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CM3002 Micropower 1.0A Low Dropout CMOS Regulators
Features
* * * * * * * * * * * Regulated output options: 1.5, 1.8, 2.5 and 3.3 volts 1.0A output current Operates from 3.3V supply (5.0V for CM3002-33) Very low dropout voltage on CM3002-33 products (500mV@1A) Enable Output Control for power-up sequencing Low quiescent operating current (< 600A typical) Current limit protection Thermal overload protection Reverse voltage protection Available in thermally-enhanced SOIC-8 and MSOP-8 (CM3002-33MA/MF) packages Lead-free versions available
Product Description
The CM3002 family of regulators are very low dropout regulators that deliver up to 1.0A of load current at a fixed voltage output. Input and output voltage options for the CM3002 family devices are presented in Table 1. Operating from a single input supply, these devices are ideally suited for powering low voltage "core" processors, especially where a 3.3V source is already available. These regulators feature a dedicated control input (EN, Active High) for power-up sequencing flexibility. When this input is taken low, the regulator output is disabled. In this state, the supply current will drop to a low level to ensure all the internal control circuitry still remains active. This provides excellent start-up response whenever the device comes out of shutdown. The CM3002 family of regulators is fully protected, offering both overload current limiting and high temperature thermal shutdown. Housed in space saving thermally-enhanced SOIC-8 and MSOP-8 (CM3002-33MA/ MF) packages, these devices ensure maximum junction-to-ambient power dissipation. The CM3002 is available with optional lead-free finishing.
Applications
* * * Low Voltage "Core" Processors Peripheral Adapter Cards Portable/Battery-Powered Devices
Table 1: CM3002 Regulator Family
PRODUCT CM3002-15SA/SF CM3002-18SA/SF CM3002-25SA/SF CM3002-33SA/SF CM3002-33MA/MF INPUT VOLTAGE 3.3V 3.3V 3.3V 5.0V or 3.3V 5.0V or 3.3V OUTPUT VOLTAGE 1.5V 1.8V 2.5V 3.3V 3.3V
Typical Application Circuit
Simplified Electrical Schematic
VCC
VCC Supply Voltage + VOUT EN + 1F 100nF GND + 10F VOUT
EN
Thermal Sensor & Current Limit
Reference Voltage
+
EN
VOUT GND
(c) 2004 California Micro Devices Corp. All rights reserved. 08/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
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1
CM3002
PACKAGE / PINOUT DIAGRAMS
Top View
EN VCC VOUT N.C.
1 2 3 4 8 7 6 5
Top View
GND GND GND GND EN VCC VOUT N.C.
1 2 3 4 8 7 6 5
GND GND GND GND
8-pin SOIC (CM3002-xxSA/SF)
Note: These drawings are not to scale.
8-pin MSOP (CM3002-33MA/MF only)
PIN DESCRIPTIONS
PIN(S) 1 NAME EN DESCRIPTION A logic input control to enable the regulator output. When EN is asserted (logic high), it allows output regulation to commence. When EN is deasserted (logic low), the regulator pass transistor (Nchannel MOSFET) is forced into a high impedance mode. All other internal circuitry is unaffected by the state of the EN input and will always remain powered whenever VCC is present. An internal pull-up current (2A) from VCC must be overdriven in order to apply a Logic Low to the EN control input. The EN control input is intended to be used for power-up sequencing. The input power supply for the regulator. If this input is within a few inches of the main supply filter, a capacitor may not be necessary. Otherwise an input filter capacitor of approximately 1uF to 10uF will ensure adequate filtering. The regulator voltage output used to power the load. A nominal output capacitor of 10uF is sufficient to minimize any transient disturbances under normal operating conditions. Additional output capacitance can be used to further improve transient load response. These pins have no connection to the internal device. To provide additional thermal performance, these pins can be connected directly to the PC board GND plane. The negative reference for all voltages.
