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| CXG1068N SP4T Antenna Switch for GSM Dual band For the availability of this product, please contact the sales office. Description The CXG1068N is a high power antenna switch MMIC for use in Dualband GSM handsets. One antenna can be routed to either of the 2Tx or 2Rx ports. This IC is designed using the Sony's GaAs J-FET process which enable the CXG1068N to be operated with low voltage. Features * Low control voltage * Low insertion loss : 0.5 dB (Typ.) @900 MHz 0.65 dB (Typ.) @1.8 GHz * Small package : SSOP-20pin (Pin interval of 0.5 mm pitch) * High power handling : P1dB : 38 dBm (Typ.) 0/5 V control * Harmonics : -31 dBm (Max.) Pin=35 dBm, 0/5 V control Applications * Dualband GSM 900/GSM 1800 or GSM 900/GSM 1900 handsets. * Dualmode GSM/DECT handsets. Structure GaAs J-FET MMIC 20 pin SSOP (Plastic) Operating Conditions (Ta=25 C) Control voltage Vctl (H)-Vctl (L): 2.5 to 5 V GaAs MMICs are ESD sensitive devices. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. --1-- E98920A8X-TE CXG1068N Truth Table ON Pass Ant.-Tx1 Ant.-Tx2 Ant.-Rx1 Ant.-Rx2 CTL 1 H L L L CTL 2 L H L L CTL 3 L L H L CTL 3 H H L H CTL 4 L L L H CTL 4 H H H L Electrical Characteristics 1 Symbol Port Ant-Tx1, Tx2 Insertion loss IL Ant-Rx1, Rx2 Ant-Tx1, Tx2 Isolation ISO Ant-Rx1, Rx2 VSWR Harmonics 1dB compression Input power Switching speed TSW Control current Bias current 1 2 3 4 : : : : VSWR 2fo 3fo P1dB TSW Ictl IDD Condition 1 2 3 4 1, 3 2, 4 1, 3 2, 4 1 2 1 2 Min. Typ. 0.5 0.65 0.6 0.85 24 20 30 25 1.2 Max. 0.7 0.85 0.8 1.05 (Ta=25 C) Unit dB dB dB dB dB dB dB dB dBm dBm dBm dBm ns A A 20 17 25 20 Ant-Tx1, Tx2 Ant-Tx1, Tx2 1.4 -31 -31 35 34 38 37 100 150 60 500 300 120 Pin=34.5 dBm, 880 to 915 MHz, VDD=5 V, 0/5 V Control Pin=32 dBm, 1710 to 1785 MHz, VDD=5 V, 0/5 V Control Pin=10 dBm, 925 to 960 MHz, VDD=3 V, 0/3 V Control Pin=10 dBm, 1805 to 1880 MHz, VDD=3 V, 0/3 V Control --2-- CXG1068N Electrical Characteristics 2 Symbol Port Ant-Tx1, Tx2 Insertion loss IL Ant-Rx1, Rx2 Ant-Tx1, Tx2 Isolation ISO Ant-Rx1, Rx2 VSWR Harmonics 1dB compression Input power Switching speed TSW Control current Bias current 1 2 3 4 : : : : VSWR 2fo 3fo P1dB TSW Ictl IDD Condition 1 2 3 4 1, 3 2, 4 1, 3 2, 4 1 2 1 2 Min. Typ. 0.5 0.65 0.6 0.85 24 20 30 25 1.2 (Ta=-35 to +85 C) Max. 0.9 1.05 1.0 1.25 Unit dB dB dB dB dB dB dB dB dBm dBm dBm dBm ns A A 20 17 25 20 Ant-Tx1, Tx2 Ant-Tx1, Tx2 1.4 -30 -30 35 34 38 37 100 150 60 500 350 150 Pin=34.5 dBm, 880 to 915 MHz, VDD=5 V, 0/5 V Control Pin=32 dBm, 1710 to 1785 MHz, VDD=5 V, 0/5 V Control Pin=10 dBm, 925 to 960 MHz, VDD=3 V, 0/3 V Control Pin=10 dBm, 1805 to 1880 MHz, VDD=3 V, 0/3 V Control --3-- CXG1068N Package Outline/Pin Configuration GND GND Ant GND VDD GND CTL1 CTL2 CTL3 CTL4 20 20pin SSOP Package 1 Tx1 GND Tx2 GND Rx1 GND Rx2 GND CTL3 CTL4 Block Diagram ON Ant CTL1 ON Tx2 CTL2 ON Rx1 CTL3 ON Rx2 CTL4 CTL4 CTL3 Tx1 --4-- CXG1068N Recommended Circuit CRF (100pF) 11 10 56k 12 CRF (100pF) Ant L1 56k 14 13 L1 Tx1 9 CRF (100pF) 8 56k L1 Tx2 7 CRF (100pF) VDD Cbypass (100pF) 15 CXG1068N 16 6 L1 Rx1 5 RCTL (1k) CTL1 Cbypass (100pF) RCTL (1k) CTL2 Cbypass (100pF) RCTL (1k) CTL3 Cbypass (100pF) RCTL (1k) CTL4 Cbypass (100pF) 17 4 L1 Rx2 18 3 RCTL (1k) 19 2 CTL3 Cbypass (100pF) RCTL (1k) CTL4 Cbypass (100pF) 20 1 Recommended to use DC blocking capacitors (CRF) and bypass capacitors (Cbypass). Rctl : This resistor is used to give improved ESD performance. 1 k is recommended. L1 : This inductor is used to give improved ESD performance. Absolute Maximum Ratings (Ta=25 C) * Control voltage 7 * Operating temperature Topr -35 to +85 * Storage temperature Tstg -65 to +150 V C C --5-- CXG1068N Package Outline Unit : mm 20PIN SSOP(PLASTIC) 5.0 0.05 1.25MAX S 11 0.1 A 20 4.4 0.05 6.4 0.2 A 1 10 0.5 0.1 S 0.1 b 0.1 M S A B 0.17 0.03 b = 0.22 0.05 0.1 0.1 b = 0.2 0.03 0.6 0.15 (0.2) 0 to 10 DETAIL A (0.5) DETAIL B : SOLDER (0.15) 0.25 DETAIL B : PALLADIUM NOTE: Dimension "" does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SSOP-20P-L03 SSOP020-P-0044 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER/PALLADIUM PLATING COPPER ALLOY 0.1g --6-- + 0.03 0.15 - 0.01 |
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