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CMOS Highly Accurate : +2% Ultra Low Power Consumption : 0.8A(TYP.) (VIN = 2.0V) Separated Sense Pin Built-In Delay Circuit, Delay Pin Available
APPLICATIONS
Microprocessor reset circuitry Charge voltage monitors Memory battery back-up switch circuits Power failure detection circuits
GENERAL DESCRIPTION
The XC6108 series is highly precise, low power consumption voltage detector, manufactured using CMOS and laser trimming technologies. Since the sense pin is separated from power supply, it allows the IC to monitor added power supply. Using the IC with the sense pin separated from power supply enables output to maintain the state of detection even when voltage of the monitored power supply drops to 0V. Moreover, with the built-in delay circuit, connecting the delay capacitance pin to the capacitor enables the IC to provide an arbitrary release delay time. Both CMOS and N-channel open drain output configurations are available.
FEATURES
Highly Accurate :+2% (Setting Detect Voltage1.5V) :+30mV (Setting Detect Voltage1.5V) Ultra Low Power Consumption : 0.8 A (TYP.) (VIN= 2.0V) Detect Voltage Range : 0.8V ~ 5.0V in 100mV increments Operating Voltage Range : 1.0V ~ 6.0V Detect Voltage Temperature Characteristics : 100ppm/ (TYP.) Output Configuration : CMOS or N-channel open drain : -40 ~ +85 Ultra Small Package : USP-4 SOT-25 Operating Temperature Range
TYPICAL APPLICATION CIRCUIT
TYPICAL PERFORMANCE CHARACTERISTICS
Output Voltage vs. Sense Voltage
XC6108C25A GR 7.0 Output Voltage: VOUT (V)
Ta=25
VIN VIN Added Power Supply VSEN Cd Cd VSS VOUT
R
100k
No resistor needed for CMOS output product
6.0 5.0 4.0 3.0 2.0 1.0 0.0 -1.0 0 1 2 3 4 5 6 Sense V oltage: V SEN (V ) 1.0V 4.0V V IN=6.0V
XC6108 ETR0205_004.doc
1
XC6108 Series
PIN CONFIGURATION
5
VIN 4 VSEN 3 5 VSS 1 VOUT 2 Cd
4 VSEN
Cd
VOUT VSS
VIN 3
USP-4 (BOTTOM VIEW)
* In the XC6108xxxA/B series, the dissipation pad should not be short-circuited with other pins. * In the XC6108xxxC/D series, when the dissipation pad is short-circuited with other pins, connect it to the NC pin (pin No.2) before use.
1
2
SOT-25 (TOP VIEW)
PIN ASSIGNMENT
PIN NUMBER USP- 4 1 2 2 3 4 5 SOT-25 1 5 4 3 2 PIN NAME VOUT Cd NC VSEN VIN VSS FUNCTION Output (Detect "L") Delay Capacitance (*1) No Connection Sense Input Ground (*2)
NOTE: *1: With the VSS pin of the USP-4 package, a tab on the backside is used as the pin No.5. *2: In the case of selecting no built-in delay pin type, the Cd pin will be used as the N.C.
PRODUCT CLASSIFICATION
Ordering Information
XC6108 DESIGNATOR DESCRIPTION Output Configuration Detect Voltage SYMBOL C N 08 ~ 50 A Output Delay & Hysteresis (Options) B C D Package Device Orientation G M R L : CMOS output : N-ch open drain output : e.g. 181.8V : Built-in delay pin, hysteresis 5% (TYP.) : Built-in delay pin, hysteresis less than 1% : No built-in delay pin, hysteresis 5% (TYP.) : No built-in delay pin, hysteresis less than 1% : USP-4 : SOT-25 : Embossed tape, standard feed : Embossed tape, reverse feed DESCRIPTION
2
XC6108
Series
PACKAGING INFORMATION
USP-4
1. 20. 08
1. 60. 08
M AX0 . 6
0. 30. 05
0. 70. 1
0. 20. 1
* Soldering fillet surface is not formed because the sides of the pins are plated.
