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| FDS3170N7 May 2003 FDS3170N7 100V N-Channel PowerTrench MOSFET General Description This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for "low side" synchronous rectifier operation, providing an extremely low RDS(ON) in a small package. Features * 6.7 A, 100 V. RDS(ON) = 26 m @ VGS = 10 V RDS(ON) = 28 m @ VGS = 6.0 V * High performance trench technology for extremely low RDS(ON) * High power and current handling capability * Fast switching, low gate charge * FLMP SO-8 package: Enhanced thermal performance in industry-standard package size Applications * Synchronous rectifier * DC/DC converter 5 6 7 8 Bottom-side Drain Contact 4 3 2 1 Absolute Maximum Ratings Symbol VDSS VGSS ID PD TJ, TSTG Drain-Source Voltage Gate-Source Voltage Drain Current - Continuous - Pulsed TA=25oC unless otherwise noted Parameter Ratings 100 20 (Note 1a) Units V V A W C 6.7 60 3.0 -55 to +150 Power Dissipation for Single Operation (Note 1a) Operating and Storage Junction Temperature Range Thermal Characteristics RJA RJC Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case (Note 1a) (Note 1) 40 0.5 C/W C/W Package Marking and Ordering Information Device Marking FDS3170N7 Device FDS3170N7 Reel Size 13'' Tape width 12mm Quantity 2500 units 2003 Fairchild Semiconductor Corporation FDS3170N7 Rev C1(W) FDS3170N7 Electrical Characteristics Symbol WDSS IAR TA = 25C unless otherwise noted Parameter Drain-Source Avalanche Energy Drain-Source Avalanche Current Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage (Note 2) Test Conditions Single Pulse, VDD = 50 V, ID= 6.7 A Min Typ Max Units 360 6.7 mJ A Drain-Source Avalanche Ratings (Note 2) Off Characteristics BVDSS BVDSS TJ IDSS IGSS VGS(th) VGS(th) TJ RDS(on) VGS = 0 V, ID = 250 A 100 104 1 100 2 2.5 -6.9 21 22 40 37 2714 171 82 VGS = 15 mV, f = 1.0 MHz (Note 2) V mV/C A nA V mV/C 26 28 52 m ID = 250 A, Referenced to 25C VDS = 80 V, VGS = 20 V, VGS = 0 V VDS = 0 V On Characteristics Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge ID = 250 A VDS = VGS, ID = 250 A, Referenced to 25C VGS = 10 V, VGS = 6.0V, VGS = 10 V, VDS = 10 V, VDS = 50 V, f = 1.0 MHz ID = 6.7 A ID = 6.4 A ID = 6.7 A,TJ = 125C ID = 6.7 A V GS = 0 V, 4 gFS Ciss Coss Crss RG td(on) tr td(off) tf Qg Qgs Qgd IS VSD tRR QRR S pF pF pF 26 18 80 40 77 ns ns ns ns nC nC nC 2.5 A V ns nC Dynamic Characteristics 1.1 14 10 49 24 Switching Characteristics VDD = 50 V, VGS = 10 V, ID = 1 A, RGEN = 6 VDS = 50 V, VGS = 10 V ID = 6.7 A, 55 12 14 Drain-Source Diode Characteristics and Maximum Ratings Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward VGS = 0 V, IS = 2.5 A Voltage Reverse Recovery Time IF = 6.7 A, diF/dt = 100 A/s Reverse Recovery Charge (Note 2) 0.7 47 135 1.2 (Note 2) Notes: 1. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design. 2. