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| TA2152FLG TOSHIBA Bipolar Linear IC Silicon Monolithic TA2152FLG Low Current Consumption Headphone Amplifier (for 1.5-V/3-V Use) The TA2152FLG is a headphone amplifier of low current consumption type developed for portable digital audio. It is especially suitable for portable CD players, portable MD players etc. Features * Low current consumption * The power amplifier output stage can be driven using a single battery. As a result, overall current consumption is low. * * Built-in center amplifier switch For the output-coupling type, the consumption current has been decreased still further. Current value (VCC1 = 2.4 V, VCC2 = 1.2 V, f = 1 kHz, RL = 16 , Ta = 25C, typ.) * Output-coupling type * * * * * * No Signal: ICC (VCC1) = 0.4 mA, ICC (VCC2) = 0.3 mA 0.1 mW x 2 ch: ICC (VCC1) = 0.5 mA, ICC (VCC2) = 2.2 mA 0.5 mW x 2 ch: ICC (VCC1) = 0.5 mA, ICC (VCC2) = 5.0 mA No Signal: ICC (VCC1) = 0.7 mA, ICC (VCC2) = 0.7 mA 0.1 mW x 2 ch: ICC (VCC1) = 0.7 mA, ICC (VCC2) = 4.5 mA 0.5 mW x 2 ch: ICC (VCC1) = 0.8 mA, ICC (VCC2) = 10.0 mA (VCC1 = 2.4 V, VCC2 = 1.2 V, f = 1 kHz, RL = 16 , THD = 10%, Ta = 25C) Weight: 0.05 g (typ.) Marking: 2152 * OCL type * * * * * * * Output power: Po = 8 mW (typ.) Voltage gain: GV = 11.5dB (typ.) Built-in beep function Built-in low-pass compensation (output-coupling type) Built-in mute switch Built-in power switch Operating supply voltage range (Ta = 25C) VCC1 (opr) = 1.8 V~4.5 V VCC2 (opr) = 0.9 V~4.5 V 1 2006-04-19 TA2152FLG Block Diagram (of OCL Application) VCC1 VCC1 ON OFF PW SW 18 MUTE TC 19 VCC1 VCC1 20 ON OFF MUTE SW 17 BEEP IN 16 BIAS OUT C-AMP SW RF IN 12 BIAS IN 11 OUT ADJ 10 15 14 GND 13 PW/MUTE SW BEEP C-AMP SW BIAS INB 21 INA 22 NC 9 VCC2 VCC2 23 BEEP OUTA 24 PW A PW C PW B NC 8 BEEP OUTB 7 1 OUTA 2 EQA 3 PW GND 4 OUTC 5 EQB 6 OUTB RL RL 2 2006-04-19 TA2152FLG Pin Descriptions Pin Voltage: Typical pin voltage for test circuit when no input signal is applied (VCC1 = 2.4 V, VCC2 = 1.2 V, Ta = 25C) Pin No. 1 4 6 3 23 Name OUTA 23 OUTC OUTB PW GND VCC2 GND for power drive stage 3 VCC for power drive stage 1.2 Outputs from power amplifier 1 0 VCC2 0.6 Function Internal Circuit Pin Voltage (V) 2 EQA Low-pass compensation pins 20 k 0.6 5 EQB 22 1 21 INB Inputs to power amplifier 5 k 15 k 43 k 2 0.6 22 INA 7 BEEP OUTB Outputs for beep signal VCC2 24 24 BEEP OUTA GND for everything other than power drive stage Not connected 14 8 9 GND NC NC VCC2 0 10 OUT ADJ DC output voltage adjustment Either connect this pin or leave it open depending on the level of VCC2. If the power supply of a 1.5 V system is applied to VCC2, connect this pin to BIAS IN (pin11) If the power supply of a 3 V system is applied to VCC2, leave this pin open. Bias circuit input