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TB62802F
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
TB62802F
CCD Clock Drivers
TB62802F is a clock distribution driver for CCD linear image sensors. The IC can functionally drive the CCD input capacitance. It also supports inverted outputs, eliminating the need for crosspoint control. The IC contains a 1-to-4 clock distribution driver and 4-bit buffer.
Features
* High drivability: Guaranteed driving 250 pF load capacitance @fclock = 25 MHz (4-bit distribution driver) Operating temperature range: Ta = 0C to 60C Weight: 0.5 g (typ.)
*
Pin Connection (top view)
OUT_cont 2B_in CP_in VCC1
1 2 3 4
16 15 14 13
2B_out CP_out
GND1
GND2
VCC2 CK_in SH_in RS_in
5 6 7 8
12 11 10 9

SH_out RS_out
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TB62802F
Logic Diagram

CK_in
CP_in
CP_out
SH_in
SH_out
RS_in
RS_out
2B_in
2B_out
OUT_cont
Pin Description
Pin No. 1 2 3 4
Pin Name OUT_cont 2B_in CP_in VCC1 GND1 VCC2 CK_in SH_in RS_in RS_out SH_out

Functions Output control pin Light load drive input Light load drive input Light load power supply Light load ground Heavy load power supply Heavy load drive input Light load drive input Light load drive input Light load drive output (not inverted) Light load drive output (not inverted) Heavy load drive output (not inverted) Heavy load drive output (inverted) Heavy load ground Heavy load drive output (inverted) Heavy load drive output (not inverted) Light load drive output (not inverted) Light load drive output (not inverted)
Remarks
Driver input for CCD last-stage clock CCD clamp gate driver input

5 6 7 8 9 10 11 12
Driver input for CCD transfer clock CCD shift gate driver input CCD reset gate driver input CCD reset gate driver output CCD shift gate driver output Driver output for CCD transfer clock Driver output for CCD transfer clock
GND2

13 14 15 16
Driver output for CCD transfer clock Driver output for CCD transfer clock CCD clamp gate driver output Driver output for CCD last-stage clock
CP_out 2B_out
Note: The internal circuits for heavy load drive pins and have the same configuration as those of light load drive pins RS_out, SH_out, CP_out and 2B_out. Thus, these internal circuits have the same characteristics.
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Truth Table
Input Pin Name Logic Pin Name Logic L CK_in H L H SH_in L H L RS_in H L 2B_in H H

Output Pin Name

Logic L H H L L H
CP_in L OUT_cont
CP_out
SH_out
L H L
RS_out H L 2B_out H All Output L
Absolute Maximum Ratings (Ta = 25C)
Characteristic Power supply voltage Input voltage Output voltage Input clamp diode current (VIN < 0) Output clamp diode current (VO < 0) Output current High level excluding other Low level than , outputs
output current
Symbol VCC VIN VO IIK IOK IOH (O) IOL (O) IOH () IOL () Tstg Tj
ja
Rating
-0.5 to 7.0 -1.2 to VCC + 0.5 -0.5 to VCC -50.0 -50.0 -16.0 +16.0 -150
Unit V V V mA mA mA mA mA mA C C C/W
High level Low level
150
-40 to 150
Storage temperature Junction temperature Thermal resistance Chip to ambient air
150 83
Note: Output current is specified as follows: VOH = 4.0 V, VOL = 0.5 V.
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Recommended Operating Conditions (Ta = 25C)
Characteristic Power supply voltage Input voltage Output voltage Output current excluding , outputs
output current
Symbol VCC VIN VO
Min 4.7 0 0
Typ. 5.0
Max 5.5 VCC VCC
-8.0
Unit V V V mA mA mA mA C/W C ns

12 25 2.5
High level Low level High level Low level
VOH (O) VOL (O) VOH () VOL ()
jc