1. 00. 1 ( 0. 6)
SOT-25
0. 007 - 0 . 0 0 4
+0 . 0 0 5
3
XC6108 Series
BLOCK DIAGRAMS
XC6108CxxA/B
XC6108CxxC/D
XC6108NxxA/B
XC6108NxxC/D
4
XC6108
Series
ABSOLUTE MAXIMUM RATINGS
XC6108xxxA/B
PARAMETER Input Voltage Output Current Output Voltage XC6108C (*1) XC6108N (*2) SYMBOL VIN IOUT VOUT VSEN VCD ICD USP-4 SOT-25 Pd Ta Tstg RATINGS VSS0.3 ~ 7.0 10 VSS0.3 ~ VIN0.3 VSS0.3 ~ 7.0 VSS0.3 ~ 7.0 VSS0.3 ~ VIN0.3 5.0 120 250 40 ~85 55 ~125 Ta = 25OC UNITS V mA V V V mA mW
Sense Pin Voltage Delay Pin Voltage Delay Pin Current Power Dissipation
Operating Temperature Range Storage Temperature Range
XC6108xxxC/D
PARAMETER Input Voltage Output Current Output Voltage XC6108C (*1) XC6108N (*2) USP-4 SOT-25 SYMBOL VIN IOUT VOUT VSEN Pd Ta Tstg RATINGS VSS0.3 ~ 7.0 10 VSS0.3 ~ VIN0.3 VSS0.3 ~ 7.0 VSS0.3 ~ 7.0 120 250 40 ~85 55 ~125
O Ta = 25 C
UNITS V mA V V mW
Sense Pin Voltage Power Dissipation
Operating Temperature Range Storage Temperature Range
NOTE: *1: CMOS output *2: N-ch open drain output
5
XC6108 Series
ELECTRICAL CHARACTERISTICS
XC6108xxxA
PARAMETER Operating Voltage Detect Voltage Hysteresis Range1 Detect Voltage Line Regulation Supply Current 1 (*2) Supply Current 2 (*2) Output Current (*3) Temperature Characteristics Sense Resistance (*4) Delay Resistance (*5) Delay pin Sink Current Delay Capacitance Pin Threshold Voltage Unspecified Operating Voltage (*6) Detect Delay Time (*7) Release Delay Time (*8)
NOTE: *1: VDF(T): Setting detect voltage *2: Current flows the sense resistor is not included. *3: This numerical value is applied only to the XC6108C series (CMOS output). *4: Calculated from the voltage value and the current value of the VSEN. *5: Calculated from the voltage value of the VIN and the current value of the Cd. *6: The maximum voltage of the VOUT in the range of the VIN 0V to 0.7V when the VIN and the VSEN are short-circuited This numerical value is applied only to the XC6108C series (CMOS output). *7: Time which ranges from the state of VSEN=VDF to the VOUT reaching 0.6V when the VSEN falls without connecting to the Cd pin. *8: Time which ranges from the state of VIN= VDF +VHYS to the VOUT reaching 5.4V when the VSEN rises without connecting to the Cd pin.
Ta=25 SYMBOL VIN VDF VHYS1 VDF VINVDF ISS1 ISS2 CONDITIONS VDF(T) = 0.8 ~ 5.0V (*1) VIN = 1.0 ~ 6.0V VIN = 1.0 ~ 6.0V VIN = 1.0 ~ 6.0V VSEN = VDF x 0.9 VSEN = VDF x 1.1 VSEN =0V VDS = 0.5V (N-ch) VSEN = 6.0V VDS = 0.5V (P-ch) VIN = 1.0V VIN = 6.0V VIN = 1.0V VIN = 6.0V VIN = 1.0V VIN = 6.0V VIN = 1.0V VIN = 6.0V 0.08 1.20 MIN. 1.0 TYP. E-1 E-2 0.1 0.6 0.7 0.8 0.9 0.20 2.00 -0.30 -2.00 100 E-4 1.6 0.4 2.9 2.0 200 0.5 3.0 0.3 30 30 2.4 0.6 3.1 0.4 230 200 1.5 1.6 1.7 1.8 -0.08 -0.70 MAX. 6.0 UNITS V V V %/V A A mA mA ppm/ M M A V V s s CIRCUITS 1 1 1 2 2 3 4 1 5 6 6 7 8 9 9
IOUT
VDF TaVDF RSEN Rdelay ICD VTCD VUNS TDF0 TDR0
-40 Ta 85 VSEN = 5.0V, VIN = 0V VSEN = 6.0V, VIN = 5.0V, Cd = 0V VDS = 0.5V, VIN = 1.0V VSEN = 6.0V, VIN = 1.0V VSEN = 6.0V, VIN = 6.0V VIN = VSEN = 0V ~ 0.7V VIN = 6.0V, VSEN = 6.0V0.0V Cd: Open VIN = 6.0V, VSEN = 0.0V6.0V Cd: Open
6
