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BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HD1G4B433T-TRB
Features:
1. Emitted Color : Super Red, Bluish Green and Super Blue. 2. Lens Appearance : Water Clear 3. Multi-color type. 4. 3.2x2.7x1.1mm(1210) standard package 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn't contain restriction Substance, comply ROHS standard.
GREEN ANODE MARK
Package Dimensions:
Applications:
1. 2. 3. Automotive : Dashboards Backlighting : LCDs, Key pads advertising. Status indicators : Comsumer & industrial electronics.
NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is 0.10mm (0.004") unless otherwise specified. 3.Specifications are subject to change without notice.
4. General use.
Absolute Maximum Ratings(Ta=25)
Parameter
Power Dissipation Forward Current Peak Forward Current 1 Reverse Volage Operating Temperature Storage Temperature Soldering Temperature
Symbol
Pd IF IFP VR Topr Tstg Tsol
Super Red
60 30 100
Bluish Green
120 30 100 5 -25~80 -30~85 See Page 7
Super Blue
120 30 100
Unit
mW mA mA V -
1 Condition for IFp is pulse of 1/10 duty and 0.1msec width.
Ver.1.1 Page 1 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HD1G4B433T-TRB
Min.
12.3 140 28 638 500 465 -
Electrical and optical characteristics(Ta=25) Parameter
Forward Voltage Luminous Intensity Reverse Current Peak Wave Length Dominant Wave Length Spectral Line Half-width Veiwing Angle
Symbol
Vf Iv IR p
Condition
IF=20mA IF=20mA VR=5V IF=20mA IF=20mA IF=20mA IF=20mA
Color
Super Red Bluish Green Super Blue Super Red Bluish Green Super Blue Super Red Bluish Green Super Blue Super Red Bluish Green Super Blue Super Red Bluish Green Super Blue Super Red Bluish Green Super Blue Super Red Bluish Green Super Blue
Typ.
1.8 3.2 3.2 25 250 50 660 505 470 20 35 30 120
Max.
2.6 3.6 3.6 100 1 1 648 510 475 -
Unit
V mcd A nm nm nm deg
d
21/2
Typical Electro-Optical Characteristics Curves
Fig.1 Relative intensity vs. wavelength
1.0
(B)
(G)
(R)
60
Fig.2 Forward current derating curve vs. ambient temperature
50
Relative radiant intensity
Forward Current (mA)
40
0.5
30
20
10
0 0 400 500 600 700
20
40
60
80
100
Ambient temperature Ta( C)
Wavelength (nm) Fig.4 Relative luminous intensity vs. ambient temperature
3.0
Fig.3 Forward current vs. forward voltage
(R) 50 (G) (B)
40 Relative luminous intensity
2.5 (Normalized @ 20mA)
Forward current (mA)
2.0
30
1.5
20
1.0
10
0.5
0
1
2
3
4
5
0 -40
-20
0
20
40
60
Forward voltage(V)
A Ambient temperature Ta( C)
Fig.5 Relative luminous intensity vs. forward current
4.0
Fig.6 Radiation diagram
0 10 20 30
Relative luminous intensity (@20mA)
Relative radlant intensity
3.0
40 1.0 0.9 0.8 50 60 70 0.7 80 90
(R) 2.0 (G) (B)
1.0
0
5
10
20
30
40
50
0.5
0.3
0.1
0.2
0.4
0.6
Forward current (mA)
Ver.1.1 Page 2 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HD1G4B433T-TRB
13.00.5
Tapping and packaging specifications(Units: mm)
USER DIRECTION OF FEED
1.270.1
COMMON ANODE
COMMON ANODE
2.82 0.1
START END
71.01
13.0 0.5
3.351
5.3 0.05
8.0 0.3
cathode 1.75 0.1 LEADER 0.3 FIXING TAPE
4.0 0.1 4.0 0.1
1.50.1 2.00.05
Package Method:(unit:mm)Vacuum
3.5 0.05
TRAILER
NOTE: 3000 pcs PER REEL
12 bag/box 3000 pcs/reel
200
Bar Code Label
245
220 185
220
Aluminum Foil Bag
645
6 box/carton
210 470
Ver.1.0 Page 3 of 8
1791
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HD1G4B433T-TRB
Bin Limits I n t e n s i t y B i n L i m i ts ( D 1 ) BIN CODE
K L M N
Min. (mcd)
12.3 18.5 28.0 42.0
Max. (mcd)
18.5 28.0 42.0 63.0
To l e r a n c e f o r e a c h B i n l i m i t i s 1 5 % .
