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| 1.6x0.8mm SMD CHIP LED LAMP KP-1608SECK SUPER BRIGHT ORANGE Features !1.6mmx0.8mm !LOW !WIDE !IDEAL Description SMT LED, 1.1mm THICKNESS. The Super Bright Orange source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. POWER CONSUMPTION. VIEWING ANGLE. FOR BACKLIGHT AND INDICATOR. COLORS AND LENS TYPES AVAILABLE. : 2000PCS / REEL. !VARIOUS !PACKAGE Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: KDA0022 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: FEB/23/2002 DRAWN: J.X.FU PAGE: 1 OF 4 Selection Guide Par t No . Di c e L en s Ty p e Iv (mc d ) @ 20 mA Min . KP-1608SECK SUPER BRIGHT ORANGE( InGaAlP ) WATER CLEAR 50 Ty p . 160 View in g An g l e 21/2 120 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C Sy m b o l peak D 1/2 C VF IR Par ameter Peak Wavelength Dominate Wavelength Spectral Line Halfwidth Capacitance Forward Voltage Reverse Current Dev ic e Super Bright Orange Super Bright Orange Super Bright Orange Super Bright Orange Super Bright Orange Super Bright Orange Ty p . 610 601 29 15 2.1 2.5 10 Max . Un i t s nm nm nm pF V uA Tes t Co n d itio n s IF=20mA IF=20mA IF=20mA VF=0V;f=1MHz IF=20mA VR = 5V Absolute Maximum Ratings at T)=25C Par ameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating Temperature Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Su p er B r ig h t Or an g e 75 30 195 5 -40C To +85C -40C To +85C Un i t s mW mA mA V SPEC NO: KDA0022 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: FEB/23/2002 DRAWN: J.X.FU PAGE: 2 OF 4 Super Bright Orange KP-1608SECK SPEC NO: KDA0022 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: FEB/23/2002 DRAWN: J.X.FU PAGE: 3 OF 4 KP-1608SECK SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: KDA0022 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: FEB/23/2002 DRAWN: J.X.FU PAGE: 4 OF 4 |
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