2
VCC
3
VOUT
4 5,6,7,8
N.C. GND
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Regulator CM3002-15 CM3002-18 CM3002-25 CM3002-33 CM3002-33 Pins 8 8 8 8 8 Package Power SOIC Power SOIC Power SOIC Power SOIC Power MSOP Ordering Part Number1 CM3002-15SA CM3002-18SA CM3002-25SA CM3002-33SA CM3002-33MA Part Marking CM3002-15SA CM3002-18SA CM3002-25SA CM3002-33SA 233 Lead-free Finish Ordering Part Number1 CM3002-15SF CM3002-18SF CM3002-25SF CM3002-33SF CM3002-33MF Part Marking CM3002-15SF CM3002-18SF CM3002-25SF CM3002-33SF 233R
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
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CM3002
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER ESD Protection (HBM) Pin Voltages VCC EN VOUT Storage Temperature Range Operating Temperature Range Ambient Junction Power Dissipation (Note 1) RATING +2000 [GND - 0.4] to [+6.0] [GND - 0.4] to [+6.0] [GND - 0.4] to [+6.0] -40 to +150 0 to +70 0 to +150 Internally Limited UNITS V V V V C C C W
Note 1: The SOIC and MSOP packages are thermally enhanced through the use of a fused integral leadframe. The power rating is based on a printed circuit board heat spreading capability equivalent to 2 square inches of copper connected to the GND pins. Typical multi-layer boards using power plane construction will provide this heat spreading ability without the need for additional dedicated copper area. Please consult with factory for thermal evaluation assistance.
STANDARD OPERATING CONDITIONS
PARAMETER VCC (CM3002-15SA, CM3002-18SA, CM3002-25SA) VCC (CM3002-33SA, CM3002-33MA) Ambient Operating Temperature Range Load Current CEXT RATING 3.0 to 3.6 3.0 to 5.5 0 to +70 0 to +1000 10 +20% UNITS V V C mA F
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CM3002
Specifications (cont'd)
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL VOUT PARAMETER Regulator Output Voltage CM3002-15SA/SF CM3002-18SA/SF CM3002-25SA/SF CM3002-33SA/SF, -33MA/MF Overload Current Limit Load Regulation CM3002-15SA/SF, -18SA/SF, -25SA/SF CM3002-33SA/SF, -33MA/MF Line Regulation xx CM3002-15SA/SF CM3002-18SA/SF CM3002-25SA/SF CM3002-33SA/SF, -33MA/MF Quiescent Current CM3002-15SA/SF CM3002-18SA/SF CM3002-25SA/SF CM3002-33SA/SF, -33MA/MF Quiescent Current CM3002-15SA/SF CM3002-18SA/SF CM3002-25SA/SF CM3002-33SA/SF, -33MA/MF Ground Current CM3002-15SA/SF CM3002-18SA/SF CM3002-25SA/SF CM3002-33SA/SF, -33MA/MF Ground Current CM3002-15SA/SF CM3002-18SA/SF CM3002-25SA/SF CM3002-33SA/SF, -33MA/MF VCC Pin Reverse Leakage Enable Input Logic High Threshold Enable Input Logic Low Threshold Enable Input Current Shutdown Temperature Thermal Hysteresis CONDITIONS 0mA < ILOAD < 1000mA 0mA < ILOAD < 1000mA 0mA < ILOAD < 1000mA 0mA < ILOAD < 1000mA; VCC=5.0 MIN 1.42 1.72 2.40 3.10 TYP 1.50 1.80 2.50 3.30 1500 10mA < ILOAD < 1000mA; VCC=3.3V 10mA < ILOAD < 1000mA; VCC=5.0V ILOAD = 5mA; 3.0V < VCC < to 5.5V ILOAD = 5mA; 3.0V < VCC < to 5.5V ILOAD = 5mA; 3.0V < VCC < to 5.5V ILOAD = 5mA; 4.5V < VCC < to 5.5V EN tied to VCC; ILOAD= 0mA EN tied to VCC; ILOAD= 0mA EN tied to VCC; ILOAD= 0mA EN tied to VCC; ILOAD= 0mA EN tied to GND; ILOAD= 0mA EN tied to GND; ILOAD= 0mA EN tied to GND; ILOAD= 0mA EN tied to GND; ILOAD= 0mA ILOAD = 0mA ILOAD = 0mA ILOAD = 0mA ILOAD = 0mA ILOAD = 1000mA ILOAD = 1000mA ILOAD = 1000mA ILOAD = 1000mA VOUT = 3.3V; VCC = 0V 1.5 Internal current source from VCC 2 160 25 0.3 10 20 20 20 20 30 20 500 500 500 600 150 150 150 200 500 500 500 600 500 500 500 600 1 900 900 900 900 300 300 300 300 900 900 900 900 900 900 900 900 100 MAX 1.58 1.88 2.60 3.50 UNITS V V V V mA mV mV mV mV mV mV A A A A A A A A A A A A A A A A A V V A C C
ILIM VR LOAD
VR LINE
IQ
IQ
IGND
IGND
IRCC VIH VIL IEN TDISABLE THYST
Note 1: Operating Characteristics are over Standard Operating Conditions unless otherwise specified.
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CM3002
Performance Information
CM3002-15SA/SF Typical DC Characteristics (nominal conditions unless specified otherwise)
Supply Current vs. Voltage (EN=VCC)
700
Supply Current [uA]
Supply Current [uA]
Supply Current vs. Voltage (EN=GND)
700 600 500 400 300 200 100 0 0 1 2 3 VCC [V] 4 5
600 500 400 300 200 100 0 0 1 2 3 VCC [V]
4
5
Line Regulation with 1A Load
1.58 1.54
VOUT[V] Ground Current [uA]
Ground Current vs. Output Load
700 600 500 400 300 200 100 0 0 200 400 600 800 1000 1200 Load Current [mA]
1.56 1.52 1.50 1.48 1.46 1.44 1.42 3.0 3.1 3.2 3.3 3.4 VCC [V] 3.5 3.6
Load Regulation 1.58 1.56 1.54
VOUT[V]
Current Limiting Protection
1.6 1.4 1.2
VOUT[V]
1.52 1.50 1.48 1.46 1.44 1.42 0 200 400 600 800 1000 1200 Load Current [mA]
1.0 0.8 0.6 0.4 0.2 0.0 0 500 1000 1500 Load Current [mA] 2000
(c) 2004 California Micro Devices Corp. All rights reserved. 08/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
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CM3002
Performance Information (cont'd)
CM3002-18SA/SF Typical DC Characteristics (nominal conditions unless specified otherwise)
Supply Current vs. Voltage (EN=VCC)
700
Supply Current [uA]
Supply Current vs. Voltage (EN=GND)
700
Supply Current [uA]
600 500 400 300 200 100 0 0 1 2 3 VCC [V] 4 5
600 500 400 300 200 100 0 0 1 2 3 VCC [V] 4 5 6
Line Regulation with 1A Load
1.88 1.86 1.84
Ground Current vs. Output Load
700
Ground Current [uA]
3.0 3.1 3.2 3.3 VCC [V] 3.4 3.5 3.6
600 500 400 300 200 100 0 0 200 400 600 800 Load Current [mA]
Current Limiting Protection
VOUT [V]
1.82 1.80 1.78 1.76 1.74 1.72
1000
Load Regulation
1.88 1.86 1.84
VOUT [V]
1.80 1.78 1.76 1.74 1.72 0 200 400 600 800 1000 1200 1400 Load Current [mA]
VOUT [V]
1.82
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 500 1000 1500 Load Current [mA] 2000
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CM3002
Performance Information (cont'd)
