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FM2G300US60
IGBT
FM2G300US60
Molding Type Module
General Description
Fairchild's Insulated Gate Bipolar Transistor (IGBT) power modules provide low conduction and switching losses as well as short circuit ruggedness. They are designed for applications such as motor control, uninterrupted power supplies (UPS) and general inverters where short circuit ruggedness is a required feature.
Features
* * * * * * UL Certified No. E209204 Short circuit rated 10us @ TC = 100C, VGE = 15V High speed switching Low saturation voltage : VCE(sat) = 2.2 V @ IC = 300A High input impedance Fast and soft anti-parallel FWD
Package Code : 7PM-BB
E1/C2
Application
* * * * * AC & DC motor controls General purpose inverters Robotics Servo controls UPS
C1 E2
G1
E1
G2
E2
Internal Circuit Diagram
Absolute Maximum Ratings
Symbol VCES VGES IC ICM (1) IF IFM TSC PD TJ Tstg Viso Mounting Torque
TC = 25C unless otherwise noted
Description Collector-Emitter Voltage Gate-Emitter Voltage Collector Current Pulsed Collector Current Diode Continuous Forward Current Diode Maximum Forward Current Short Circuit Withstand Time Maximum Power Dissipation Operating Junction Temperature Storage Temperature Range Isolation Voltage Power Terminals Screw: M5 Mounting Screw: M6
@ TC = 25C @ TC = 100C @ TC = 100C @ TC = 25C
@ AC 1minute
FM2G300US60 600 20 300 600 300 600 10 1250 -40 to +150 -40 to +125 2500 2.0 2.5
Units V V A A A A us W C C V N.m N.m
Notes : (1) Repetitive rating : Pulse width limited by max. junction temperature
(c)2002 Fairchild Semiconductor Corporation
FM2G300US60 Rev. A1
FM2G300US60
Electrical Characteristics of the IGBT T
Symbol Parameter
C
= 25C unless otherwise noted
Test Conditions
Min.
Typ.
Max.
Units
Off Characteristics
BVCES BVCES/ TJ ICES IGES Collector-Emitter Breakdown Voltage Temperature Coefficient of Breakdown Voltage Collector Cut-Off Current G-E Leakage Current VGE = 0V, IC = 250uA VGE = 0V, IC = 1mA VCE = VCES, VGE = 0V VGE = VGES, VCE = 0V 600 ----0.6 ----250 100 V V/C uA nA
On Characteristics
VGE(th) VCE(sat) G-E Threshold Voltage Collector to Emitter Saturation Voltage IC = 0V, IC = 200mA IC = 300A, VGE = 15V 5.0 --2.2 8.5 2.8 V V
Dynamic Characteristics
Cies Coes Cres Input Capacitance Output Capacitance Reverse Transfer Capacitance VCE = 30V, VGE = 0V, f = 1MHz ---14600 2170 500 ---pF pF pF
Switching Characteristics
td(on) tr td(off) tf Eon Eoff Ets td(on) tr td(off) tf Eon Eoff Ets Tsc Qg Qge Qgc Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Short Circuit Withstand Time Total Gate Charge Gate-Emitter Charge Gate-Collector Charge --------------10 ---170 110 240 100 4.2 13.3 17.5 290 140 285 165 6.0 16.5 22.5 -1260 250 565 --300 200 -----------1400 --ns ns ns ns mJ mJ mJ ns ns ns ns mJ mJ mJ us nC nC nC
VCC = 300 V, IC = 300A, RG = 1.5, VGE = 15V Inductive Load, TC = 25C
VCC = 300 V, IC = 300A, RG = 1.5, VGE = 15V Inductive Load, TC = 125C
@ TC =
VCC = 300 V, VGE = 15V 100C
VCE = 300 V, IC = 300A, VGE = 15V
(c)2002 Fairchild Semiconductor Corporation
FM2G300US60 Rev. A1
FM2G300US60
Electrical Characteristics of DIODE T
