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| EMIF02-MIC03C2 2 line EMI filter and ESD protection Main product characteristics Where EMI filtering in ESD sensitive equipment is required: Mobile phones and communication systems Computers and printers and MCU Boards Description The EMIF02-MIC03C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The Flip-Chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15 kV. Coated Flip-Chip package (about 20 times real size) Pin configuration (Bump side) Benefits EMI symmetrical (I/O) low-pass filter High efficiency EMI filter (-35 dB @ 900 MHz) Very low PCB space consumption: 1.07 mm x 1.47 mm Very thin package: 0.695 mm Coating resin on back side and lead free package High efficiency in ESD suppression High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging. 321 I2 GND O2 O1 I1 A B C Complies with following standards: IEC 61000-4-2 level 4 input pins 15 kV 8 kV level 1 output pins 2 kV 2 kV (air discharge) (contact discharge (air discharge) (contact discharge MIL STD 883G - Method 3015-7 Class 3 November 2006 Rev 1 www.st.com 1/7 Characteristics EMIF02-MIC03C2 1 Characteristics Figure 1. Basic cell configuration Low-pass Filter Input Output Ri/o = 68 Cline = 100 pF GND GND GND Table 1. Symbol Tj Top Tstg Absolute ratings (limiting values) Parameter Maximum junction temperature Operating temperature range Storage temperature range Value 125 -40 to +85 -55 to +150 Unit C C C Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Electrical characteristics (Tamb = 25 C) Parameters I Breakdown voltage IPP Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between input and output Input capacitance per line Test conditions IR = 1 mA VRM = 3 V per line Tolerance VR = 0 V 68 100 Min 6 Typ 8 500 Max Unit V nA pF IPP VCL VBR VRM IR IRM IRM IR VRM VBR VCL V Symbol VBR IRM RI/O Cline 2/7 EMIF02-MIC03C2 Characteristics Figure 2. 0.00 -5.00 -10.00 S21 (dB) attenuation measurement Figure 3. dB 0.00 -10.00 -20.00 Analog crosstalk measurement dB -15.00 -20.00 -25.00 -30.00 -35.00 -60.00 -30.00 -40.00 -50.00 -40.00 -45.00 -50.00 100.0k -70.00 F (Hz) 1.0M 10.0M 100.0M 1.0G F (Hz) -80.00 100.0k 1.0M 10.0M 100.0M 1.0G Figure 4. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input Vin and one output Vout Figure 5. ESD response to IEC 61000-4-2 (- 15 kV air discharge) on one input Vin and one output Vout Figure 6. C(pF) Line capacitance versus applied voltage 140 120 100 80 60 40 20 VR(V) F=1MHz Vosc=30mVRMS Tj=25C 0 0 1 2 3 4 5 3/7 Characteristics Figure 7. IN1 EMIF02-MIC03C2 Aplac model Rbump Lbump Rmic Lmic Lbump Rbump OUT1 model = D1 model = D2 Rsub GND Lsub GND model = D3 Rbump Lbump model = D1 model = D2 Cgnd Lgnd Rgnd IN2 Rbump Lbump Rmic Lmic Lbump Rbump OUT2 EMIF02-MIC03C2 model Ground return Figure 8. Aplac parameters Model D1 CJO=Cdiode1 BV=7 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.7 VJ=0.6 TT=50n Model D3 CJO=Cdiode3 BV=7 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.12 VJ=0.6 TT=50n Model D2 CJO=Cdiode2 BV=7 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.3 VJ=0.6 TT=50n aplacvar Rmic 68 aplacvar Lmic 10p aplacvar Cdiode1 100pF aplacvar Cdiode2 3.6pF aplacvar Cdiode3 1.17nF aplacvar Lbump 50pH aplacvar Rbump 20m aplacvar Rsub 0.5m aplacvar Rgnd 10m aplacvar Lgnd 50pH aplacvar Cgnd 0.15pF aplacvar Lsub 10pH 4/7 EMIF02-MIC03C2 Ordering information scheme 2 Ordering information scheme EMIF EMI Filter Number of lines Information 3 letters = application 2 digits = version yy - xxx zz Cx Package C = Coated Flip-Chip x = 2: Leadfree Pitch = 500 m, Bump = 315 m 3 Package information Figure 9. Flip-Chip Dimensions 500 m 10 250 m 10 315 m 50 695 m 50 50 0 1.07 mm 50 m Figure 10. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) 1.47 mm 50 m m 15 Figure 11. Footprint recommendation Copper pad Diameter: 250m recommended, 300 m max E xxz y ww Solder stencil opening: 330 m Solder mask opening recommendation: 340 m min for 315 m copper pad diameter 5/7 Ordering information Figure 12. Flip-Chip tape and reel specification Dot identifying Pin A1 location EMIF02-MIC03C2 8 0.3 ST E xxz yww ST E xxz yww ST E xxz yww 0.73 0.05 4 0.1 All dimensions in mm User direction of unreeling In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 4 Ordering information Ordering code EMIF02-MIC03C2 Marking FW Package Flip-Chip Weight 2.3 mg Base qty 5000 Delivery mode 7" Tape and reel 5 Revision history Date 28-Nov-2006 Revision 1 Initial release. Changes 6/7 3.5 0.1 1.75 0.1 4 0.1 O 1.5 0.1 EMIF02-MIC03C2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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