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| @Ob3/4EAeN/|--1/2q MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 EN/DECODER SAME Rosc in EN/DE S.O.DIP FEATURES \aO-z E Momentary DATA w suffix-M. E S.O.Package 18P w suffix-S. E Direct Data Transmit w suffix-H : switch to VDD. II|P@qy M1EA/DA 1/2sN1/2X / EN/DE BIT FORMAT "0" PROTOCOL TE DO TTT "1" VT D0~3 DATA APPLICATION ~AI E Security alarm, Remote control. 3/4stI , o|oEm . ELECTRICAL CHARACTERISTICS q(R)W(R)ae Characteristics u@qA Operating Voltage u@qy Operating Current ARAqy Quiescent Current AEqy Driving Current (R)AuAWvOscillator Frequency u@*Ax Operating Temperature Sym. VDD IOP ISB IOL FOSC Temp. Min. 2.4 w w w w Typ. w 0.1 1 2 76 25 Max. 13 1 10 w w 60 Unit V mA uA mA KHz J No load REMARKS @ VDS=1.2V ExternalO 30% -20 APPLICATION DIAGRAM N|OqoI M1EA VDD A0 A1 X A2 Y A3 A4 A5 A6 TE A11/D3 Rosc A3 A4 A5 A6 A7 VSS 1 18 DO IR / RF M1DA A0 A1 A2 1 18 VDD IR / RF VT X Rosc Y DIN A11/D3 A10/D2 A9/D1 9 10 A8/D0 A10/D2 A9/D1 9 10 A8/D0 A7 VSS * Rosc~M1EA : 270 K[ , M1DA : 270 K[ * All specs and applications shown above subject to change without prior notice. ( HWqoIW(R)aeENN|O ,1/2qow|ae-x) 1/3 2004-07-15 @Ob3/4EAeN/|--1/2q MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 EN/DECODER SAME Rosc in EN/DE S.O.DIP APPLICATION DIAGRAM N|OqoI CHIP FORM II|P@qy M1EA/DA 1/2sN1/2X / EN/DE A0 A1 A2 A3 VDD IR / RF DO X Rosc A4 A5 A6 A7 1.80 X1.81 mm 2 (c) =VDD M1EA Y TE D3 VSS D0 D1 D2 A1 A0 VDD VT Rosc X A2 A3 A4 A5 Y M1DA DIN 2 IR / RF 2.60 X 2.60 mm (c) =VDD D3 A6 A7 VSS D0 D1 D2 * Rosc~M1EA : 270 K[ , M1DA : 270 K[ * All specs and applications shown above subject to change without prior notice. ( HWqoIW(R)aeENN|O ,1/2qow|ae-x) 2/3 2004-07-15 @Ob3/4EAeN/|--1/2q MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 EN/DECODER SAME Rosc in EN/DE S.O.DIP PAD ASSIGNMENT & POSITION II|P@qy M1EA/DA 1/2sN1/2X / EN/DE M1EAG 5 4 3 2 1 No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 NAME A10 / D2 A11 / D3 TEB Y X DOUT VDD A0 A1 A2 A3 A4 A5 A6 A7 VSS A8 / D0 A9 / D1 X 728 528 211 -31.5 -728.5 -728.5 -728.5 -728.5 -728.5 -728.5 -480.5 -101 184 480 728 728 728 728 UNIT : um Y 732.5 732.5 732.5 732.5 732.5 376.5 36 -164 -533 -733 -733 -733 -733 -733 -733 -66 183 431.5 6 Y 18 17 7 8 ( 0,0 ) X 16 9 10 11 12 13 14 15 M1DAG 5 6 18 7 8 Y 4 3 2 1 No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 NAME X VT VDD A0 A1 A2 A3 A4 A5 A6 A7 VSS A8 / D0 A9 / D1 A10 / D2 A11 / D3 DIN Y X 259.5 -9.5 -347 -547 -950 -1150 -1150 -1150 -1150 -1043 -799.5 -599.5 -251 169 696 1145.5 1086 1086 UNIT : um Y 1096.5 1096.5 1096.5 1096.5 1096.5 1025 702 502 179 -1100 -1100 -1100 -1100 -1100 -1100 -946 590 790 17 9 X ( 0,0 ) 16 10 11 12 13 14 15 * M1EA CHIP SIZE ~ 1.80 X 1.81 mm2 * M1DA CHIP SIZE ~ 2.60 X 2.60 mm2 * IC substrate should be connected to VDD in PCB (PCB WIC * VDD) 3/3 2004-07-15 |
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