XC6108
Series
ELECTRICAL CHARACTERISTICS (Continued)
XC6108xxxB
PARAMETER Operating Voltage Detect Voltage Hysteresis Range1 Detect Voltage Line Regulation Supply Current 1 (*2) Supply Current 2 (*2) Output Current (*3) Temperature Characteristics Sense Resistance (*4) Delay Resistance (*5) Delay pin Sink Current Delay Capacitance Pin Threshold Voltage Unspecified Operating Voltage (*6) Detect Delay Time (*7) Release Delay Time (*8)
NOTE: *1: VDF(T): Setting detect voltage *2: Current flows the sense resistor is not included. *3: This numerical value is applied only to the XC6108C series (CMOS output). *4: Calculated from the voltage value and the current value of the VSEN. *5: Calculated from the voltage value of the VIN and the current value of the Cd. *6: The maximum voltage of the VOUT in the range of the VIN 0V to 0.7V when the VIN and the VSEN are short-circuited This numerical value is applied only to the XC6108C series (CMOS output). *7: Time which ranges from the state of VSEN=VDF to the VOUT reaching 0.6V when the VSEN falls without connecting to the Cd pin. *8: Time which ranges from the state of VIN= VDF +VHYS to the VOUT reaching 5.4V when the VSEN rises without connecting to the Cd pin.
Ta=25 SYMBOL VIN VDF VHYS1 VDF VINVDF ISS1 ISS2 CONDITIONS VDF(T) = 0.8 ~ 5.0V (*1) VIN = 1.0 ~ 6.0V VIN = 1.0 ~ 6.0V VIN = 1.0 ~ 6.0V VSEN = VDF x 0.9 VSEN = VDF x 1.1 VSEN =0V VDS = 0.5V (N-ch) VSEN = 6.0V VDS = 0.5V (P-ch) VIN = 1.0V VIN = 6.0V VIN = 1.0V VIN = 6.0V VIN = 1.0V VIN = 6.0V VIN = 1.0V VIN = 6.0V 0.08 1.20 MIN. 1.0 TYP. E-1 E-3 0.1 0.6 0.7 0.8 0.9 0.20 2.00 -0.30 -2.00 100 E-4 1.6 0.4 2.9 2.0 200 0.5 3.0 0.3 30 30 2.4 0.6 3.1 0.4 230 200 1.5 1.6 1.7 1.8 -0.08 -0.70 MAX. 6.0 UNITS V V V %/V A A mA mA ppm/ M M A V V s s CIRCUITS 1 1 1 2 2 3 4 1 5 6 6 7 8 9 9
IOUT
VDF TaVDF RSEN Rdelay ICD VTCD VUNS TDF0 TDR0
-40 Ta 85 VSEN = 5.0V, VIN = 0V VSEN = 6.0V, VIN = 5.0V, Cd = 0V VDS = 0.5V, VIN = 1.0V VSEN = 6.0V, VIN = 1.0V VSEN = 6.0V, VIN = 6.0V VIN = VSEN = 0V ~ 0.7V VIN = 6.0V, VSEN = 6.0V0.0V Cd: Open VIN = 6.0V, VSEN = 0.0V6.0V Cd: Open
7
XC6108 Series
ELECTRICAL CHARACTERISTICS (Continued)
XC6108xxxC
PARAMETER Operating Voltage Detect Voltage Hysteresis Range1 Detect Voltage Line Regulation Supply Current 1 (*2) Supply Current 2 (*2) Output Current (*3) Temperature Characteristics Sense Resistance (*4) Unspecified Operating Voltage (*5) Detect Delay Time (*6) Release Delay Time (*7)
NOTE: *1: VDF(T): Setting detect voltage *2: Current flows the sense resistor is not included. *3: This numerical value is applied only to the XC6108C series (CMOS output). *4: Calculated from the voltage value and the current value of the VSEN. *5: The maximum voltage of the VOUT in the range of the VIN 0V to 0.7V when the VIN and the VSEN are short-circuited This numerical value is applied only to the XC6108C series (CMOS output). *6: Time which ranges from the state of VSEN=VDF to the VOUT reaching 0.6V when the VSEN falls. *7: Time which ranges from the state of VIN= VDF +VHYS to the VOUT reaching 5.4V when the VSEN rises.
