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| TD62S011AFM TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62S011AFM 1-Channel Sink-Current Driver The TD62011AFM is a 1-channel noninverting sink-current driver with a PNP transistor at the first stage and a NPN transistor at the second stage. The driver incorporates output clamp diodes used to clamp the counter electromotive force which is generated when driving an inductive load. Because the driver operates by source input current, it is optimal for interfacing with sink-current driven general-purpose CMOS logic ICs and microprocessors. Also it is optimal for driving relays and LEDs. When using the driver, pay attention to the thermal conditions Features * * * * * * Ultra-small HSON6 package with heat sink on rear High output withstandard voltage: VCE (SUS) = 50 V (min) Large output current: IOUT = 100 mA (max) Built-in input resistor: RIN = 14 k Input signal: Low Level Active Built-in output clamp diodes Weight: 0.017 g (typ.) Pin Connection (top view) Basic Circuit Diagram VCC OUTPUT 1 6 INPUT INPUT 10 kW 20 k9 COMMON 20 k9 1 k9 OUTPUT COMMON VCC 2 5 P-GND 3 4 GND P-GND GND Note 1: Diodes shown using dotted lines are parasitic. Do not use them. Note 2: When using the driver, connect the P-GND pin to the GND pin. Note 3: When using the driver, connect the P-GND pin to the heat sink on the rear of the package. 1 2001-12-05 TD62S011AFM Maximum Ratings (Ta = 25C) Characteristics Supply voltage Collector-emitter voltage Output withstand voltage Output current Input voltage Input current Clamp diode reverse voltage Clamp diode forward current Power dissipation Symbol VCC VCEO VCE (SUS) IOUT VIN IIN VR IF PD (Note 4) Rth (j-a) (Note 4) Saturated thermal resistance Rth (j-c) (Note 5) Operating temperature Storage temperature Topr Tstg 25 -40~85 -55~150 C C Rating -0.5~7.0 50 50 100 -0.5~7.0 -10 50 100 0.78 160 C/W Unit V V V mA V mA V mA W Note 4: 114.3 76.2 1.6 mm glass epoxy film substrate Note 5: When an infinite heat sink is mounted. Cu heat dissipation pattern 100 mm 2 Recommended Operating Condition (Ta = -40~85C) Characteristics Supply voltage Output withstand voltage Output current Input voltage Clamp diode reverse voltage Clamp diode forward current Symbol VCC VCEO IOUT VIN VR IF Test Circuit 3/4 3/4 Test Condition Min 4.5 0 3/4 0 3/4 3/4 Typ. 5.0 Max 5.5 50 100 5.5 50 100 Unit V V mA V V mA 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 2 2001-12-05 TD62S011AFM Electrical Characteristics (Ta = 25C) Characteristics Output leakage current Symbol ICEX Test Circuit 1 Test Condition VCC = VIN = 5.5 V, VOUT = 50 V VCC = 4.5 V, VIN = 0 V, IOUT = 100 mA VCC = 4.5 V, VIN = 0 V, IOUT = 50 mA VCC = 5.5 V, VIN = 0.4 V VCC = 5.5 V, VIN = 5.5 V VCC = 4.5 V, IOUT = 100 mA VR = 50 V IF = 100 mA VCC = 5.5 V, VIN = 0 V VCC = 5.5 V, VIN = VCC VCC = 5 V, VOUT = 50 V, RL = 625 W, CL = 15 pF Min 3/4 3/4 3/4 3/4 3/4 3/4 Typ. 3/4 3/4 3/4 -0.44 Max 10 0.3 V 0.15 -0.63 -4.0 VCC - 3.7 10 1.3 6.0 100 mA mA V mA V mA mA ms Unit mA Output saturation voltage VCE (sat) 2 Output ON Input current Output OFF Input voltage Clamp diode leakage current Clamp diode forward voltage Power dissipation Turn-on delay Turn-off delay IIN (ON) IIN (OFF) VIN (ON) IR VF ICC (ON) ICC (OFF) tON tOFF 3 4 5 6 7 8 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 0.2 8.5 9 3/4 3/4 3/4 3/4 3 2001-12-05 TD62S011AFM Test Circuit 1. ICEX VCC OPEN VIN VCE VCE (sat) OPEN ICEX IIN 2. VCE (sat) VCC OPEN IOUT 3. IIN (ON) VCC IIN (ON) OPEN VIN OPEN 4. IIN (OFF) VCC IIN (OFF) OPEN IOUT 5. VIN (ON) VCC OPEN 6. IR VCC IR OPEN VR VIN (ON) VCE OPEN 7. VF VCC VF OPEN IOUT 8. ICC VCC OPEN ICC OPEN VIN OPEN 4 2001-12-05 TD62S011AFM 9. tON, tOFF tr INPUT VCC OPEN VOUT 90% INPUT Pulse generator (Note 6) OUTPUT CL = 15 pF (Note 7) 50% 10% 10% 90% 50% 0 tOFF VOH 90% OUTPUT 10% VOL tf 5V 50 ms tON Note 6: Pulse width 50 ms, Duty cycle 10% Output impedance 50 W, tr < 5 ns, tf < 10 ns = = Note 7: CL includes probe and jig capacitance. Caution on Application 1. The device does not include protectors such as an overcurrent protector and an overvoltage protector. Applying excessive current or voltage may damage the device. Thus, design with great care to prevent excessive current or voltage from being applied to the device. The device may also be damaged by short-circuits between outputs and power supply/ground. Take care when designing output, VCC and GND line. 2. Be sure to mount the device in the correct orientation. Make sure that the positive and negative power supply pins are connected the right way round. Otherwise, the absolute maximum current and power dissipation ratings may be exceeded and the device may break down or undergo performance degradation, causing it to catch fire or explode, and resulting in injury. 5 2001-12-05 TD62S011AFM Package Dimensions Weight: 0.017 g (typ.) 6 2001-12-05 TD62S011AFM Preliminary land pattern 1.6 0.7 0.25 1.6 1.3 0.7 0.6 2.2 0.6 Unit : mm 10 mm Preliminary PCB trace dimension 0.7 5 mm 7 2001-12-05 TD62S011AFM RESTRICTIONS ON PRODUCT USE 000707EBA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice. 8 2001-12-05 |
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