Ripple filter input Bias circuit output VCC for everything other than power drive stage 47 k 15 k 12 0.6 VCC1 20 0.6 10 11 12 15 20 BIAS IN RF IN BIAS OUT VCC1 11 62 k 15 1.1 0.6 2.4 3 2006-04-19 TA2152FLG Pin No. Name Function Internal Circuit Pin Voltage (V) VCC1 13 C-AMP SW Center amplifier switch C-Cup type: GND OCL type: Open 13 to center amplifier 16 BEEP IN Beep signal input If the beep function is not used, this pin is connected to GND. 10 k 16 17 MUTE SW Mute switch Mute OFF: L level Mute ON: H level Refer to application note (6) VCC1 62 k 17 VCC1 100 k 18 PW SW 10 k Power switch IC ON: H level IC OFF: L level Refer to application note (6) 18 VCC1 19 MUTE TC Mute smoothing Reduces pop noises during switching. 19 39 k 4 2006-04-19 TA2152FLG Application Notes (1) Beep function In Power Mute Mode, the beep signal from the microcomputer or other controlling device is input on the BEEP IN pin (pin 16). This signal is output as a current which flows to the load via the BEEP output pin (pin 7/24). The beep level is set to Vo = -50dBV (RL = 16 (typ.) ). For the beep signal timing, please refer to Figure 1. ON PW SW OFF ON MUTE SW OFF BEEP OUT 100 ms 100 ms 10 ms 100 ms OCL type Output-coupling type 200 ms 100 ms 10 ms 100 ms Figure 1 Timing chart for beep and output signals (2) Low-cut compensation For output-coupling type, the low-frequency range can be decreased using an output-coupling capacitor and a load (fc = 45 Hz at C = 220 F, R = 16 ). However, since the capacitor is connected between the IC's output pin (pin 1/6) and EQ pin (pin 2/5), the low-frequency gain of the power amplifier increases, enabling low-cut compensation to be performed. For the response of capacitors of different values, please refer to Figure 2. RES - f 4 2 0.18 F 0.22 F -2 0.33 F 0.47 F 0.68 F -6 No compensation -8 20 50 100 200 500 1k 2k Response (dB) 0 -4 Frequency f (Hz) Figure 2 Capacitor response 5 2006-04-19 TA2152FLG (3) Adjustment of DC output voltage Please perform the OUT ADJ pin (pin 10) as follows by the power supply of VCC1 and VCC2. * If a boost voltage is applied to VCC1, VCC2 is connected to a battery and the difference between VCC1 and VCC2 is greater than or equal to 0.7 V, short pins 10 and 11 together. In this case the DC output voltage will be * VCC2 . 2 If the difference between VCC1 and VCC2 is less than 0.7 V, or if VCC1 and VCC2 are connected to the same power supply, leave pin 10 open. In these cases the DC output voltage will be VCC2 - 0.7 V . 