Ta=25 SYMBOL VIN VDF VHYS1 VDF VINVDF ISS1 ISS2 CONDITIONS VDF(T) = 0.8 ~ 5.0V (*1) VIN = 1.0 ~ 6.0V VIN = 1.0 ~ 6.0V VIN = 1.0 ~ 6.0V VSEN = VDF x 0.9 VSEN = VDF x 1.1 VSEN =0V VDS = 0.5V (N-ch) VSEN = 6.0V VDS = 0.5V (P-ch) VIN = 1.0V VIN = 6.0V VIN = 1.0V VIN = 6.0V VIN = 1.0V VIN = 6.0V VIN = 1.0V VIN = 6.0V 0.08 1.20 MIN. 1.0 TYP. E-1 E-2 0.1 0.6 0.7 0.8 0.9 0.20 2.00 -0.30 -2.00 100 E-4 0.3 30 30 0.4 230 200 1.5 1.6 1.7 1.8 -0.08 -0.70 MAX. 6.0 UNITS V V V %/V A A mA mA ppm/ M V s s CIRCUITS 1 1 1 2 2 3 4 1 5 7 9 9
IOUT
VDF TaVDF RSEN VUNS TDF0 TDR0
-40 Ta 85 VSEN = 5.0V, VIN = 0V VIN = VSEN = 0V ~ 0.7V VIN = 6.0V, VSEN = 6.0V0.0V VIN = 6.0V, VSEN = 0.0V6.0V
8
XC6108
Series
ELECTRICAL CHARACTERISTICS (Continued)
XC6108xxxD
PARAMETER Operating Voltage Detect Voltage Hysteresis Range1 Detect Voltage Line Regulation Supply Current 1 (*2) Supply Current 2 (*2) Output Current (*3) Temperature Characteristics Sense Resistance (*4) Unspecified Operating Voltage (*5) Detect Delay Time (*6) Release Delay Time (*7)
NOTE: *1: VDF(T): Setting detect voltage *2: Current flows the sense resistor is not included. *3: This numerical value is applied only to the XC6108C series (CMOS output). *4: Calculated from the voltage value and the current value of the VSEN. *5: The maximum voltage of the VOUT in the range of the VIN 0V to 0.7V when the VIN and the VSEN are short-circuited This numerical value is applied only to the XC6108C series (CMOS output). *6: Time which ranges from the state of VSEN=VDF to the VOUT reaching 0.6V when the VSEN falls. *7: Time which ranges from the state of VIN= VDF +VHYS to the VOUT reaching 5.4V when the VSEN rises.
Ta=25 SYMBOL VIN VDF VHYS1 VDF VINVDF ISS1 ISS2 CONDITIONS VDF(T) = 0.8 ~ 5.0V (*1) VIN = 1.0 ~ 6.0V VIN = 1.0 ~ 6.0V VIN = 1.0 ~ 6.0V VSEN = VDF x 0.9 VSEN = VDF x 1.1 VSEN =0V VDS = 0.5V (N-ch) VSEN = 6.0V VDS = 0.5V (P-ch) VIN = 1.0V VIN = 6.0V VIN = 1.0V VIN = 6.0V VIN = 1.0V VIN = 6.0V VIN = 1.0V VIN = 6.0V 0.08 1.20 MIN. 1.0 TYP. E-1 E-3 0.1 0.6 0.7 0.8 0.9 0.20 2.00 -0.30 -2.00 100 E-4 0.3 30 30 0.4 230 200 1.5 1.6 1.7 1.8 -0.08 -0.70 MAX. 6.0 UNITS V V V %/V A A mA mA ppm/ M V s s CIRCUITS 1 1 1 2 2 3 4 1 5 7 9 9
IOUT
VDF TaVDF RSEN VUNS TDF0 TDR0
-40 Ta 85 VSEN = 5.0V, VIN = 0V VIN = VSEN = 0V ~ 0.7V VIN = 6.0V, VSEN = 6.0V0.0V VIN = 6.0V, VSEN = 0.0V6.0V
9
XC6108 Series
VOLTAGE CHART
SYMBOL SETTING OUTPUT VOLTAGE VDF(T) (V) 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0
NOTE: *1: When VDF(T)1.4V, the detection accuracy is 30mV. When VDF(T)1.5V, the detection accuracy is 2%.
E-1 DETECT VOLTAGE (*1) (V) VDF MIN. 0.770 0.870 0.970 1.070 1.170 1.270 1.370 1.470 1.568 1.666 1.764 1.862 1.960 2.058 2.156 2.254 2.352 2.450 2.548 2.646 2.744 2.842 2.940 3.038 3.136 3.234 3.332 3.430 3.528 3.626 3.724 3.822 3.920 4.018 4.116 4.214 4.312 4.410 4.508 4.606 4.704 4.802 4.900 MAX. 0.830 0.930 1.030 1.230 1.230 1.330 1.430 1.530 1.632 1.734 1.836 1.938 2.040 2.142 2.244 2.346 2.448 2.550 2.652 2.754 2.856 2.958 3.060 3.162 3.264 3.366 3.468 3.570 3.672 3.774 3.876 3.978 4.080 4.182 4.284 4.386 4.488 4.590 4.692 4.794 4.896 4.998 5.100
E-2 HYSTERESIS RANGE (V) VHYS MIN. MAX. 0.015 0.066 0.017 0.074 0.019 0.082 0.021 0.090 0.023 0.098 0.025 0.106 0.027 0.114 0.029 0.122 0.031 0.131 0.033 0.085 0.035 0.147 0.037 0.155 0.039 0.163 0.041 0.171 0.043 0.180 0.045 0.188 0.047 0.196 0.049 0.204 0.051 0.212 0.053 0.220 0.055 0.228 0.057 0.237 0.059 0.245 0.061 0.253 0.063 0.261 0.065 0.269 0.067 0.277 0.069 0.286 0.071 0.294 0.073 0.302 0.074 0.310 0.076 0.318 0.078 0.326 0.080 0.335 0.082 0.343 0.084 0.351 0.086 0.359 0.088 0.367 0.090 0.375 0.092 0.384 0.094 0.392 0.096 0.400 0.098 0.408
E-3 HYSTERESIS RANGE (V) VHYS MIN. MAX. 0.008 0.009 0.010 0.011 0.012 0.013 0.014 0.015 0.016 0.017 0.018 0.019 0.020 0.021 0.022 0.023 0.024 0.026 0.027 0.028 0.029 0 0.030 0.031 0.032 0.033 0.034 0.035 0.036 0.037 0.038 0.039 0.040 0.041 0.042 0.043 0.044 0.045 0.046 0.047 0.048 0.049 0.050 0.051
E-4 SENSE RESISTANCE (M) RSEN MIN. TYP.
10
20
13
24
15
28
10
XC6108
Series
TEST CIRCUITS
Circuit 1
Circuit 2
Circuit 3
Circuit 4
Circuit 5
11
XC6108 Series
TEST CIRCUITS (Continued)
Circuit 6
Circuit 7
Circuit 8
Circuit 9
R=100k (No resistor needed for CMOS output products) VOUT Waveform Measurement Point Cd VSS * No delay capacitance pin available in the XC6108xxxC/D series.
VIN VSEN
12
XC6108
Series
OPERATIONAL EXPLANATION
A typical circuit example is shown in Figure 1, and the timing chart of Figure 1 is shown in Figure 2 on the next page. As an early state, the sense pin is applied sufficiently high voltage (6.0V MAX.) and the delay capacitance (Cd) is charged to the power supply input voltage, (VIN: 1.0V MIN., 6.0V MAX.). While the sense pin voltage (VSEN) starts dropping to reach the detect voltage (VDF) (VSEN>VDF), the output voltage (VOUT) keeps the "High" level (=VIN). * If a pull-up resistor of the XC6108N series (N-ch open drain) is connected to added power supply different from the input voltage pin, the "High" level will be a voltage value where the pull-up resistor is connected. When the sense pin voltage keeps dropping and becomes equal to the detect voltage, an N-ch transistor for the delay capacitance discharge is turned ON, and starts to discharge the delay capacitance. For the internal circuit, which uses the delay capacitance pin as power input, the reference voltage operates as a comparator of VIN, and the output voltage changes into the "Low" level (=VSS). The detect delay time [TDF] is defined as time which ranges from VSEN=VDF to the VOUT of "Low" level (especially, when the Cd pin is not connected: TDF0). While the sense pin voltage keeps below the detect voltage, the delay capacitance is discharged to the ground voltage (=VSS) level. Then, the output voltage maintains the "Low" level while the sense pin voltage increases again to reach the release voltage (VSEN< VDF +VHYS). When the sense pin voltage continues to increase up to the release voltage level (VDF+VHYS), the N-ch transistor for the delay capacitance discharge will be turned OFF, and the delay capacitance will start discharging via a delay resistor (Rdelay). The internal circuit, which uses the delay capacitance pin as power input, will operate as a hysteresis comparator (Rise Logic Threshold: VTLH=VTCD, Fall Logic Threshold: VTHL=VSS) while the sense pin voltage keeps higher than the detect voltage (VSEN > VDF). While the delay capacitance pin voltage (VCD) rises to reach the delay capacitance pin threshold voltage (VTCD) with the sense pin voltage equal to the release voltage or higher, the sense pin will be charged by the time constant of the RC series circuit. Assuming the time to the release delay time (TDR), it can be given by the formula (1). TDR = RdelayxCdxIn (1VTCD / VIN) ...