0
8.0
-10.0
10.0
Thermal resistance (chip to case) Operating temperature Input rise/fall time (Note)
60 5.0
Topr tri/tfi
Note: There is no hysteresis in the input block of this IC. Therefore attention should be given to the following: A CMOS integrated circuit charges and discharges the capacitance load (internal equivalent capacitance) of the internal circuit while operating. The charged or discharged current flows in the package of the IC and inductance of transmission line, which causes inductive spike voltage to be generated. When the spike voltage is generated in the reference GND, it affects the amplitude of an input signal. The amplitude seems to be fluctuating compared to when no spike voltage is generated in the reference GND. In this case, some induced spike waveforms exceed the input threshold level. For low-frequency inputs, the rate at which a spike exceeds the level increases, resulting in unstable output. Therefore, do not apply input signals lower than 1 s. When designing a board, be sure to take transmission line inductance into consideration.
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Electrical Characteristics DC Characteristics (unless otherwise specified, VCC = 4.7 to 5.5 V, Ta = 0 to 60C)
Characteristic Input voltage High Low Input clamp voltage Symbol VIH VIL VIK VOH (O) 2 3 IIK = -20 mA IOH = -50 A IOH = -8 mA IOL = 50 A IOL = 8 mA IOH = -10 mA VOH (/ )
output voltage
Test Circuit 1
Test Condition
VCC 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 5.5
Min 2.0 0
Typ.

Max VCC 0.8 1.0 VCC VCC 0.2 0.7 VCC VCC VCC 0.3 0.5 2.0 1.0
Unit V V
4.5 3.9 0 0 4.5 3.9 3.0 0 0 0
Output voltage excluding , outputs
V
VOL (O)
5
3, 4
IOH = -30 mA IOH = -120 mA IOL = 50 A
V
VOL (/ )
5, 6
IOL = 30 mA IOL = 120 mA VIN = VCC or GND For light load output, all bits are High. For heavy load output, 2 bits are High. 2 bits are Low. Out_cont = "H" One input : VIN = 0.5 V or VCC - 2.1 V Other inputs : VIN = VCC or GND
Input voltage
IIN
7
A
Total Static current consumption
ICC
8
5.5
15.0
Forced low for all bits Each bit
ICCL
ICC
5.5
30.0
mA
9
1.5
Output off mode supply voltage
VPOR
(Note) Light load power supply (VCC1) reference
3.0
V
Note: Refer to the description of the P.O.R below.
Mode in Which Output Is Held at Low at Power-On (P.O.R: Power On Reset circuit)
To eliminate the unstable period for the internal logic, this IC incorporates a function for monitoring the light load power supply (VCC1) at power-on to maintain the outputs at Low. * At power-on, all output are held at Low until light load power supply (VCC1) reaches the voltage level of 3 V.
* *
When the light load power supply (VCC1) voltage is higher than 3 V (typ.), the internal logic operates according to input signals. For normal operation, be sure to use a power supply of 4.7 V or higher as guaranteed.
Supply voltage VCC Power VCC
Pulse generator
DUT Output signal waveform
3V
Output signal waveform P.O.R test circuit GND Low level state Time Refer to Subsection 10. "Propagation Delay Time" in AC Parameters.
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AC Characteristics (input transition rise or fall time: tr/tf = 3.0 ns)
Ta = 25C, VCC = 5.0 V Min tpLH () Propagation delay time tpHL () tpLH (O) tpHL (O) tpCLH () Output OFF time tpCHL () tpCLH (O) tpCHL (O) Light load drive output skew Heavy load drive output crosspoints Equivalent internal capacitance (Note 1) to (skw) VT (crs) CPD () CPD (O) CL = 250 pF CL = 20 pF CL = 250 pF CL = 20 pF CL = 20 pF CL = 100 to 250 pF 5.3 5.3 2.5 2.5 9.5 9.5 7.2 7.3 0 1.5

Characteristic
Symbol
Test Condition
Ta = 0 to 60C VCC = 4.7 to 5.5 V Min 5.0 5.0 2.0 2.0 9.0 9.0 6.0 6.0 0 1.5

Unit
Reference Measurement Diagram Measurement diagram 1
Typ. 10.8 9.8 5.4 6.0 14.0 15.4 10.7 18.5

