP2357N is comprised of six circuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. It also includes 4 lines of TVS diodes for ESD protection of power lines or high speed I/O lines. The device is housed in a 16-pin Quad Flat No-Lead (QFN) package. Electrical connection is made via 16 pins located at the bottom of the device. A center tab serves as the ground connection. Pin connections are noted in the table to the right. The device is designed for easy PCB routing as shown in the application examples. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. PRELIMINARY Pin Identification and Configuration (Top Side View) 16 15 14 13 1 2 3 4 5 678 Pin 3, 4, 5, 7, 9, 10 1, 2, 11, 12, 14, 16 6, 8, 13, 15 Center Tab Identification Input EMI/ESD Protected Lines Output EMI/ESD Protected Lines Input/Output ESD Protected Lines Ground 12 11 10 9 Pin Configuration and Schematic 3 LOW PASS FILTER 2 7 LOW PASS FILTER 14 4 LOW PASS FILTER 1 8 13 5 LOW PASS FILTER 16 9 LOW PASS FILTER 12 6 15 10 LOW PASS FILTER 11 2005 Semtech Corp. 4 www.semtech.com ECLAMP2357N PROTECTION PRODUCTS Typical Applications PRELIMINARY 2005 Semtech Corp. 5 www.semtech.com ECLAMP2357N PROTECTION PRODUCTS Outline Drawing - 16L QFN DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .031 .040 .002 .000 (.008) .007 .010 .012 .114 .118 .122 .051 .057 .061 .114 .118 .122 .051 .057 .061 .020 BSC .012 .016 .020 16 .003 .004 0.80 1.00 0.00 0.05 (0.20) 0.18 0.25 0.30 2.90 3.00 3.10 1.30 1.45 1.55 2.90 3.00 3.10 1.30 1.45 1.55 0.50 BSC 0.30 0.40 0.50 16 0.08 0.10 PRELIMINARY DIM A D B A A1 A2 b D D1 E E1 e L N aaa bbb PIN 1 INDICATOR (LASER MARK) E A2 A aaa C A1 D1 e/2 LxN E/2 E1 2 1 N e D/2 C SEATING PLANE bxN bbb CAB NOTES: 1. 2. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - 16L QFN H R DIM 2x (C) 2x G 2x Z C G H R P X Y Z DIMENSIONS INCHES MILLIMETERS (.112) .079 .063 .006 .020 .012 .033 .146 (2.85) 2.00 1.60 0.15 0.50 0.30 0.85 3.70 4x Y X P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2005 Semtech Corp. 6 www.semtech.com ECLAMP2357N PROTECTION PRODUCTS Marking PRELIMINARY Ordering Information Part Number 16 15 14 13 1 2 3 4 13 14 15 16 12 11 10 9 12 11 10 9 8765 Bottom View Showing Pin 1 Identifier EClamp 2357N .TCT Qty per Reel 3000 R eel Size 7 Inch 2357N YYWW 5 678 1 2 3 4 EClamp and EMIClamp are marks of Semtech Corporation Top View Showing Device Marking Notes: 1) YYWW = Date Code 2) Pin 1 indicated by bevel on the ground pad Tape and Reel Specification Tape Specifications Device Orientation in Tape Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2005 Semtech Corp. 7 www.semtech.com |
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