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ILC7071
100mA SOT-23-5 Low Noise CMOS RF-LDOTM Regulator
Features
* * * * * * * *
1% output voltage accuracy Low noise Only 90A ground current at 100mA load Ripple rejection up to 75 dB at 1kHz Excellent line and load transient response Guaranteed to 100mA output current Industry standard five lead SOT-23 packages Fixed 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 2.9V, 3.0V, 3.1V, 3.3V and custom output voltage options
General Description
The ILC7071 is an 100mA, Low Noise, Low Dropout (LDO) linear regulator, designed and processed in CMOS technology. This process combines the best CMOS features of low quiescent current, small size and low dropout voltage with the best bipolar features of high ripple rejection, low noise and power handling capability. The ILC7071 offers a quiescent current of less than 100A, a logic level enable (regulator EN) pin, the size of the industry standard SOT-23 and a low dropout voltage of 25mV at 10mA. With better than 70 dB (1kHz) of ripple rejection, low noise of 40 VRMS and 1% output voltage accuracy, the ILC7071 is ideally suited for communications and personal electronics applications.
Applications
* * * *
Cellular phones Wireless communicators PDAs/palmtops/organizers Battery powered portable electronics
Block Diagram
VIN
Error Amplifier Voltage Reference
Transconductance Amplifier
CN
+ VOUT -
EN
Thermal Shut Down GND
Figure 1.
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ILC7071
PRODUCT SPECIFICATION
Test circuit
VIN VIN CIN EN GND CN CN VOUT COUT RL
Figure 2.
Pin Configuration
VOUT
5
CN
4
ILC7071
1 2 3
VIN GND EN SOT-23-5
Figure 3.
Pin Definition
Pin Number 1 2 3 4 5 Pin Name VIN GND EN CN VOUT Supply voltage input Ground of the IC Enable input. High level enables VOUT while Low level commands shutdown mode and discharge COUT to GND Optional noise bypass capacitor Voltage output. Regulated output voltage Pin Function Description
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PRODUCT SPECIFICATION
ILC7071
Absolute Maximum Ratings
Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Parameter Supply Voltage: EN Input Voltage Output Voltage Junction Temperature (TJ ) Storage Temperature Lead Soldering Temperature, 10 seconds Power Dissipation (PD) -40 -0.3 -0.3 Min. Max. 10 VIN + 0.3 VIN + 0.3 125, Internally limited 150 300 150 Units V V V C C C mW
Recommended Operating Conditions
Parameter Supply Voltage VDD Peak Output Current Ambient Operating Temperature Conditions VIN to GND IOUT to GND, tpw=2mS TA -40 Min. VOUT+VDO Typ. VOUT+1 Max. VOUT+4 150 85 Units V mA C
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ILC7071
PRODUCT SPECIFICATION
Electrical Specifications
VIN=VOUT+1V, IOUT=1mA, VEN=2V and TA = +25C using circuit in Figure 2 with CIN=COUT=1F, CN=0, unless otherwise specified Parameter Output Voltage Ground pin Current Line Regulation Symbol VOUT IGND VOUT/ VOUT/ VIN VOUT/ VOUT VDO IOUT = 10mA IOUT = 100mA VOUT + 2V VIN VOUT + 1V IOUT=1 to 100mA IOUT = 10mA, VOUT > 2.8V IOUT = 20mA, VOUT > 2.8V IOUT = 100mA, VOUT > 2.8V Shutdown (OFF) current EN Input Voltage EN Input Current Output Noise Voltage IOFF VEN IEN eN VEN = 0 High = ON state Low = OFF state VEN = 0.6V VEN = 2V BW = 300Hz to 50kHz CIN = COUT = 2.2uF IOUT = 10mA, CN = 10nF COUT = 4.7uF, f = 120Hz IOUT = 80mA VIN = 1V,IOUT = 10mA, tr/tf = 2uS VEN = 0 2 0.6 0.3 1 40 V RMS dB mV mV k A Conditions Min. 0.99 VOUTnom Typ. VOUT nom 70 90 0.017 Max. 1.01 VOUTnom 90 110 0.075 %/V Units V A
Load Regulation Dropout Voltage. Notes 1and 2
0.15 25 50 275 10
0.25 30 60 320 40
% mV
nA V
Ripple Rejection Dynamic Line Regulation
PSRR VOUT(line)
65 10 20 1.5
Dynamic Load Regulation VOUT(load) IOUT = 100mA, tr < 5S Resistance Discharge in OFF state RDISC
Notes: 1. For 2.5V < VOUT < 2.8V refer to diagram "Dropout Voltage vs.Output Voltage". 2. Dropout Voltage is defined as the input to output differential voltage at which the output voltage drops 2% below the nominal value measured with 1V differential.