2 However, when the voltage level of VCC2 is high, the DC output voltage is will be set to approximately 1.4 V. (4) RF IN pin The ripple rejection ratio can by improved by connecting a capacitor to this pin. Connection of a capacitor is recommended, particularly for output-coupling type. RR - C (RF IN) 30 Output-coupling type (dB) RR Ripple rejection ratio 40 50 60 70 VCC1 = 2.4 V VCC2 = 1.2 V (ripple signal applied) 80 fr = 100 Hz Vr = -20dBV BIAS IN = 4.7 F Open 0.1 0.2 0.5 1 2 5 10 RF IN capacitance C (F) Figure 3 Improvement of ripple rejection ratio (5) Output application of power amplifier For output-coupling type the center amplifier is not used with the result that current consumption is low. Please set the C-AMP SW pin (pin 13) accordingly. Output-coupling type: Pin 13 is connected to GND. OCL type: Pin 13 is open. 6 2006-04-19 TA2152FLG (6) Switching pins (a) PW SW The device is ON when this pin is set to High. To prevent the IC being turned ON by external noise, it is necessary to connect an external pull-down resistor to the PW SW pin. The pin is highly sensitive. (b) MUTE SW If the MUTE SW pin is fixed to High, current will flow through the pin, even when the PW SW pin is in OFF Mode. To prevent the IC being turned ON by external noise, it is necessary to connect an external pull-down resistor. The pop noise heard when the MUTE SW switch is turned ON or OFF can be reduced by connecting an external capacitor to the MUTE TC pin. (c) Switch sensitivity (Ta = 25C) PW SW 5 4.5 V 4 4 5 4.5 V MUTE SW (V) V18 3 V17 (V) H 3 H Pin voltage 2 1.5 V 1 0.3 V 0 0 1 2 3 Pin voltage 2 1 1.0 V 0.3 V L 4 5 0 0 L 2 3 4 5 1 Supply voltage VCC1 (V) Supply voltage VCC1 (V) PW SW H level L level IC ON IC OFF H level L level MUTE SW Mute ON Mute OFF Figure 4 Switch sensitivity (7) Miscellaneous The following capacitors must have excellent temperature and frequency characteristics. * Capacitor between VCC1 (pin 20) and GND (pin 14) * Capacitor between VCC2 (pin 23) and PW GND (pin 3) * Capacitor between BIAS IN (pin 11) and GND (pin 14) * Capacitor between BIAS OUT (pin 15) and GND (pin 14) * Capacitor between RF IN (pin 12) and GND (pin 14) 7 2006-04-19 TA2152FLG Absolute Maximum Ratings (Ta = 25C) Characteristic Supply voltage 1 Supply voltage 2 Output current Power dissipation Operating temperature Storage temperature Symbol VCC1 VCC2 Io (peak) PD (Note) Topr Tstg Rating 4.5 4.5 100 350 -25~75 -55~150 mA mW C C Unit V Note: Derated by 2.8 mW/C above Ta = 25C Electrical Characteristics (Unless otherwise specified VCC1 = 2.4 V, VCC2 = 1.2 V, Rg = 600 , RL = 16 , f = 1 kHz, Ta = 25C, SW1: a, SW2: b, SW3: a) Characteristic Symbol ICCQ1 ICCQ2 ICCQ3 ICCQ4 Quiescent supply current ICCQ5 ICCQ6 ICCQ7 ICCQ8 ICCQ9 ICCQ10 ICC1 Power supply current during drive ICC2 ICC3 ICC4 Voltage gain Channel balance Output power Total harmonic distortion Output noise voltage Cross talk Ripple rejection ratio 1 Ripple rejection ratio 2 Muting attenuation Beep sound output voltage PW SW ON current PW SW OFF voltage Mute SW ON current Mute SW OFF voltage GV CB Po THD Vno CT RR1 RR2 ATT Test conditions IC OFF (VCC1), SW1: b IC OFF (VCC2), SW1: b OCL, Mute ON (VCC1), SW2: a OCL, Mute ON (VCC2), SW2: a C-Cup, Mute ON (VCC1), SW2: a C-Cup, Mute ON (VCC2), SW2: a OCL, no signal (VCC1) OCL, no signal (VCC2) C-Cup, no signal (VCC1) C-Cup, no signal (VCC2) OCL, 0.5 mW x 2 ch (VCC1) OCL, 0.5 mW x 2 ch (VCC2) C-Cup, 0.5 mW x 2 ch (VCC1) C-Cup, 0.5 mW x 2 ch (VCC2) Vo = -22 dBV Vo = -22 dBV THD = 10% Po = 1 mW Rg = 600 , Filter: IHF-A, SW3: b Vo = -22 dBV Inflow to VCC1, SW3: b fr = 100 Hz, Vr = -20 dBV Inflow to VCC2, SW3: b fr = 100 Hz, Vr = -20 dBV Vo = -12 dBV Min 9.5 -1.5 5 -25 -65 -85 -100 -55 5 0 5 0 Typ. 0.1 0.1 400 650 170 85 0.7 0.7 0.4 0.3 0.8 10.0 0.5 5.0 11.5 0 8 0.1 -100 -35 -85 -100 -115 -50 Max 5 5 600 1400 250 170 1.1 1.5 mA 0.6 0.6 13.5 +1.5 1.0 -96 dB -45 0.3 0.3 dBV A V A V dB mW % dBV mA A Unit VBEEP (OUT) VBEEP (IN) = 2 Vp-p I18 V18 I17 V17 VCC1 = 1.8 V, VCC2 = 0.9 V VCC1 = 1.8 V, VCC2 = 0.9 V VCC1 = 1.8 V, VCC2 = 0.9 V VCC1 = 1.8 V, VCC2 = 0.9 V 8 2006-04-19 TA2152FLG Test Circuit VCC1 VCC1 0.47 F 18 PW SW 19 MUTE TC 17 MUTE SW 16 BEEP IN 10 F 15 BIAS OUT (a) SW1 (b) (a) SW2 (b) 14 GND 13 C-AMP SW RF IN 12 4.7 F 22 F VCC1 20 VCC1 BIAS IN 11 600 (b) 10 F BIAS OUT (a) SW3b Rg = 600 600 (b) 10 F (a) SW3a Rg = 600 VCC2 21 INB TA2152FLG 22 INA NC 9 OUT ADJ 10 22 F 23 VCC2 NC 8 24 BEEP OUTA OUTA 1 EQA 2 PW GND 3 BEEP OUTB 7 OUTC 4 EQB 5 OUTB 6 RL 16 RL 16 9 2006-04-19 TA2152FLG Characteristic Curves (unless otherwise specified, VCC1 = 2.4 V, VCC2 = 1.2 V, Rg = 600 , RL = 16 , f = 1 kHz, Ta = 25C) ICCQ - VCC2 1.5 1.5 ICCQ - VCC1 (mA) 1.5 V application VCC2 = 1.2 V OCL: VCC2 current 1 (mA) 1.5 V application VCC1 = 2.4 V ICCQ 1 Quiescent supply current OCL: VCC1 current OCL: VCC2 current 0.5 C-Cup: VCC1 current Quiescent supply current ICCQ OCL: VCC1 current 0.5 C-Cup: VCC1 current C-Cup: VCC2 current C-Cup: VCC2 current 0 0 0 1 1.5 2 2.5 0 1 2 3 4 5 Supply voltage of power drive stage VCC2 (V) Supply voltage VCC1 (V) ICCQ - VCC (mA) VO (DC) - VCC2 1.5 (V) OCL 1.5 Pin 10, 11: Short 1.5 V application ICCQ Quiescent supply current Output DC voltage 1 C-Cup VO(DC) 1 Pin 10, 11: Open 3 V application 0.5 0.5 3 V application VCC1 = VCC2 ICCQ (VCC1 + VCC2) 0 0 1 2 3 4 5 0 0 1 2 3 4 5 Supply voltage VCC (V) Supply voltage of power drive stage VCC2 (V) ICC - Po 100 OCL mode f = 1 kHz Dual input VCC2 100 C-Cup mode f = 1 kHz Dual input ICC - Po (mA) ICC ICC 10 (mA) 10 VCC2 Supply current 1 VCC1 Supply current 1 VCC1 0.1 0.01 0.1 1 10 100 0.1 0.01 0.1 1 10 100 Output power Po (mW) Output power Po (mW) 10 2006-04-19 TA2152FLG Po - VCC2 30 20 100 3 V application VCC1 = VCC2 50 f = 1 kHz RL = 16 30 20 Po - VCC (mW) Po 10 Output power Output power Po 1.5 V application VCC1 = 