Max 15.5 15.5 9.5 10.5 24.0 24.0 19.0 30.0 2.0

Max 16.0 16.0 10.0 12.0 25.0 25.0 23.0 35.0 2.0

ns Measurement diagram 2 Measurement diagram 1 ns Measurement diagram 2 ns V pF Measurement diagram 3 Measurement diagram 4
57 18
Note 1: CPD denotes "power dissipation capacitance". Dynamic power dissipation can be calculated using the CPD value. Pd = [CPD x VCC x Fin] + (CL x VCC x Fout) CL: Load capacitance per output CPD: Power dissipation capacitance Fin: Input clock frequency Fout: Output clock frequency For example: For heavy load drive output, driving a load capacity of 250 pF at 25 MHz; For light load drive output, driving a load capacity of 20 pF at 25 MHz. Note 2: In practice, the frequencies of some shift gate control signals are lower than the transfer clock. Therefore the power dissipation during practical use is smaller than the calculated value below. Pd = [57 pF x 5.0 V x 5.0 V x 25 MHz] x 4 bit + (250 pF x 5.0 V x 5.0 V x 25 MHz) x 4 bit + [18 pF x 5.0 V x 5.0 V x 25 MHz] x 4 bit + (20 pF x 5.0 V x 5.0 V x 25 MHz) x 4 bit 862 mW - The typical power dissipation is approximately 862 mW.
2 2
Notes on System Design
As shown above, the TB62802F consumes high current while operating. There is temporary flow of a current greater than the calculated value. To suppress bouncing from the power supply and GND, decoupling for the power supply is a vital necessity. Below is an example of how the capacitance of a decoupling capacitor is calculated. Be sure to refer to this when designing a system. The decoupling capacitor should be placed underneath the IC to reduce the high-frequency components. Supply current variable: 350 mA (estimated variable in 1 bit) Supply voltage variable: 0.3 V Noise pulse width: 10 ns (time in which fluctuation occurs) C = ICC/(V/T) = 350 mA x 4 bit/(0.3 V/10 ns) 47 nF - 0.047 F (when using a normal capacitor) - To control the fluctuation in the low-frequency components, it is recommended that the power supply on the board be decoupled using a 10 F to 50 F capacitor.
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Reference Characteristics
Load Capacitance vs. Power Dissipation
1.2
1
W
0.8
Power dissipation
0.6 Drive frequency: 25 MHz (all bits are driven at the same frequency) Supply voltage: 5.0 V Light load capacitance: 20 pF Light load internal equivalent capacitance: 18 pF Heavy load internal equivalent capacitance: 57 pF Ambient temperature: 25C 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300
0.4
0.2
0 0
Load capacitance
pF
Power Dissipation and Junction Temperature (reference value)
1.00 0.90 0.80 Condition: (1) Power dissipation IC internal equivalent capacitance Heavy load = 57 pF Light load = 18 pF CCD input capacitance Main clock = 250 pF Control clock = 20 pF Driver supply voltage = 5.0 V Driver output amplitude = 5.0 V The main clock and control clock oscillate at the same frequency. 120 (2) Junction temperature Ta = 25C ja = 83.3C/W (typical value for the IC itself)
100
W
0.60 0.50 0.40 0.30 0.20 0.10
60
40
Power dissipation Junction temperature
20
0.00 1.0
0 3.0 5.0 7.0 9.0 11.0 13.0 15.0 17.0 19.0 21.0 23.0 25.0
Drive frequency
MHz
Thermal Design
The junction temperature is expressed as follows: Tj = Ta + (jc + ca) x Pd = Ta + ja x Pd Tj: Junction temperature Ta: Ambient temperature jc: Thermal resistance from chip to case (a specific value not affected by environment) ja: Thermal resistance from chip to ambient temperature (affected by environment) Pd: Power dissipation when driving external load Here, the thermal performance of the heat dispersion on the PCB and of the ambient temperature setting should be so designed that the calculated value is within the specified range.
Junction temperature
0.70
80
Power dissipation
C
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Propagation Delay Time Capacitance Dependency of the TB62802F Heavy Load Drive Pin
14.0 Condition: VCC = 5.0 V, 12.0 ambient temperature = 25C
ns Propagation delay time
10.0 8.0 6.0 tpHL 4.0 2.0 tpLH tpLH tpHL
0 100 200 250 300
Load capacitance
pF
Propagation Delay Time Capacitance Dependency of the TB62802F Light Load Drive Pin
7.0 Condition: VCC = 5.0 V, 6.0 ambient temperature = 25C
ns Propagation delay time
5.0 4.0 3.0 2.0 1.0 tpLH (O) tpHL (O) 0 10 20
Load capacitance
pF
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Waveform Measuring Point
Propagation Delay Time Setting
Input signal *2B_in *CK_in *SH_in *RS_in *CP_in *out_cont
tri 90% 1.5 V 10% VCC - 0.5 V tpLH () tpHL () GND + 0.5 V VCC - 0.5 V tpLH () GND VCC 90% 1.5 V 10% GND VCC tfi 3.0 V
Measurement Diagram 1
* Output signal
tpHL ()
* Output signal
GND + 0.5 V VCC - 0.5 V tpLH (O) tpHL (O) GND + 0.5 V
GND VCC
Measurement Diagram 2
*2B_out *CK_out *SH_out *RS_out *CP_out
GND VCC
Measurement Diagram 3
*2B_out *CK_out *SH_out *RS_out *CP_out
GND to (skw) to (skw) VOH VT (CRS) VOL GND
Output Waveform Crosspoint/Level Setting
Measurement Diagram 4
* Output signal
* Output signal
VT (CRS) VOL
VOH GND
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Test Circuit
DC Parameters
Pins marked with an asterisk (*) are test pins. Be sure to ground those input pins that are not used as test pins so that the logic is determined. Unless otherwise specified, bits of the same type are measured in the same way.
1. VIH/VIL
(1) Light load drive bits
1 4.7 V 0 to VCC 4 2 3
16 15 20 pF 14 13
E.g., oscilloscope
5 6 7 8
12 11 10 9
Note 1: When measuring input pins, connect to GND those input pins that are not being measured.
(2)
Heavy load drive bits
1 4.7 V 2 3 4
16 15 14 13 250 pF E.g., oscilloscope
5 6 7 0 to VCC 8
12 11 10 9
Note 2: Connect to GND those input pins that are not being measured.
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2. VIK
1 4.7 V 2 3 4 16 15 14 13
5 6 7 8
-20 mA
12 11 10 9
V
Note 1: When measuring input pins, connect to GND those input pins that are not being measured.
3. VOH (O/)
1 4.7 V 2 3 4 16 15 14 13
5 6 7 8
12 11 10 9 V O output: -8 mA output: -120 mA
Note 2: Connect to GND those input pins that are not being measured.
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4. VOH ( )
1 4.7 V 2 3 4 16 15 14 13
5 6 7 8
12 11 V 10 9
output: -120 mA
Note 1: Connect to GND those input pins that are not being measured.
5. VOL (O/)
16 15 14 13 4.7 V
1 4.7 V 2 3 4
O output: 8 mA output: 120 mA 5 6 7 8 12 11 10 9 V
Note 2
Connect to GND those input pins that are not being measured.
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6. VOL ( )
1 4.7 V 2 3 4 16 15 14 13 4.7 V
output: 120 mA
5 6 7 8
12 11 V 10 9
Note 1: Connect to GND those input pins that are not being measured.
7. IIN
1 5.5 V 2 3 4
16 15 14 13
5.5 V 5 A 6 7 8 12 11 10 9
A
Note 2: Connect to GND those input pins that are not being measured.
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8. ICC
5.5 V 0 V or 5.5 V 1 A 2 3 4 16 15 14 13
5 6 7 8
12 11 10 9
Note 1: The input logic of the heavy load drive clock input pin (pin 6) is the same for HIGH or LOW.
9. ICC
VCC 1 A 2 3 4 16 15 14 13
5 6 0.5 V or VCC - 2.1 V 7 8
12 11 10 9
Note 2: When measuring input pins, connect to GND (or to the power supply) those input pins that are not being measured.
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TB62802F
AC Parameters
Pins marked with an asterisk (*) are test pins. Ground those input pins that are not being used as test pins so that the logic is determined. Unless otherwise specified, bits of the same type are measured in the same way.
10. Propagation Delay Time
(1) Light load drive bits
VCC 0 to 3 Vp-p 1 2 3 4 16 15 20 pF 14 13 E.g., oscilloscope
5 6 7 8
12 11 10 9
(2)
Heavy load drive bits
VCC 1 2 3 4 16 15 14 13 250 pF E.g., oscilloscope
5 0 to 3 Vp-p 6 7 8
12 11 10 9
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Package Dimensions
Weight: 0.5 g (typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
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TB62802F
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
(2)
(3)
(4)
(5)
Points to Remember on Handling of ICs
(1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
(2)
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RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice. 021023_D
060116EBA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C * The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
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