CM3002-25SA/SF Typical DC Characteristics (nominal conditions unless specified otherwise)
Supply Current vs. Voltage (EN=VCC)
600
Supply Current vs. Voltage (EN=GND)
600
Supply Current [uA]
Supply Current [uA]
500 400 300 200 100 0 0 1 2 3 VCC [V] 4 5
500 400 300 200 100 0 0 1 2 3 VCC [V] 4 5
Line Regulation (rated 1.0 Amp Load)
Ground Current vs. Output Load
600
Ground Current [uA]
2.60 2.58 2.56 2.54 2.52 2.50 2.48 2.46 2.44 2.42 2.40 3.0 3.1 3.2 3.3
VCC [V]
500 400 300 200 100 0
VOUT [V]
3.4
3.5
3.6
0
200
400
600
800
1000
Load Current [mA]
Load Regulation
2.52 2.51
VOUT [V]
Current Limiting Protection
3.0 2.5
VOUT [V]
2.0 1.5 1.0 0.5 0.0
2.50 2.49 2.48 0 250 500 750 1000 Load Current [mA] 1250
0
500 1000 1500 Load Current [mA]
2000
(c) 2004 California Micro Devices Corp. All rights reserved. 08/16/04
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Tel: 408.263.3214
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CM3002
Performance Information (cont'd)
CM3002-33SA/SF & CM3002-33MA/MF Typical DC Characteristics (nominal conditions unless specified otherwise, data representative of SOIC packaged -33SA/SF devices)
Supply Current vs. Voltage (EN=VCC) 700
Supply Current [uA] Supply Current [uA]
Supply Current vs. Voltage (EN=GND) 700 600 500 400 300 200 100 0
600 500 400 300 200 100 0 0 1 2 3 4 VCC [V] 5 6
0
1
2
3
VCC [V]
4
5
6
Line Regulation with 5mA & 1A Load
3. 3.3 4 5mA Load
Ground Current vs. Output Load 700
Ground Current [uA]
600 500 400 300 200 100 0
VOUT [V]
3.2 1A Load 3.1 3.0 3.0 3.5 4.0 4.5 5.0 VCC [V] 5.5 6.0
0
200
400 600 800 1000 1200 Load Current [mA]
Dropout Voltage vs. Load (Vout=3.2V)
0.6 0.5
Dropout [V]
Current Limiting Protection
3.5 3.0 2.5
0.3 0.2 0.1 0.0 0 200 400 600 800 Load Current [mA] 1000 1200
VOUT[V]
0.4
2.0 1.5 1.0 0.5 0.0 0 500 1000 1500 2000 Load Current [mA] 2500
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Fax: 408.263.7846
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CM3002
Performance Information (cont'd)
CM3002-33SA & CM3002-33MA/MF Typical DC Characteristics (continued)
Load Regulation (VCC = 5V)
Load Regulation (VCC = 3.3V)
3.34 3.32
VOUT [V] VOUT [V]
3.4 3.3 3.2 3.1 3.0 2.9 2.8 2.7 2.6 2.5
0 200 400 600 800 1000 1200 Load Current [mA]
3.30 3.28 3.26
0
200
400 600 Load Current [mA]
800
(c) 2004 California Micro Devices Corp. All rights reserved. 08/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
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CM3002
Performance Information (cont'd)
CM3002-15SA/SF Typical Transient Characteristics (nominal conditions unless specified otherwise)
Cold Start Power-up with Rated Load Full Power Down with Rated Load
Power-Up Sequencing using Enable Input
Line Transient Step Response (0.6Vp-p)
Load Transient Response (50mA to 450mA)
Load Transient Response (100mA to 900mA)
(c) 2004 California Micro Devices Corp. All rights reserved.