Symbol VFM trr Irr Qrr Parameter Diode Forward Voltage Diode Reverse Recovery Time Diode Peak Reverse Recovery Current Diode Reverse Recovery Charge
C
= 25C unless otherwise noted
Test Conditions TC = 25C IF = 300A TC = 100C TC = 25C TC = 100C IF = 300A di / dt = 600 A/us TC = 25C TC = 100C TC = 25C TC = 100C
Min. ---------
Typ. 1.9 1.8 90 130 32 63 1440 4095
Max. 2.8 -130 -42 -2700 --
Units V ns A nC
Thermal Characteristics
Symbol RJC RJC RCS Weight Parameter Junction-to-Case (IGBT Part, per 1/2 Module) Junction-to-Case (DIODE Part, per 1/2 Module) Case-to-Sink (Conductive grease applied) Weight of Module Typ. --0.03 -Max. 0.10 0.24 -270 Units C/W C/W C/W g
(c)2002 Fairchild Semiconductor Corporation
FM2G300US60 Rev. A1
FM2G300US60
600 Common Emitter T C = 25 500 20V 15V 12V
400 350 Common Emitter VGE = 15V TC = 25 TC = 125
Collector Current, IC [A]
V GE = 10V
Collector Current, IC [A]
300 250 200 150 100
400
300
200
100 50 0 0 2 4 6 8 0 0.3 1 10 20
Collector - Emitter Voltage, VCE [V]
Collector - Emitter Voltage, VCE [V]
Fig 1. Typical Output Characteristics
Fig 2. Typical Saturation Voltage Characteristics
5
320 Common Emitter VGE = 15V 280 600A 240
V CC = 300V Load Current : peak of square wave
Collector - Emitter Voltage, V [V] CE
4
Load Current [A]
3 300A 2 IC = 150A 1
200 160 120 80 40 Duty cycle : 50% TC = 100 Power Dissipation = 370W 0.1 1 10 100 1000
0 0 30 60 90 120 150
0
Case Temperature, T C []
Frequency [Khz]
Fig 3. Saturation Voltage vs. Case Temperature at Variant Current Level
Fig 4. Load Current vs. Frequency
20 Common Emitter T C = 25 16
20 Common Emitter T C = 125
Collector - Emitter Voltage, VCE [V]
Collector - Emitter Voltage, VCE [V]
16
12
12
8
8
600A 4 IC = 150A 0 0 4 8 12 16 20 300A
600A 4 IC = 150A 0 0 4 8 12 16 20 300A
Gate - Emitter Voltage, V GE [V]
Gate - Emitter Voltage, VGE [V]
Fig 5. Saturation Voltage vs. VGE
(c)2002 Fairchild Semiconductor Corporation
Fig 6. Saturation Voltage vs. VGE
FM2G300US60 Rev. A1
FM2G300US60
50000
2000 Common Emitter V GE = 0V, f = 1MHz T C = 25 Common Emitter VCC = 300V, V GE = 15V IC = 300A TC = 25 TC = 125
40000
Cies
1000
Ton
Capacitance [pF]
30000
Switching Time [ns]
Tr
20000 Coes
10000 Cres
100
0 0.5
50 1 10 30 1 10 50
Collector - Emitter Voltage, V CE [V]
Gate Resistance, R G [ ]
Fig 7. Capacitance Characteristics
Fig 8. Turn-On Characteristics vs. Gate Resistance
3000
100000 Common Emitter V CC = 300V, VGE = 15V IC = 300A T C = 25 T C = 125 Toff Common Emitter V CC = 300V, V GE = 15V IC = 300A TC = 25 TC = 125
Switching Time [ns]
1000
Switching Loss [uJ]
Eoff 10000
Tf
Eon
100
50 1 10 50
1000 1 10 50
Gate Resistance, RG [ ]
Gate Resistance, R G [ ]
Fig 9. Turn-Off Characteristics vs. Gate Resistance
Fig 10. Switching Loss vs. Gate Resistance
1000 Common Emitter V CC = 300V, V GE = 15V RG = 1.8 T C = 25 T C = 125
Switching Time [ns]
Switching Time [ns]
Ton
1000
100 Tr Common Emitter VCC = 300V, V GE = 15V RG = 1.5 TC = 25 TC = 125 10 30 60 90 120 150 180 210 240 270 300
Toff
Tf 100
50 30 60 90 120 150 180 210 240 270 300
Collector Current, IC [A]
Collector Current, IC [A]
Fig 11. Turn-On Characteristics vs. Collector Current
(c)2002 Fairchild Semiconductor Corporation
Fig 12. Turn-Off Characteristics vs. Collector Current
FM2G300US60 Rev. A1
