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| MICROWAVE POWER GaAs FET MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES TIM7179-8UL HIGH POWER P1dB=39.5dBm at 7.1GHz to 7.9GHz HIGH GAIN G1dB= 9.0dB at 7.1GHz to 7.9GHz BROAD BAND INTERNALLY MATCHED HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS ( Ta= 25C ) CHARACTERISTICS Output Power at 1dB Compression Point Power Gain at 1dB Compression Point Drain Current Gain Flatness Power Added Efficiency 3rd Order Intermodulation Distortion Drain Current Channel Temperature Rise IDS2 Tch IDS1 G G1dB VDS= 10V dB A dB % Two Tone Test Po= 28.5dBm (Single Carrier Level) SYMBOL P1dB CONDITION UNIT MIN. TYP. MAX. dBm 38.5 8.0 -44 39.5 9.0 2.2 35 -47 2.2 2.6 0.6 2.6 80 f = 7.1 - 7.9GHz add IM3 dBc A C VDS X IDS X Rth(c-c) ELECTRICAL CHARACTERISTICS ( Ta= 25C ) CHARACTERISTICS Transconductance Pinch-off Voltage Saturated Drain Current Gate-Source Breakdown Voltage Thermal Resistance SYMBOL gm VGSoff IDSS VGSO CONDITION VDS= 3V IDS= 3.0A VDS= 3V IDS= 30mA VDS= 3V VGS= 0V IGS= -100A UNIT MIN. TYP. MAX. mS 1800 V A V C/W -1.0 -5 -2.5 5.2 2.5 -4.0 7.0 3.5 Rth(c-c) Channel to Case The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use, No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA before proceeding with design of equipment incorporating this product. Apr. 2000 TIM7179-8UL ABSOLUTE MAXIMUM RATINGS CHARACTERISTICS Drain-Source Voltage Gate-Source Voltage Drain Current Total Power Dissipation (Tc= 25 C) Channel Temperature Storage ( Ta= 25C ) SYMBOL VDS VGS IDS PT Tch Tstg UNIT V V A W C C RATING 15 -5 7.0 37.5 175 -65 +175 PACKAGE OUTLINE (2-11D1B) 0.60.15 4-C1.2 4.0 MIN. Unit in mm Gate Source Drain 12.90.2 3.20.3 170.3 210.2 11.0 MAX. +0.1 0.1 -0.05 HANDLING PRECAUTIONS FOR PACKAGED TYPE Soldering iron should be grounded and the operating time should not exceed 10 seconds at 260C. 2 1.60.3 2.60.3 12 0.2 MAX. 5.0 MAX. 4.0 MIN. TIM7179-8UL RF PERFORMANCES Output Power vs. Frequency 42 41 Po (dBm) 40 39 38 37 6.8 7 7.2 7.4 7.6 7.8 8 8.2 VDS= 10V IDS 2.2A Pin= 30.5dBm Frequency (GHz) Output Power vs. Input Power 42 41 40 39 Po (dBm) 38 37 36 35 34 33 24 f= 7.5GHz VDS= 10V IDS 2.2A 90 Po 80 70 60 50 add (%) add 40 30 20 10 0 26 28 30 Pin (dB m) 32 34 3 TIM7179-8UL POWER DISSIPATION vs. CASE TEMPERATURE 50 40 30 PT (W) 20 10 0 0 40 80 Tc () 120 160 200 IM3 vs. OUTPUT POWER CHARACTERISTICS -20 VDS= 10V IDS 2.2A f= 7.5GHz f= 5MHz -30 IM 3 (dBc) -40 -50 -60 24 26 28 30 32 34 Po(dBm), Single Carrier Level 4 |
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