(1) * In = a natural logarithm The release delay time can also be briefly calculated with the formula (2) because the delay resistance is 2.0M(TYP.) and the delay capacitance pin voltage is VIN /2 (TYP.) TDR = 2.0e6xCdx0.69...(2) As an example, presuming that the delay capacitance is 0.68F, TDR is : 2.0e6x0.68e6x0.69 = 938 (ms) * Note that the release delay time may remarkably be short when the delay capacitance is not discharged to the ground (=VSS) level because time described in is short. When the delay capacitance pin voltage reaches to the delay capacitance pin threshold voltage (VCD=VTCD), output of an internal circuit, which uses the delay capacitance pin as power input will be inverted. As a result, the output voltage changes into the "High" (=VIN) level. TDR0 is defined as time which ranges from VSEN=VDF+VHYS to the VOUT of "High" level without connecting to the Cd. While the sense voltage is higher than the detect voltage (VSEN > VDF), the delay capacitance pin is charged until the delay capacitance pin voltage becomes the input voltage level. Therefore, the output voltage maintains the "High"(=VIN) level.
Release Delay Time Chart
Delay Capacitance [Cd] (F) 0.010 0.022 0.047 0.100 0.220 0.470 1.000 Release Delay Time [TDR] (TYP.) (ms) 13.8 30.4 64.9 138 304 649 1380 Release Delay Time [TDR] (MIN. ~ MAX.) (ms) 11.0 ~ 16.6 24.3 ~ 36.4 51.9 ~ 77.8 110 ~ 166 243~ 364 519 ~ 778 1100 ~ 1660
13
XC6108 Series
OPERATIONAL EXPLANATION (Continued)
Figure 1: Typical application circuit example
VIN VSEN RSEN =R1+R2+R3
The circuit which uses the delay capacitance pin as power input.
R1
+
Rdelay
VOUT
VIN
VSEN
R2
-
Vref R3
Cd N-ch transistor for the delay capacitance discharge External Delay Capacitor [Cd]
VSS
* In the XC6108N series (N-ch open drain output), a pull-up resistor for pulling up output is required.
Figure 2: The timing chart of Figure 1
14
XC6108
Series
NOTES ON USE
1. Use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent damage to the device. 2. The power supply input pin voltage drops by the resistance between power supply and the VIN pin, and by through current at operation of the IC. similarly occur. At this time, the operation may be wrong if the power supply input pin voltage falls below the minimum operating voltage range. In CMOS output, for output current, drops in the power supply input pin voltage Moreover, in CMOS output, when the VIN pin and the sense pin are short-circuited and used, oscillation of the circuit may occur if the drops in voltage, which caused by through current at operation of the IC, exceed the hysteresis voltage. Note it especially when you use the IC with the VIN pin connected to a resistor. 3. When the setting voltage is less than 1.0V, be sure to separate the VIN pin and the sense pin, and to apply the voltage over 1.0V to the VIN pin. 4. Note that a rapid and high fluctuation of the power supply input pin voltage may cause a wrong operation. 5. When there is a possibility of which the power supply input pin voltage falls rapidly (e.g.: 6.0V to 0V) at release operation with the delay capacitance pin (Cd) connected to a capacitor, use a schottky barrier diode connected between the VIN pin and the Cd pin as the Figure 3 shown below. 6. In N-ch open drain output, a pull-up resistor connected to the output voltage pin should be 100k-200k.
