![]() |
|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
BAV23S Small Signal Diode September 2006 BAV23S Small Signal Diode Connection Diagram 3 3 3 2 1 1 tm L30 2 1 2 SOT-23 Absolute Maximum Ratings * Symbol VRRM IF(AV) IFSM Ta = 25C unless otherwise noted Parameter Maximum Repetitive Reverse Voltage Average Rectified Forward Current Non-repetitive Peak Forward Surge Current Pulse Width = 1.0 microsecond Pulse Width = 100 microsecond Storage Temperature Range Operating Junction Temperature Value 250 200 9.0 3.0 -55 to +150 150 Unit V mA A A C C TSTG TJ *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. Thermal Characteristics Symbol PD RJA Power Dissipation Thermal Resistance, Junction to Ambient* Parameter Value 350 357 Unit mW C/W Electrical Characteristics Symbol VR VF IR trr TC = 25C unless otherwise noted Parameter Breakdown Voltage Forward Voltage Reverse Leakage Reverse Recovery Time Conditions IR = 100A IF = 100mA IF = 200mA VR = 250V VR = 250V, TA = 150C IF = IR = 30mA, IRR = 3.0mA, RL = 100 Min. 250 Max 1.0 1.25 100 100 50 Units V V V nA A ns (c)2006 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com BAV23S Rev. E BAV23S Small Signal Diode Typical Performance Characteristics 2 BAV23S Rev. E www.fairchildsemi.com BAV23S Small Signal Diode Typical Performance Characteristics (Continued) P - POWER DISSIPATION (mW) 400 300 250 IF - CURRENT (mA) 0 25 50 75 100 125 o 300 200 150 100 50 0 200 100 150 0 25 50 75 100 125 o 150 T A - A M B IEN T TEM PE R A TU R E ( C ) T A - AMBIENT TEMPERATURE ( C) Figure 9. Power Derating Curve Figure 10. Average Rectified Current(IO) vs Ambient Temperature(TA) Figure 11. Reverse Recovery Time vs Reverse Recovery Current (Irr) 3 BAV23S Rev. E www.fairchildsemi.com BAV23S Small Signal Diode Mechanical Dimensions SOT-23 4 BAV23S Rev. E www.fairchildsemi.com BAV23S Small Signal Diode BAV23S Small Signal Diode TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM ActiveArrayTM BottomlessTM Build it NowTM CoolFETTM CROSSVOLTTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FAST(R) FASTrTM FPSTM FRFETTM FACT Quiet SeriesTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM IntelliMAXTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyBoostTM TinyBuckTM TinyPWMTM TinyPowerTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UltraFET(R) UniFETTM VCXTM WireTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I20 5 BAV23S Rev. E www.fairchildsemi.com |
Price & Availability of BAV23S06
![]() |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |