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STPS340
Power Schottky rectifier
Main product characteristics
K
IF(AV) VRRM Tj (max) VF (max)
3A
A
40 V 150 C 0.57 V
A
NC
DPAK STPS340B
A
Features and Benefits

Very small conduction losses Negligible switching losses Low forward voltage drop Low thermal resistance Extremely fast switching Surface mounted device Avalanche capability specified
K
K
SMB STPS340U
SMC STPS340S
A
K
Description
Single chip Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in DPAK, SMC, SMB, and low profile SMB, this device is intended for use in low and medium voltage operation, high frequency inverters, free wheeling and polarity protection applications where low switching losses are required. SMB flat STPS340UF
Order codes
Part Number STPS340U STPS340S STPS340B STPS340B-TR STPS340UF Marking U34 S34 S340 S340 FU34
February 2007
Rev 9
1/11
www.st.com 11
Characteristics
STPS340
1
Characteristics
Table 1.
Symbol VRRM IF(RMS)
Absolute Ratings (limiting values)
Parameter Repetitive peak reverse voltage RMS forward current Tc = 135 C = 0.5 DPAK DPAK SMB/SMC SMB flat 75 1300 -65 to + 150
(1)
Value 40 6
Unit V A
IF(AV)
Average forward current
TL = 105 C = 0.5 TL = 115 C = 0.5
3
A
IFSM PARM Tstg Tj
1.
dPtot --------------dTj
Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Operating junction temperature <
1 ------------------------Rth ( j - a )
tp =10 ms sinusoidal tp = 1 s Tj = 25 C
A W C C
150
condition to avoid thermal runaway for a diode on its own heatsink
Table 2.
Symbol
Thermal resistance
Parameter SMB Value 25 15 20 5.5 C/W C/W Unit
Rth(j-l)
Junction to lead
SMB flat SMC
Rth(j-c)
Junction to case
DPAK
Table 3.
Symbol IR(1)
Static electrical characteristics
Parameter Reverse leakage current Test Conditions Tj = 25 C Tj = 125 C Tj = 25 C VR = VRRM Min. Typ. Max. 20 2 10 0.63 IF = 3 A 0.52 0.57 V 0.84 IF = 6 A 0.63 0.72 Unit A mA
VF(1)
Forward voltage drop
Tj = 125 C Tj = 25 C Tj = 125 C
1. Pulse test: tp = 380 s, < 2%
To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.050 IF2(RMS)
2/11
STPS340
Characteristics
Figure 1.
Average forward power dissipation Figure 2. versus average forward current (per diode)
IF(AV)(A)
3.5
Average forward current versus ambient temperature ( = 0.5, per diode) (DPAK / SMB / SMC)
PF(AV)(W)
2.5
= 0.05
2.0
= 0.1
= 0.2
= 0.5
3.0
Rth(j-a)=Rth(j-l)
DPAK
=1
1.5
2.5
SMB / SMC
2.0 1.5 1.0
Rth(j-a)=65C/W
1.0
0.5
T
0.5
T
IF(AV)(A)
0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0
=tp/T
3.5
tp
0.0 4.0 0
=tp/T
25
tp
50
Tamb(C)
75 100 125 150
Figure 3.
Average forward current versus ambient temperature ( = 0.5, per diode) (SMB flat)
Figure 4.
Non repetitive surge peak forward current versus overload duration (maximum values) (DPAK)
IF(AV)(A)
3.5
Rth(j-a)=Rth(j-l)
IM(A)
60
DPAK
3.0 2.5
50
40 2.0
SMB flat
30
Tc=25C Tc=75C
1.5 1.0
Rth(j-a)=40C/W . SCU=2.5 cm2
20
IM t
T
0.5 0.0 0 10
Tc=125C
=tp/T
25
tp
50
Tamb(C)
0 75 100 125 150 1.E-03
=0.5
t(s)
1.E-02 1.E-01 1.E+00
Figure 5.
Non repetitive surge peak forward current versus overload duration (maximum values) (SMB)
SMB
Figure 6.
Non repetitive surge peak forward current versus overload duration (maximum values) (SMC)
SMC
IM(A)
10 9 8 7
Ta=25C
IM(A)
12 11 10 9 8 7 6
Ta=75C Ta=75C Ta=25C
6 5 4 3 2 1 0 1.E-03 1.E-02 1.E-01 1.E+00
IM t
5 4 3
Ta=125C
2
=0.5
IM t
Ta=125C
t(s)
1 0 1.E-03
=0.5
t(s)
1.E-02 1.E-01 1.E+00
3/11
Characteristics
STPS340
Figure 7.
Non repetitive surge peak forward current versus overload duration (maximum values) SMB flat
SMB flat
Figure 8.
Normalized avalanche power derating versus pulse duration
IM(A)
25
PARM(tp) PARM(1s)
1
20
15
TL=25C
0.1
TL=75C
10
0.01
TL=125C
5
IM t
=0.5
t(s)
1.E-02 1.E-01 1.E+00
0.001 0.01 0.1 1
tp(s)
10 100 1000
0 1.E-03
Figure 9.
Normalized avalanche power derating versus junction temperature
Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration (DPAK)
Zth(j-a)/Rth(j-a)
1.0 0.9 0.8
DPAK
PARM(tp) PARM(25C)
1.2 1
0.7 0.8 0.6 0.4 0.2 0.6 0.5 0.4 0.3 0.2
Single pulse
T
Tj(C)
0 25 50 75 100 125 150
0.1 0.0 1.E-03 1.E-02
tp(s)
1.E-01
=tp/T
tp
1.E+00
Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB)
Zth(j-a)/Rth(j-a)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2
Single pulse
Figure 12. Relative variation of thermal impedance junction to ambient versus pulse duration (SMC)
Zth(j-a)/Rth(j-a)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3
SMC
SMB
T
0.2
Single pulse
T
0.1 0.0 1.E-02 1.E-01 1.E+00
tp(s)
1.E+01
0.1
=tp/T
1.E+02
tp
1.E+03
tp(s)
1.E-01 1.E+00 1.E+01
0.0 1.E-02
=tp/T
1.E+02
tp
1.E+03
4/11
STPS340
Characteristics
Figure 13. Relative variation of thermal impedance junction to lead versus pulse duration - SMB flat
Zth(j-l)/Rth(j-l)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3
SMB flat
Figure 14. Reverse leakage current versus reverse voltage applied (typical values)
IR(mA)
1.E+01
Tj=150C
1.E+00
Tj=125C Tj=100C
1.E-01
Tj=75C
1.E-02
Tj=25C
0.2
Single pulse
1.E-03
0.1 0.0 1.E-04 1.E-03 1.E-02
tp(s)
1.E-04
1.E-01 1.E+00 1.E+01
VR(V)
0 5 10 15 20 25 30 35 40
Figure 15. Junction capacitance versus reverse voltage applied (typical values)
C(pF)
1000
F=1MHz VOSC=30mVRMS Tj=25C
Figure 16. Forward voltage drop versus forward current
IFM(A)
10
Tj=125C (Maximum values)
1
100
Tj=125C (Typical values)
0
Tj=25C (Maximum values)
VR(V)
10 1 10 100
VFM(V)
0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU = 35 m) (DPAK)
Rth(j-a)(C/W)
100 90 80 70 60 50
DPAK
Figure 18. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU = 35 m) (SMB / SMC)
Rth(j-a)(C/W)
110 100 90 80 70 60 50
SMB / SMC
40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
40 30 20
SCU(cm)
10 0 0.0 0.5 1.0 1.5 2.0
SCU(cm)
2.5 3.0 3.5 4.0 4.5 5.0
5/11
Package Information
STPS340
Figure 19. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU = 35 m) (SMB flat)
Rth(j-a)(C/W)
110 100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMB flat
SCU(cm)
2
Package Information

Band indicates cathode on SMB and SMC Epoxy meets UL94, V0 DPAK dimensions
Dimensions Ref Millimeters Min. A
E B2 C2 L2 A
Table 4.
Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397
Max. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10
2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35
A1 A2 B
D
B2 C C2
H L4 B G A1
R
R C
D E
A2 0.60 MIN.
G H
V2
L2 L4 V2
0.80 typ. 0.60 0 1.00 8
0.031 typ. 0.023 0 0.039 8
6/11
STPS340 Figure 20. DPAK footprint dimensions (in millimeters)
6.7 3 3 1.6
Package Information
2.3 6.7 2.3
1.6
Table 5.
SMB dimensions
Dimensions Ref.
E1
Millimeters Min. Max. 2.45 0.20 2.20 0.40 5.60 4.60 3.95 1.50
Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.059
D
A1 A2 b
1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75
E
c
A1
E E1
b
C L
A2
D L
Figure 21. SMB footprint (dimensions in mm)
1.62 2.60 1.62
2.18
5.84
7/11
Package Information Table 6. SMB Flat dimensions
Dimensions Ref.
A c D L L2 E E1 L L1 b
STPS340
Millimeters Min. Typ. Max. Min. 0.035 0.077 0.006 0.130 0.200 0.189 0.029
Inches Typ. Max. 0.043 0.087 0.016 0.156 0.220 0.181 0.059 0.016 0.024
A b(1) c
(1)
0.90 1.95 0.15 3.30 5.10 4.05 0.75 0.40 0.60
1.10 2.20 0.40 3.95 5.60 4.60 1.50
D E E1 L L1 L2
1. Applies to plated leads
Figure 22. SMB Flat footprint (dimensions in mm)
5.84
2.07
1.20
3.44
1.20
8/11
STPS340 Table 7. SMC package mechanical data
Package Information
Dimensions Ref
E1
Millimeters Min. Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.40
Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063
A1
D
1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75
A2 b
E
c E
A1
E1
C A2 E2 L b
E2 D L
Figure 23. Foot print dimensions (in millimeters)
1.54 5.03 1.54
3.15
8.11
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
9/11
Ordering information
STPS340
3
Ordering information
Ordering type STPS340U STPS340S STPS340B S340 STPS340B-TR STPS340UF FU34 SMB flat 0.50 g DPAK 0.30 g 2500 5000 Tape and reel Tape and reel Marking U34 S34 Package SMB SMC Weight 0.107 g 0.243 g Base qty 2500 Tape and reel 2500 75 Tube Delivery mode
4
Revision history
Date Jul-2003 Feb-2005 08-Feb-2007 Revision 7B 8 9 Last update. Layout update. No content change. Reformatted to current standard. Added ECOPACK statement. Added SMB flat package. Description of Changes
10/11
STPS340
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