I n t e n s i t y B i n L i m i ts ( G 4 ) BIN CODE
R S T U
Min. (mcd)
140 210 317 475
Max. (mcd)
210 317 475 715
To l e r a n c e f o r e a c h B i n l i m i t i s 1 5 % . C o l o r B i n L i m i ts ( G 4 ) BIN CODE
2 3
Min. (nm)
500 505
Max. (nm)
505 510
To l e r a n c e f o r e a c h B i n l i m i t i s 1 n m . V F B i n L i m i ts ( G 4 ) BIN CODE
G H J K
Min.(v)
2.8 3.0 3.2 3.4
Max.(v)
3.0 3.2 3.4 3.6
To l e r a n c e f o r e a c h B i n l i m i t i s 0 . 0 5 V.
Ver.1.1 Page 4 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HD1G4B433T-TRB
Bin Limits BIN CODE
M N P Q
I n t e n s i t y B i n L i m i ts ( B 4 ) Min. (mcd)
28 42 63 94
Max. (mcd)
42 63 94 140
To l e r a n c e f o r e a c h B i n l i m i t i s 1 5 % . C o l o r B i n L i m i ts ( B 4 ) BIN CODE
4
Min. (nm)
465
Max. (nm)
470
To l e r a n c e f o r e a c h B i n l i m i t i s 1 n m . V F B i n L i m i ts ( B 4 ) BIN CODE
G H J K
Min.(v)
2.8 3.0 3.2 3.4
Max.(v)
3.0 3.2 3.4 3.6
To l e r a n c e f o r e a c h B i n l i m i t i s 0 . 0 5 V.
B IN x-x x x-x x x
VF BIN CODE (B4) Color BIN CODE (B4) Intensity BIN CODE (B4) VF BIN CODE (G4) Color BIN CODE (G4) Intensity BIN CODE (G4) Intensity BIN CODE (D1)
Ver.1.1 Page 5 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HD1G4B433T-TRB
Reliability Test
Classification Test Item Reference Standard Test Conditions Result
Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low :B-12 Temperature JIS-C-7021 Storage Temperature MIL-STD-202:107D Cycling MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 Thermal Shock MIL-STD-202:107D Environmental MIL-STD-750:1051 Test MIL-STD-883:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1
Connect with a power If=20mA Ta=Under room temperature Test time=1,000hrs Ta=+655 RH=90%-95% Test time=240hrs High Ta=+855 Test time=1,000hrs Low Ta=-355 Test time=1,000hrs -35 ~ +25 ~ +85 ~ +25 60min 20min 60min 20min Test Time=5cycle -355 ~+855 20min 20min Test Time=10cycle Preheating 140-160,within 2 minutes. Operation heating 260(Max.), within 10seconds. (Max.)
0/20
0/20
0/20
0/20
0/20
0/20
0/20
Judgment criteria of failure for the reliability
Measuring items Forward voltage Reverse current Luminous intensity Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=20mA VR=5V IF=20mA Judgement criteria for failure Over Ux1.2 Over Ux2 Below SX0.5
Note:
1.U means the upper limit of specified characteristics.
S means initial value.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test.
Ver.1.0 Page 6 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HD1G4B433T-TRB
Soldering :
1. Manual Of Soldering The temperature of the iron tip should not be higher than 300(572) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 140~1605,within 2 minutes. Operation heating : 260(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching).
10 SEC. MAX.
3. DIP soldering (Wave Soldering) : Preheating : 120~150,within 120~180 sec. Operation heating : 2455 within 5 sec.260 (Max) Gradual Cooling (Avoid quenching).
Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook.
Temperature
140~160
260 MAX. 4 /SEC. MAX.
4 /SEC. MAX. OVER 2 MIN.
Time
Soldering heat Max. 260 120~150 245 5 within 5 sec.
Temperature
Preheat 120~180 sec.
Time
Ver.1.0 Page 7 of 8
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HD1G4B433T-TRB
Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs.
Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5-30(41)Humidity : RH 60Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 12 hours at 603.
Package and Label of Products:
(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag. (2) Label:
BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date x xx xx Year Month xx Day
Manufacture Location
Ver.1.0 Page 8 of 8

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