2.4 V f = 1 kHz RL = 16 0 1 1.5 2 2.5 (mW) 5 10 5 3 2 0 3 2 1 2 3 4 5 Supply voltage of power drive stage VCC2 (V) Supply voltage VCC (V) THD - Vo 100 1.5 V application 100 3 V application THD - Vo VCC1 = VCC2 = 2.4 V RL = 16 10 (%) VCC2 = 1.2 V 10 RL = 16 THD Total harmonic distortion 1 f = 10 kHz f = 100 Hz 0.1 f = 1 kHz 0.01 -60 Total harmonic distortion THD (%) 1 VCC1 = 2.4 V f = 10 kHz f = 100 Hz 0.1 f = 1 kHz -50 -40 -30 -20 -10 0 0.01 -60 -50 -40 -30 -20 -10 0 Output voltage Vo (dBV) Output voltage Vo (dBV) Vno - VCC2 -90 -90 Vno - VCC (dBV) Vno -100 OCL Vno (dBV) -100 OCL Output noise voltage C-Cup -110 1.5 V application VCC1 = 2.4 V -120 Rg = 600 Filter: IHF-A 0 1 1.5 2 2.5 Output noise voltage C-Cup -110 3 V application VCC1 = VCC2 -120 Rg = 600 Filter: IHF-A 0 1 2 3 4 5 Supply voltage of power drive stage VCC2 (V) Supply voltage VCC (V) 11 2006-04-19 TA2152FLG CT - VCC2 1.5 V application 0 VCC1 = 2.4 V f = 1 kHz 0 3 V application VCC1 = VCC2 f = 1 kHz CT - VCC CT (dB) CT (dB) OCL -20 -20 Cross talk Cross talk OCL -40 -40 C-Cup -60 -60 C-Cup 0 1 1.5 2 2.5 0 1 2 3 4 5 Supply voltage of power drive stage VCC2 (V) Supply voltage VCC (V) RR - VCC2 1.5 V application -40 fr = 100 Hz Vr = -20 dBV RR1: Inflow to VCC1 -60 RR2: Inflow to VCC2 RR2 (C-Cup) -40 3 V application fr = 100 Hz Vr = -20 dBV VCC1 = VCC2 -60 RR - VCC (dB) RR Ripple rejection ratio Ripple rejection ratio RR (dB) C-Cup -80 RR1 (OCL) RR1 (C-Cup) -80 -100 RR2 (OCL) 0 1 1.5 2 2.5 -100 OCL 0 1 2 3 4 5 Supply voltage of power drive stage VCC2 (V) Supply voltage VCC (V) VBEEP (OUT) - VBEEP (IN) 0 (dBV) VBEEP (OUT) Beep output voltage f = 400 Hz (rectangle wave) -10 R = 16 L -20 -30 -40 -50 -60 -70 -80 -90 -100 0.1 0.3 0.5 1 3 5 10 Beep input voltage VBEEP (IN) (Vp-p) 12 2006-04-19 TA2152FLG ICCQ - Ta (mA) 0.8 OCL: VCC2 current 15 VCC1 = 2.4 V VCC2 = 1.2 V GV, Po, THD - Ta (%) Total harmonic distortion THD 0.8 0.6 OCL: VCC1 current Voltage gain GV (dB) Output power Po (mW) ICCQ GV 10 Po 0.6 Quiescent supply current C-Cup: VCC1 current 0.4 0.4 C-Cup: VCC2 current 0.2 VCC1 = 2.4 V VCC2 = 1.2 V 0 -20 0 20 40 60 80 5 0.2 THD 0 -20 0 20 40 60 80 0 Ambient temperature Ta (C) Ambient temperature Ta (C) Vno, VBEEP (OUT) - Ta Output noise voltage Vno (dBV) Beep output voltage VBEEP (OUT) (dBV) -40 VCC1 = 2.4 V VCC2 = 1.2 V 0 VCC1 = 2.4 V VCC2 = 1.2 V CT - Ta -60 CT (dB) VBEEP (OUT) -20 OCL -40 -80 -100 Vno (OCL) Vno (C-Cup) Cross talk -60 C-Cup -120 -20 0 20 40 60 80 -80 -20 0 20 40 60 80 Ambient temperature Ta (C) Ambient temperature Ta (C) RR - Ta -20 VCC1 = 2.4 V VCC2 = 1.2 V -60 VCC1 = 2.4 V VCC2 = 1.2 V -80 ATT - Ta (dB) -40 Vr = -20 dBV RR1: Inflow to VCC1 RR2: Inflow to VCC2 RR2 (C-Cup) Ripple rejection ratio Muting attenuation -60 ATT (dB) fr = 100 Hz RR -100 OCL -120 C-Cup -140 -80 RR1 (OCL) RR1 (C-Cup) -100 RR2 (OCL) -20 0 20 40 60 80 -20 0 20 40 60 80 Ambient temperature Ta (C) Ambient temperature Ta (C) 13 2006-04-19 TA2152FLG Application Circuit1 (1.5 V Output Coupling Type) VCC1 VCC1 OFF PW SW 18 MUTE TC 19 0.47 F VCC1 22 F 20 OFF MUTE SW 17 BEEP IN 16 10 F BIAS OUT ON ON 15 14 GND 13 C-AMP SW RF IN 2.2 F 12 BIAS IN 4.7 F 11 OUT ADJ 10 3 V application : Open PW/MUTE SW BEEP C-AMP SW BIAS 1 F INB 21 1 F INA 22 NC 9 VCC2 22 F 23 BEEP OUTA 24 PW A PW C PW B NC 8 BEEP OUTB 7 1 OUTA 2 EQA 3 PW GND 4 OUTC 5 EQB 6 OUTB 220 F 220 F 0.22 F 0.22 F RL RL 14 2006-04-19 TA2152FLG Application Circuit2 (1.5 V OCL Type) VCC1 VCC1 OFF PW SW 18 MUTE TC 19 0.47 F VCC1 20 22 F OFF MUTE SW 17 BEEP IN 16 10 F BIAS OUT ON ON 15 14 GND 13 C-AMP SW RF IN 12 BIAS IN 4.7 F 11 OUT ADJ 10 3 V application : Open PW/MUTE SW BEEP C-AMP SW BIAS 1 F INB 21 1 F INA 22 NC 9 VCC2 22 F 23 BEEP OUTA 24 PW A PW C PW B NC 8 BEEP OUTB 7 1 OUTA 2 EQA 3 PW GND 4 OUTC 5 EQB 6 OUTB RL RL 15 2006-04-19 TA2152FLG Markings Markings (example) *1 *1 9 *2 0 *1 Product name: 2152 *2 Weekly code: 9 0 1 K A Toshiba internal management code Weekly code Year (last digit only) A K 1 Orientation marking *2 Precautions when using QON Package outline (Upper surface) (lower surface) Please take into account the following points regarding the QON package (1) Do not attempt to strengthen the device mechanically by performing soldering on the island sections at the four corners of the package (the sections illustrated by diagonal lines) on the diagram of the lower surface. This island sections on the package surfaces (the sections illustrated by diagonal lines on the upper and lower surface diagrams) must be electrically insulated. *1: Ensure that the island sections on the lower surface (as indicated by the diagonal lines on the diagram) do not come into contact with solder from via holes in the board. * When mounting or soldering, take care to ensure that neither static electricity nor electrical overstress is applied to the IC (by taking measures to prevent antistatic, leaks etc.). * When incorporating the device into an item of equipment employ a set design which does not result in voltage being applied directly to the island section. (2) 16 2006-04-19 TA2152FLG Package Dimensions Weight: 0.05 g (typ.) 17 2006-04-19 TA2152FLG RESTRICTIONS ON PRODUCT USE * The information contained herein is subject to change without notice. 021023_D 060116EBA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C * The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E About solderability, following conditions were confirmed * Solderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux 18 2006-04-19 |
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