10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
08/16/04
CM3002
Performance Information (cont'd)
CM3002-18SA/SF Typical Transient Characteristics (nominal conditions unless specified otherwise)
Cold Start Power-up with Rated Load Full Power Down with Rated Load
Power-Up Sequencing using Enable Input
Line Transient Step Response (1Vp-p)
Load Transient Response (50mA to 500mA)
Load Transient Response (100mA to 900mA)
(c) 2004 California Micro Devices Corp. All rights reserved. 08/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
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CM3002
Performance Information (cont'd)
CM3002-25SA/SF Typical Transient Characteristics (nominal conditions unless specified otherwise)
Cold Start Power-up with Rated Load Full Power Down with Rated Load
Power-Up Sequencing using Enable Input
Line Transient Step Response (1Vp-p)
Load Transient Response (50mA to 450mA)
Load Transient Response (100mA to 900mA)
(c) 2004 California Micro Devices Corp. All rights reserved.
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Fax: 408.263.7846
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08/16/04
CM3002
Performance Information (cont'd)
CM3002-33SA/SF & CM3002-33MA/MF Typical Transient Characteristics (nominal conditions unless specified otherwise)
Cold Start (1A Load) Full Power Down (1A Load)
Line Transient Response (4.0V to 5.0V Line Step)
Power-Up Sequencing using Enable Input (1A Load)
Load Transient Response (VCC=5V)
Load Transient Response (VCC=3.3V)
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CM3002
Performance Information (cont'd)
Typical Thermal Characteristics The overall junction to ambient thermal resistance ( JA) for device power dissipation (PD) consists primarily of two paths in series. The first path is the junction to the case ( JC) which is defined by the package style, and the second path is case to ambient ( CA) thermal resistance which is dependent on board layout. The final operating junction temperature for any set of conditions can be estimated by the following thermal equation: TJUNC = TAMB + PD (JC) + PD (CA) = TAMB + PD ( JA) The CM3002 family uses thermally enhanced SOIC and MSOP packages where all the GND pins (5 through 8) are integral to the leadframe. When this package is mounted on a double sided printed circuit board with two square inches of copper allocated for "heat spreading", the resulting JA is about 50 C/W for the SOIC package and 70 C/W for the MSOP package. Based on a maximum power dissipation of 0.8W (Load x Vin-Vout = 1.0A x [3.3V-2.5V]) with an ambient of 70 C, the resulting junction temperature for a SOICpackaged device will be: TJUNC = TAMB + PD (JA) = 70 C + 0.8W (50 C/W) = 70 C + 40 C = 110 C Thermal characteristics were measured using a double sided board with two square inches of copper area connected to the GND pins for "heat spreading". Measurements showing performance up to a junction temperature of 125 C are presented in Figure 1, Figure 2, Figure 3 and Figure 4. They were performed under light load conditions (5mA); this allows the ambient temperature to be representative of the internal junction temperature. Note: The use of multi-layer board construction with separate ground and power planes will further enhance the overall thermal performance. In the event of no copper area being dedicated for heat spreading, a multi-layer board construction using only the minimum size pad layout will typically provide a CM3002 device packaged in a SOIC package with an overall JA of 50 C/W, which allows up to 0.8W to be dissipated safely. Please consult CAMD Technical Support for assistance with thermal analysis of the CM3002 family of regulators with respect to a specific application.
Output Voltage with Temperature (5mA Load)
Ground Current with Temperature (No Load)
1.54 1.52
700
Ground Current [uA]
600 500 400 300 200 100 0 0 25 50 75 100 125
VOUT [V]
1.50 1.48 1.46 0 25 50 75 100 Junction Temperature [C] 125
Junction Temperature [C]
Figure 1. CM3002-15SA/SF Performance vs. Temperature
(c) 2004 California Micro Devices Corp. All rights reserved.