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0%, For Repetitive Avalanche Tj must be less the 150 C b) a) 40C/W when mounted on a 1in2 pad of 2 oz copper 85C/W when mounted on a minimum pad of 2 oz copper Scale 1 : 1 on letter size paper FDS3170N7 Rev C1(W) FDS3170N7 Dimensional Outline and Pad Layout FDS3170N7 Rev C1(W) FDS3170N7 Typical Characteristics 60 1.6 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE VGS = 10V 50 ID, DRAIN CURRENT (A) 40 30 20 10 0 0 1 2 3 4 5 VDS, DRAIN-SOURCE VOLTAGE (V) VGS = 4.0V 1.4 5.0V 4.5V 4.0V 4.5V 1.2 5.0V 6.0V 10V 1 0.8 0 10 20 30 40 50 60 ID, DRAIN CURRENT (A) Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation with Drain Current and Gate Voltage. 0.06 RDS(ON), ON-RESISTANCE (OHM) 2.4 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 2.0 1.6 1.2 0.8 0.4 0.0 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (oC) ID = 6.7A VGS = 10V ID = 3.4A 0.05 TA = 125oC 0.04 0.03 0.02 TA = 25oC 0.01 3 4 5 6 7 8 9 10 VGS, GATE TO SOURCE VOLTAGE (V) Figure 3. On-Resistance Variation with Temperature. 80 VDS = 10V ID, DRAIN CURRENT (A) 60 IS, REVERSE DRAIN CURRENT (A) Figure 4. On-Resistance Variation with Gate-to-Source Voltage. 100 VGS = 0V 10 TA = 125oC 1 0.1 0.01 0.001 0.0001 25oC -55oC 40 TA = 125oC 20 25oC -55oC 0 2 2.5 3 3.5 4 4.5 5 VGS, GATE TO SOURCE VOLTAGE (V) 0 0.2 0.4 0.6 0.8 1 1.2 VSD, BODY DIODE FORWARD VOLTAGE (V) Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature. FDS3170N7 Rev C1(W) FDS3170N7 Typical Characteristics 10 VGS, GATE-SOURCE VOLTAGE (V) ID = 6.7A 8 CAPACITANCE (pF) 70V 6 VDS = 30V 50V 3500 3000 CISS 2500 2000 1500 1000 500 COSS CRSS 0 20 40 60 80 100 f = 1MHz VGS = 0 V 4 2 0 0 10 20 30 40 50 60 Qg, GATE CHARGE (nC) 0 VDS, DRAIN TO SOURCE VOLTAGE (V) Figure 7. Gate Charge Characteristics. 1000 P(pk), PEAK TRANSIENT POWER (W) 50 Figure 8. Capacitance Characteristics. ID, DRAIN CURRENT (A) 100 RDS(ON) LIMIT 1ms 10ms 100ms 1s VGS = 10V SINGLE PULSE RJA = 85oC/W TA = 25oC 10s DC 40 SINGLE PULSE RJA = 85C/W TA = 25C 10 30 1 20 0.1 10 0.01 0.1 1 10 100 1000 VDS, DRAIN-SOURCE VOLTAGE (V) 0 0.01 0.1 1 10 100 1000 t1, TIME (sec) Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum Power Dissipation. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE 1 D = 0.5 0.2 RJA(t) = r(t) * RJA RJA = 85 C/W P(pk) t1 t2 TJ - TA = P * RJA(t) Duty Cycle, D = t1 / t2 0.1 0.1 0.05 0.02 0.01 0.01 SINGLE PULSE 0.001 0.001 0.01 0.1 1 t1, TIME (sec) 10 100 1000 Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. FDS3170N7 Rev C1(W) TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx FACT ActiveArray FACT Quiet Series Bottomless FASTa CoolFET FASTr CROSSVOLT FRFET DOME GlobalOptoisolator EcoSPARK GTO E2CMOSTM HiSeC EnSignaTM I2C Across the board. Around the world. The Power Franchise Programmable Active Droop DISCLAIMER ImpliedDisconnect PACMAN POP ISOPLANAR Power247 LittleFET PowerTrencha MicroFET QFET MicroPak QS MICROWIRE QT Optoelectronics MSX Quiet Series MSXPro RapidConfigure OCX RapidConnect OCXPro SILENT SWITCHERa OPTOLOGICa SMART START OPTOPLANAR SPM Stealth SuperSOT-3 SuperSOT-6 SuperSOT-8 SyncFET TinyLogica TruTranslation UHC UltraFETa VCX FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Preliminary No Identification Needed Full Production Obsolete Not In Production Rev. I2 |
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