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 HMC445LP4 / 445LP4E
SMT GaAs HBT MMIC x16 ACTIVE FREQUENCY MULTIPLIER, 9.9 - 11.0 GHz OUTPUT
Typical Applications
Active Multiplier for X Band Applications: * Fiber Optic
v03.0907
Features
Output Power: +7 dBm Sub-Harmonic Suppression: >25 dBc SSB Phase Noise: -130 dBc/Hz Single Supply: 5V @ 78 mA 24 Lead 4x4 mm SMT Package: 16 mm2
7
FREQUENCY MULTIPLIERS - SMT
* Point-to-Point Radios * Military Radar
Functional Diagram
General Description
The HMC445LP4 & HMC445LP4E are active miniature x16 frequency multipliers utilizing InGaP GaAs HBT technology in 4x4 mm leadless surface mount packages. Power output is +7 dBm typical from a 5.0V supply voltage and varies little vs. input power, temperature and supply voltage. Suppression of undesired fundamental and sub-harmonics is >25 dBc typical with respect to output signal level. The low additive SSB phase noise of -130 dBc/Hz at 100 kHz offset helps the user maintain good system noise performance. The HMC445LP4 & HMC445LP4E are ideal for use in LO multiplier chains allowing reduced parts count vs. traditional approaches.
Electrical Specifi cations, TA = +25 C, Vcc= 5.0V
Parameter Frequency Range, Input Frequency Range, Output Input Power Range Output Power Sub-Harmonic Suppression Input Return Loss Output Return Loss SSB Phase Noise (100 kHz Offset) Supply Current (Icc) Pin= 0 dBm -15 4 7 25 28 7 -130 78 104 Min. Typ. 618.75 - 687.50 9.9 - 11.0 5 Max. Units MHz GHz dBm dBm dBc dB dB dBc/Hz mA
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC445LP4 / 445LP4E
SMT GaAs HBT MMIC x16 ACTIVE FREQUENCY MULTIPLIER, 9.9 - 11.0 GHz OUTPUT
Output Power vs. Temperature @ -10 dBm Drive Level
0
v03.0907
Output Power vs. Drive Level
10 9
RETURN LOSS (dB)
-5
OUTPUT POWER (dBm)
8 7 6 5 4 3 2 1
-20 dBm -15 dBm -10 dBm -5 dBm 0 dBm +5 dBm
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FREQUENCY MULTIPLIERS - SMT
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-10
-15
+25 C +85 C -40 C
-20 8 9 10 11 12 13 14 15 FREQUENCY (GHz)
0 9.6
10
10.4
10.8
11.2
11.6
OUTPUT FREQUENCY (GHz)
Output Power vs. Supply Voltage @ -10 dBm Drive Level
10 9 OUTPUT POWER (dBm) 8 7 6 5 4 3 2 1 0 9.6 10 10.4 10.8 11.2 11.6
Vcc=4.5V Vcc=5.0V Vcc=5.5V
Input Return Loss vs. Temperature
0 -5 RETURN LOSS (dB) -10 -15 -20 -25 -30 -35 -40 0 0.5 1 1.5 2 2.5 3
+25 C +85 C -40 C
OUTPUT FREQUENCY (GHz)
FREQUENCY (GHz)
Output Return Loss vs. Temperature
0
RETURN LOSS (dB)
-5
-10
-15
+25 C +85 C -40 C
-20 8 9 10 11 12 13 14 15 FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC445LP4 / 445LP4E
SMT GaAs HBT MMIC x16 ACTIVE FREQUENCY MULTIPLIER, 9.9 - 11.0 GHz OUTPUT
SSB Phase Noise Performance, Fout= 10.5 GHz
0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 -140 -150 2 10 SSB PHASE NOISE (dBc/Hz)
v03.0907
Output Spectrum
10 0
7
FREQUENCY MULTIPLIERS - SMT
OUTPUT POWER (dBm)
-10 -20 -30 -40 -50 -60 0 2 4 6 8 10 12 14 16 18 20 22 24 26 FREQUENCY (GHz)
Pin= 0dBm Pin= -10dBm
10
3
10
4
10
5
10
6
10
7
OFFSET FREQUENCY (Hz)
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC445LP4 / 445LP4E
SMT GaAs HBT MMIC x16 ACTIVE FREQUENCY MULTIPLIER, 9.9 - 11.0 GHz OUTPUT
v03.0907
Absolute Maximum Ratings
RF Input (Vcc= +5V) Vcc Channel Temperature Continuous Pdiss (T=85 C) (derate 11.5 mW/C above 85 C) Thermal Resistance (Rth) (junction to ground paddle) Storage Temperature Operating Temperature +20 dBm +6V 150 C 750 mW 87.2 C/W -65 to +150 C -40 to +85 C
Typical Supply Current vs. Vcc
Vcc (V) 4.5 5.0 5.5 Icc (mA) 75 78 80
7
FREQUENCY MULTIPLIERS - SMT
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Note: Multiplier will operate over full voltage range shown above.
ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS
Outline Drawing
NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOT FOR SUGGESTED
Package Information
Part Number HMC445LP4 HMC445LP4E Package Body Material Low Stress Injection Molded Plastic
LAND PATTERN.
Lead Finish Sn/Pb Solder 100% matte Sn
MSL Rating MSL1 MSL1
[1]
Package Marking [3] H445 XXXX H445 XXXX
RoHS-compliant Low Stress Injection Molded Plastic
[2]
[1] Max peak reflow temperature of 235 C [2] Max peak reflow temperature of 260 C [3] 4-Digit lot number XXXX
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC445LP4 / 445LP4E
SMT GaAs HBT MMIC x16 ACTIVE FREQUENCY MULTIPLIER, 9.9 - 11.0 GHz OUTPUT
v03.0907
Pin Description
Pin Number 1, 2, 5-14, 17, 18, 20-24 Function N/C Description No Connection Interface Schematic
7
FREQUENCY MULTIPLIERS - SMT
3
RFIN
RF input needs to be DC blocked only if there is an external DC voltage applied to RF IN.
4, 15
GND
All ground leads and ground paddle must be soldered to PCB RF/DC ground. Multiplied Output. AC coupled. No external DC blocks necessary.
16
RFOUT
19
Vcc
Supply voltage 5V 0.5V.
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC445LP4 / 445LP4E
SMT GaAs HBT MMIC x16 ACTIVE FREQUENCY MULTIPLIER, 9.9 - 11.0 GHz OUTPUT
Evaluation PCB
v03.0907
7
FREQUENCY MULTIPLIERS - SMT
List of Materials for Evaluation PCB 106137 [1]
Item J1 - J3 C1 U1 PCB [2] Description PCB Mount SMA Connector 1,000 pF Capacitor, 0603 Pkg. HMC445LP4 / HMC445LP4E x16 Active Multiplier 104610 Eval Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350
The circuit board used in the final application should be generated with proper RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. The evaluation circuit board shown is available from Hittite upon request.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
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