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TA G - 1 0 3 0
5.725 to 5.825 GHz GaAs MMIC U-NII Band Power Amplifier
re F e a t u re s :
25 dBm Minimum Linear Output Power 20 dB Small Signal Gain 35 dBm 3rd Order Intercept Point Surface Mount Thermally Efficient Moly-Copper Package
ISO 9001 CERTIFIED
Product Description
The TAG-1030 GaAs MMIC power amplifier is designed to operate in the ETSI approved Unlicensed band of 5.725 to 5.825 GHz. It provides a minimum of 20 dB gain, a minimum of +25 dBm linear output power when measured at 1 dB GCP and has an IP3 of +35 dBm. It is housed in a thermally efficient moly-copper surface mount package and is capable , of performing within typical commercial system operating temperature ranges. Electrical Specifications (All Specifications at 25oC, Vd = +7.0V, Id = 500 to 700 mA)
Pa ra m e te r Small Signal Gain Input Return Loss Reverse Isolation Sym bol S 21 S 11 S 12 Fre que ncy 5.7 to 5.9 GHz 5.7 to 5.9 GHz 5.7 to 5.9 GHz 5.7 GHz 5.8 GHz 5.9 GHz 5.7 to 5.9 GHz Min 20.0 25.0 25.0 25.0 Ma x Typica l 23.0 -10.0 52.0 26.0 26.3 26.8 -0.045 Units dB dB dB dBm dBm dBm dB/ o C
Output Power @ 1dB Gain Compression P -1dB Temperature Coefficient of Gain S 21
Typical Small Signal Gain and Input Return Loss
Gain / Return Loss (dB) 30 20 10 0 -10 -20 5.70 5.75 5.80 Frequency (GHz) 5.85 5.90 Gain Return
Typical Output Power
30 29 28 27 26 25 24 23 22 5.70 Output Power (dBm)
P-1dB Psat
5.75
5.80
5.85
5.90
5.95
Frequency (GHz)
www.teledynewireless.com email: amplifiers@teledyne.com
10/2001
1274 Terra Bella Avenue, Mountain View, CA 94043
*
Tel: 800-832-6869
*
Fax: (650) 962-6845
7
TAG-1030
5.725 to 5.825 GHz GaAs MMIC Power Amplifier for U-NII Applications
Package Outline
Pin 3: RF Input Pin 5: Vg Pin 8: RF Output Pin 10:Vd
RF Input (50 ohms)
Input
T ypical Biasing Configuration
10 PACKAGED AMPLIFIER 470 pF Vd Bypass (1F Typical) 8 RF Output (50 ohms)
PIN 1
10
3
GaAs MMIC 470 pF
3
8
5
PIN 6
Vg Bypass (1F Typical)
5
Tolerance: .XXX 0.005
External Components Required: Bypass Capacitors: 1 F, typical 50 Ohm microsrtip interface
Evaluation Circuit
Evaluation Board
GND
GND 1 2 3 10
Vdd C2 1.0 f
GND 9 8 7 6 GND GND 1.0 f
GND
TAG-1030
RF IN
50 OHM LINE
4 5 GND
50 OHM LINE
RF OUT
C1
GND
V6
Notes 1. Dual bias supply required. 2. 3. 4. 5. 6. 7. 8. 9. DC supply sequencing or protection circuitry not included. See Amplifier Biasing Procedure A 360 pF DC supply line decoupling capacitor is included on both Vd and Vg lines. (See typical biasing configuration shown above). The last fixture or circuit should incorporate additional bypass capacity (25ufd) on the drain and gate bias terminals to prevent oscillations caused by feedback signals. Supply (drain and gate) wire/leads should be as short as possible. Close placement of external components to the power amplifier is essential for stability purposes. TET recommends the unit be soldered to DC and RF ground for best results. Pin numbers indicated on outline drawing are for user information only. Units are not labeled with pin numbers. MASK drawing for circuit board available on the Teledyne Wireless website at www.teledynewireless.com.
Teledyne reserves the right to make changes without further notice to any specification herein. "Typical" parameters can and do vary.
www.teledynewireless.com email: amplifiers@teledyne.com
10/2001
1274 Terra Bella Avenue, Mountain View, CA 94043
*
Tel: 800-832-6869
*
Fax: (650) 962-6845
8


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