FM2G300US60
30000 Eoff 10000
15 Common Emitter RL = 1 T C = 25
Gate - Emitter Voltage, VGE [ V ]
12
300 V
Switching Loss [uJ]
Eon
9
200 V V CC = 100 V
1000 Common Emitter VCC = 300V, VGE = 15V RG = 1.5 TC = 25 TC = 125 60 90 120 150 180 210 240 270 300
6
3
100 30
0 0 200 400 600 800 1000 1200 1400
Collector Current, IC [A]
Gate Charge, Qg [ nC ]
Fig 13. Switching Loss vs. Collector Current
Fig 14. Gate Charge Characteristics
1000 IC MAX. (Pulsed) IC MAX. (Continuous) 50us
1000
Collector Current, IC [A]
100
1
Collector Current, IC [A]
100us
100
DC Operation
10 Single Nonrepetitive Pulse T C = 25 Curves must be derated linerarly with increase in temperature 1 0.3 1 10 100 1000
10
Safe Operating Area V GE = 20V, TC = 100 C 1 1 10 100 1000
o
Collector-Emitter Voltage, V CE [V]
Collector-Emitter Voltage, VCE [V]
Fig 15. SOA Characteristics
Fig 16. Turn-Off SOA Characteristics
2000 1000
0.5
Thermal Response, Zthjc [/W]
0.1
Collector Current, I
C
[A]
100
0.01
10 Single Nonrepetitive Pulse TJ 125 V GE = 15V RG = 1.5 0 100 200 300 400 500 600 700
1E-3 T C=25 IGBT : DIODE : 1E-4 10
-5
1
10
-4
10
-3
10
-2
10
-1
10
0
10
1
Collector-Emitter Voltage, VCE [V]
Rectangular Pulse Duration [sec]
Fig 17. RBSOA Characteristics
(c)2002 Fairchild Semiconductor Corporation
Fig 18. Transient Thermal Impedance
FM2G300US60 Rev. A1
FM2G300US60
600
200
500
Peak Reverse Recovery Current, Irr [A] Reverse Recovery Time, Trr [x10ns]
Common Cathode VGE = 0V TC = 25 TC = 125
100
Forward Current, I F [A]
Common Cathode di/dt = 600A/ T C = 25 T C = 100
400
Irr
300
200
T rr 10
100
0 0 1 2 3 4
5 0 50 100 150 200 250 300
Forward Voltage, V F [V]
Forward Current, IF [A]
Fig 19. Forward Characteristics
Fig 20. Reverse Recovery Characteristics
(c)2002 Fairchild Semiconductor Corporation
FM2G300US60 Rev. A1
FM2G300US60
Package Dimension
7PM-BB (FS PKG CODE BE)
Dimensions in Millimeters
(c)2002 Fairchild Semiconductor Corporation FM2G300US60 Rev. A1
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
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FAST(R) FASTrTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM ISOPLANARTM LittleFETTM MicroFETTM MicroPakTM
MICROWIRETM OPTOLOGICTM OPTOPLANARTM PACMANTM POPTM Power247TM PowerTrench(R) QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM
SLIENT SWITCHER(R) SMART STARTTM SPMTM STAR*POWERTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM TruTranslationTM
UHCTM UltraFET(R) VCXTM
STAR*POWER is used under license
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems 2. A critical component is any component of a life support which, (a) are intended for surgical implant into the body, device or system whose failure to perform can be or (b) support or sustain life, or (c) whose failure to perform reasonably expected to cause the failure of the life support when properly used in accordance with instructions for use device or system, or to affect its safety or effectiveness. provided in the labeling, can be reasonably expected to result in significant injury to the user.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
(c)2002 Fairchild Semiconductor Corporation
Rev. H5

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