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PRODUCT SPECIFICATION
ILC7071
Typical Applications Diagrams
Short Circuit Thermal Protection VIN = VOUTnom+1V Output to GND Load Transient Response VIN = VOUT+1V, CN=0
IOUT (0 to 100mA) IOUT (0.5A/div) VOUT(AC)
Line Transient Response VIN = VOUT+1V to VOUT+2V Load=10mA, COUT=2.2F
ON/OFF Transient Response Load=80mA, COUT=1F, CN=0
VIN
VEN
VOUT(AC) VOUT
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ILC7071
PRODUCT SPECIFICATION
ON/OFF Transient Response Load=10mA, COUT=1F CN=10nF
ON/OFF Transient Response Load=10mA, COUT=1F, CN=0
VEN
VEN
VOUT
VOUT
Ground Current
120 110 100 90 80 70 60 50 40 30 20 10 0 0 1 2 3 4 80mA Load
500 450 400 350 300 250 200 150 100 50 0 2.5 Maximum VDO(mV)
Dropout Voltage vs. Output Voltage
Ground Current (A)
100mA
No Load
10mA
2.75
3
3.25
3.5
3.75 VOUT (V)
4
4.25
4.5
4.75
5
5
6
7
8
Input Voltage (V)
Output Voltage
2.830 2.825 2.820 2.815 2.810 2.805 -40 -20 0 20 40 60 80 300 1mA Load
Dropout Voltage
Dropout Voltage (mV)
Output Voltage (V)
250 200 150 100 50 0 0 20 40 60 80 100 -40C 25C 85C
80mA Load
Temperature (C)
Load Current (mA)
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PRODUCT SPECIFICATION
ILC7071
Ripple Rejection Load=10mA, COUT=4.7F
Ripple Rejection Load=80mA, COUT=4.7F
Spectral Noise Density and Output Voltage Noise CIN=COUT=2.2F, CN=10nF, VIN=VOUT+1V, IOUT=10mA
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ILC7071
PRODUCT SPECIFICATION
Application Information
Capacitor Selection
In general, ceramic capacitors are preferred due to their superior ESR performance. Those with X5R dielectric offer the best temperature coefficient. An input capacitor of 1F or greater, connected between Input and Ground, located in close proximity to the device will improve the transient response and the noise rejection. An output capacitor of at least 1F is required to maintain regulator loop stability. Stable operation will be achieved with a wide variety of capacitors with ESR ranging from 10m to 10. An optional capacitor connected between the CN pin and ground can significantly reduce noise on the output.Values ranging up to 10nF can be used, depending upon the sensitivity to output noise in the application. Care should be taken to prevent noise from external sources to enter into the CN pin, which is a very sensitive, high impedance pin. Leakage currents into this pin will directly affect the regulator accuracy and should be kept as low as possible.