Figure 3: Circuit example with the delay capacitance pin (Cd) connected to a schottky barrier diode
15
XC6108 Series
TYPICAL PERFORMANCE CHARACTERISTICS
(1) Supply Current vs. Sense Voltage
XC6108C25A GR 2.0 Supply Current: ISS (A)
VIN=3.0V
1.5
Ta=85 25
1.0
0.5
-40
0.0 0 1 2 3 4 5 Sense Voltage: VSEN (V) 6
(2) Supply Current vs. Input Voltage
XC6108C25AGR
VSEN=2.25V
XC6108C25AGR 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40
VSEN=2.75V
1.2
Supply Current: ISS (A)
0.8 0.6 0.4 0.2 0.0 0 1
Ta=85 25
Supply Current: ISS (A)
1.0
Ta=85
25
-40
2 3 4 5 Input Voltage: VIN (V)
6
0
1
2
3
4
5
6
Input Voltage: VIN (V)
(3) Detect Voltage vs. Ambient Temperature
XC6108C25AGR
VIN=4.0V
(4) Detect Voltage vs. Input Voltage
XC6108C25AGR 2.55 Ta=25
2.55
Detect Voltage: VDF (V)
Detect Voltage: VDF (V)
85 2.50
2.50
-40 2.45
2.45 -50 -25 0 25 50 75 A mbient Temperature: Ta ( ) 100
1.0
2.0 3.0 4.0 5.0 Input Voltage: VIN (V)
6.0
16
XC6108
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(5) Hysteresis Voltage vs. Ambient Temperature
XC6108C25A GR 0.20
VIN=4.0V
(6) CD Pin Sink Current vs. Input Voltage
XC6108C25AGR
VSEN=0V, VDS=0.5V
3.0
Cd PIN Sink Current: ICD (mA)
2.5 2.0 1.5 1.0 0.5 0.0
Hysteresis Voltage: VHYS (V)
Ta=-40 25
0.15
0.10
85
0.05 -50 -25 0 25 50 75 A mbient Temperature: Ta ( ) 100
0
1
2 3 4 5 Input Voltage: VIN (V)
6
(7) Output Voltage vs. Sense Voltage
XC6108C25AGR 7.0 6.0 Output Voltage: VOUT (V) 5.0 4.0 3.0 2.0 1.0 0.0 -1.0 0 1 2 3 4 5 6 Sense Voltage: VSEN (V ) 1.0V 4.0V
Ta=25
(8) Output Voltage vs. Input Voltage
XC6108N25AGR
VSEN=VIN, Pull-up=VIN, R=100k
4.0
Output Voltage: VOUT (V)
VIN=6.0V
3.0 Ta=85 2.0 1.0 0.0 -1.0 0 0.5 1 1.5 2 2.5 Input Voltage: VIN (V) 3 25 -40
(9) Output Current vs. Input Voltage
XC6108C25AGR 4.0
VDS(Nch)=0.5V
XC6108C25AGR 0.0
VDS(Pch)=0.5V
Output Current: IOUT (mA)
3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 1
Ta=-40 25
Output Current: IOUT (mA)
3.5
-0.5
Ta=85
-1.0
25
85
-1.5
-40
-2.0 2 3 4 5 Input Voltage: VIN (V) 6 0 1 2 3 4 5 Input Voltage: VIN (V) 6
17
XC6108 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(10) Delay Resistance vs. Ambient Temperature
XC6108C25AGR 4 Delay Resistance: Rdelay (M ) 3.5 3 2.5 2 1.5 1 -50 -25 0 25 50 75 100 Ambient Temperature: Ta ( )
VSEN=6.0V, VCD=0.0V, VIN=5.0V
(11) Release Delay Time vs. Delay Capacitance
XC6108C25A GR 10000 Release Delay Time: TDR (ms) 1000 100 10 1 0.1 0.0001 V IN=1.0V 3.0V 6.0V
Ta=25
TDR=Cdx2.0e6x0.69
0.001 0.01 0.1 Delay Capacitance: Cd ( F)
1
(12) Detect Delay Time vs. Delay Capacitance
XC6108C25A GR 1000 Detect Delay Time: TDF ( s) VIN=6.0V 4.0V 100 3.0V
Ta=25
10 1.0V 1 0.0001
2.0V
0.001 0.01 0.1 Delay Capacitance: Cd ( F)
1
18

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