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CM3002
Performance Information (cont'd)
Output Voltage with Temperature (5mA Load)
1.84 1.83 1.82 VOUT [V] 1.81 1.80 1.79 1.78 1.77 1.76 25 50 75 100 125 150 Junction Temperature [C]
Ground Current with Temperature (No Load)
700 600 Ground Current [uA] 500 400 300 200 100 0 25 50 75 100 125 150
Junction Temperature [C]
Figure 2. CM3002-18SA/SF Performance vs. Temperature
Output Voltage with Temperature (5mA Load)
2.58 Ground Current [uA] 25 50 75 100 125 Junction Temperature [C] 150 2.56 2.54 VOUT [V] 2.52 2.50 2.48 2.46 2.44 2.42
Ground Current with Te mperature (No Load)
500 400 300 200 100 0 25 50 75 100 125 Junction Temperature [C] 150
Figure 3. CM3002-25SA/SF Performance vs. Temperature
Output Voltage with Temperature (5mA Load)
Ground Current with Temperature (No Load)
3.40 3.38 3.36 3.34 3.32 3.30 3.28 3.26 3.24 3.22 3.20 0 25 50 75 100 Junction Temperature [C] 125
700 Ground Current [uA] 600 500 400 300 200 100 0 0 25 50 75 100 125
Junction Temperature [C]
(c) 2004 California Micro Devices Corp. All rights reserved. 08/16/04
VOUT [V]
Figure 4. CM3002-33SA/SF & CM3002-33MA/MF Performance vs. Temperature
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CM3002
Mechanical Details
CM3002 devices are packaged in 8-pin Narrow SOIC (CM3002-xxSA/SF) and 8-pin MSOP (CM3002-33MA/ MF only) packages. SOIC-8 Mechanical Specifications: Dimensions for CM3002-xxSA/SF devices packaged in 8-pin Narrow SOIC packages are presented below. For complete information on the SOIC-8 package, see the California Micro Devices SOIC Package Information document.
8 7
Mechanical Package Diagrams
TOP VIEW
D
6 5
H
Pin 1 Marking
E
PACKAGE DIMENSIONS
Package Pins Dimensions A A1 B C D E e H L # per tube # per tape and reel Millimeters Min 1.35 0.10 0.33 0.19 4.80 3.80 5.80 0.40 Max 1.75 0.25 0.51 0.25 5.00 4.19 6.20 1.27 Min 0.053 0.004 0.013 0.007 0.189 0.150 0.228 0.016 SOIC 8 Inches Max 0.069 0.010 0.020 0.010 0.197 0.165
C A
SEATING PLANE
1
2
3
4
SIDE VIEW
A1 B e
END VIEW
1.27 BSC
0.050 BSC 0.244 0.050
L
100 pcs* 2500 pcs Controlling dimension: inches
Package Dimensions for SOIC-8
* This is an approximate number which may vary.
(c) 2004 California Micro Devices Corp. All rights reserved.
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Fax: 408.263.7846
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08/16/04
CM3002
Mechanical Details (cont'd)
MSOP-8 Mechanical Specifications: CM3002-33MA/MF devices are packaged in 8-pin MSOP packages. Dimensions are presented below. For complete information on the MSOP-8 package, see the California Micro Devices MSOP Package Information document.
8
Mechanical Package Diagrams
TOP VIEW
D
7 6 5
PACKAGE DIMENSIONS
Package Pins Dimensions A A1 B C D E e H L # per tube # per tape and reel 2.90 2.90 4.78 0.52 Millimeters Min 0.87 0.05 0.18 3.10 3.10 4.98 0.54 0.114 0.114 0.188 0.017 Max 1.17 0.25 Min 0.034 0.002 MSOP 8 Inches Max 0.046 0.010 0.007 0.122 0.122 0.196 0.025
SEATING PLANE
H
Pin 1 Marking
E
1
2
3
4
SIDE VIEW
0.30 (typ)
0.012 (typ)
A A1 B e
END VIEW
0.65 BSC
0.025 BSC
80 pcs* 4000 pcs Controlling dimension: inches
C
L
* This is an approximate number which may vary.
Package Dimensions for MSOP-8
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430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
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