Thermal Characteristics
The ILC7071 is designed to supply up to 100mA at the specified output voltage with an operating die (junction) temperature of up to 125 C. While the power dissipation is calculated from known electrical parameters, the thermal resistance is a result of the thermal characteristics of the compact SOT-23-5 surface-mount package and the surrounding PC Board copper to which it is mounted. The relationship describing the thermal behavior of the package is:
T J ( max ) - T A P D ( max ) = ------------------------------- JA
where TJ(max) is the maximum allowable junction temperature of the die, which is 125 C, and TA is the ambient operating temperature. JA is dependent on the surrounding PC board layout and can be empirically obtained. While the JC (junction-to-case) of the SOT-23-5 package is specified at 130 C/W, the JA of the minimum PWB footprint will be at least 235 C/W. This can be improved upon by providing a heat sink of surrounding copper ground on the PCB. Depending on the size of the copper area, the resulting JA can range from approximately 180 C/W for one square inch, to nearly 130 C/W for 4 square inches. The addition of backside copper with through-holes, stiffeners, and other enhancements can also aid in reducing this value. The heat contributed by the dissipation of other devices located nearby must be included in design considerations. Once the limiting parameters in the thermal relationship have been determined, the electrical design should be verified to ensure that the device remains within specified operating conditions. If overload conditions are not considered, it is possible for the device to enter a thermal cycling loop, in which the circuit enters a shutdown condition, cools, reenables, and then again overheats and shuts down repeatedly due to an unmanaged fault condition.
Control Functions Enable Pin
Applying a voltage of 0.6V or less at the Enable pin will disable the output, reducing the quiescent output current to less than 1A, while a voltage of 2V or greater will enable the device. If this shutdown function is not needed, the pin can simply be connected to the VIN pin. Allowing this pin to float will cause erratic operation.
Thermal Protection
The ILC7071 is designed to supply high peak output currents for brief periods, however this output load will cause the device temperature to increase and exceed maximum ratings due to power dissipation. During output overload conditions, when the die temperature exceeds the shutdown limit temperature of 125 C, onboard thermal protection will disable the output until the temperature drops below this limit,at which point the output is then re-enabled. During a thermal shutdown situation the user may assert the power-down function at the Enable pin, reducing power consumption to the minimum level.
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PRODUCT SPECIFICATION
ILC7071
General PCB Layout Considerations
To achieve the full performance of the device, careful circuit layout and grounding technique must be observed. Establishing a small local ground, to which the GND pin, the output and bypass capacitors are connected, is recommended, while the input capacitor should be grounded to the main ground plane. The quiet local ground is then routed back to the main ground plane using feedthrough vias. In general, the high frequency compensation components (input, bypass, and output capacitors) should be located as close to the device as possible.
The proximity of the output capacitor is especially important to achieve optimal noise compensation from the onboard error amplifier, especially during high load conditions. A large copper area in the local ground will provide the heat sinking discussed above when high power dissipation significantly increases the temperature of the device. Component-side copper provides significantly better thermal performance for this surface-mount device, compared to that obtained when using only copper planes on the underside.
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ILC7071
PRODUCT SPECIFICATION
Mechanical Dimensions
5 Lead SOT-23-5
0.122 (3.10) 0.106 (2.70)
0.071 (1.80) 0.055 (1.40)
0.118 (3.00) 0.102 (2.60)
PIN 1 0.037 (0.95) BSC
0.055 (1.40) 0.0393 (1.0)
0.057 (1.45) 0.035 (0.90) 10 0 0.0217 (0.55) 0.0138 (0.35)
0.0059 (0.15) 0.0019 (0.05)
0.019 (0.50) 0.0138 (0.35)
SEATING PLANE
0.0078 (0.2) 0.0031 (0.08)
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ILC7071
PRODUCT SPECIFICATION
Ordering Information
Output Voltage 2.5 2.6 2.7 2.8 2.85 2.9 3.0 3.1 3.3 Part Number ILC7071AIM525X ILC7071AIM526X ILC7071AIM527X ILC7071AIM528X ILC7071AIM5285X ILC7071AIM529X ILC7071AIM530X ILC7071AIM531X ILC7071AIM533X Temperature Range -40 to 85C -40 to 85C -40 to 85C -40 to 85C -40 to 85C -40 to 85C -40 to 85C -40 to 85C -40 to 85C Package SOT-23-5 SOT-23-5 SOT-23-5 SOT-23-5 SOT-23-5 SOT-23-5 SOT-23-5 SOT-23-5 SOT-23-5
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.
www.fairchildsemi.com 7/16/03 0.0m 002 Stock#DS30007071 2003 Fairchild Semiconductor Corporation
2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

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