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PREPARED BY: TTti
DATE:
/(6/?7
DATE: /I&/ ~E~TRONIC COMPONENTS GROUP SHARP CORPORATION SPEC~CATIO~J
7-I LLdLl
APPROVED BY: *_I;,* 97, 1 Opto-Electronic Devices Division
DEVICE SPECIFICATION
FOR
Light Emitting Diode
MODEL No.
GL5ZJ302BOS
A
1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (Terminal) * LMeasuring equipment 1 L * Tooling machines * Computers If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, &ain. automobile etc.) * Traffic signals * Gas leakage sensor breakers * Rescue and security equipment * Other safety equipment [I (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) * Nuclear power control equipment * Medical equipment L(4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product.
1
1
CUSTOMERS
APPROVAL M.Katoh, Department General Manager of Engineering Dept.,IH Opto-Electronic Devices Division Electronic Components Group SHARP CORPOR4TION
`DATE:
BY:
DG996030
MODEL No.
Juni16iW
PAGE
GLSZJ302BOS
l/10
GL5ZT302BOS
StAfication
1. Application This specification applies to the light emitting diode device Model No. GL5ZJ302BOS. [AlGaIS (dicing or scribe/brake ty-pe) Orange IED device]
2. Guthne dimensions and pin
co~ections
. . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer
to the attached sheet Page 2.
3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 3-4. 3- 1. Absolute maximum ratings 3-2. Electra-optical characteristics 3-3. Derating Curve 3-4. Characteristics Diagram
4. Reliability .,..................................................... 4-l. Test items and test conditions 4-2. Measurement items and Failure judgement criteria
Refer to the attached sheet Page 5.
5. Incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 6. 5- 1. Applied standard 5-2. Sampling method and level 5-3. Test items, judgement criteria and classifica of defect 5-4. Test items the surface is be applied for flat type, judgement criteria and classifrca of defect
6. Supplement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 7-8. 6-l. Packing 6-2. Luminous intensity rank 6-3. Dominant wavelength rank 6-4. Environment
7. Precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 9- 10. 7-1. Lead forming method 7-2. Notice of installation 7-3. Soldering Conditions .7-4. For cleaning
DG!396030
MODEL No.
Jud16199
PAGE
I
2. Outline dimensions aud-pin connections
Colorless +nspare~Y
GLZJ302BOS
I
2/10
i I I I $`:i: t i t
. o. 4
0 oi
* w
/
:-I
iii iiiQ i ~;~ i -; i ' -I I i i i LL
54NOM 1 I
z z
0
ti ! I _ 0. 5 20. 1 C-J I i z; i C;
i
4
y.
L.
pin connections 0. Anode 0. cathode 2. 4 L-J (Note) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product unit mm Material Lead : (Fe) Cold rolled steel Package : Epoxy resin Finish Lead : Sn plated or wave soldering Drawing No. 51106011 (Note) Unspecified tol. to be k0.21~1
DG996030
MODEL No.
Jun/16/9!
PAGE
GL5ZJ302BOS
3110
3. Ratings and characteristics
(Note 1) Duty ratio=l/lO,Pulse width=O.lms (Note 2) At the positionof 1.6mmfrom the bottom resinpackage
Terminal capacitance V=OV,f=lMHz 60 Ct Viewing Angle 261/2 IF=2OmA 30 (Note 3) Refer to the suplement item 6. regardingthe standardof rank classification.
-
pF deg.
3-3. Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
Current
Derating
Curve
120 z .5 iz 100 g 80 ,m 3 60
-25
0 Amb i ent
25
50
75 85 100 Ta ("cl
125
-25
0 Ambient
25
50 Temperature
75"*100 TarC)
125
Temperature
DG996030 MODEL No.
Jun/16/% PAGE
4110
GLZJ302BOS
Peak 1000
Forward
CurrFnt
vs.
Duty
Ratio (Ta?Z!?C)
I I ""`I// I i I /lllll
II /llllllll I /II/
I I/lil/ll
II
III!1
i II
loo
l/100
l/10 Duty Raito
1 DR
10
3-4. Characteristics
Forward
Diagram(typ)
Current
(Note 1)
Relative vs.Forward Voltage (Ta=25"C) vs. Luminous Ambient Intensity Temperature ( I F=2GmA)
100
10
I
I
I
,
I
I
I
I
1
1;:
1 / ,
`,`,:;,,,I
,I / ! / ! 4 /
0. 1 1 1.2
III III
1.4 Forward 1.6
/I I!
II II
1.8 2 2.2 VFW
I I I I.
2.4 2.6 -60 -40-20 Ambient 0 20 40 Temprature 60 80 Ta("C)-
100
120
Voltage
Relative
Luminous
Intensity
vs.
Frorard
Voltage
(Ta= 1000
Q5"c)
100
10
1
0. 1
0.01 0. 1 Forward 1 Current 10 IFhA) 100
(Note 1) Above characteristic
&ta are typical data ad not a guarantteed &u.
DC3996030
Junl16/94
MODEL No. GL5a302BOS
PAGE S/10
4. Reliability The reliability of productsshallbe satisfiedwith itemslistedbelow.
Al-1. Test itemsand test conditions
Test items Solderability Soldering temperature Mechanicalshock Variable frequency vibration Terminal strength (Tension) Terminalstrength (Bending) Temperature cycling High temp.andhigh humidity storage
Test conditions 230*5"c. 5s Prior disposition: Dip in rosinflux 260tPC,
5s
Confidencelevel: 909 6 Samples (n) LTPD Defective (C) (Q/o) 3 n=ll, C=O n=ll,C=O n=ll. C=O n=ll, C=O n=ll, C=O n=ll,C=O n=22, C=O n=22, C=O n=22, C=O n=22, C=O n=22, C=O 20 20 20 20 20 20 10 10 10 10 10
15 OOOm/sz, OSms, 3times/ iSgtY,kZ direction 2OOm/s*, to 2 Oooto lOOHz/sweep 4min. 100 for .4times/fX+Y,iZ direction Weight:lON, S/each terminal Weight:SN, 0" - 90" -+ O"* -90" + 0" /each terminal -4O"c(3Omin)~+lOO"c(3~in),3O cycles Ta=+60%, 9O%RH,t=lOOOh
tigh temperature storageTa=lOO"C, t=lOOOh x)w temperature storageTa=-40"C, t=lOOOh Operationlife Ta=25"c. IFMAX, t=1000h *3
4-2. Measurement itemsand Failurejudgementcriteria * 1 Measurement Forward voltage Reversecurrent Luminousintensity SpbOl
vF
Failurejudgementcriteria *2 v, > U.S.L. x 1.2 I, > U.S.L. x 2.0 Iv > The fist stage value X 2.0 or The first stagevalue X 0.5 > Iv
IR
Iv
Z Solderability : Sol&r shallbe adhereat the areaof 95% or moreof dippedportion. z Terminalstrength: Packageis not destroyed,andterminalis not slack. * 1: Measuringcondition is in accordancewith specification. *2: U.S.L. is shownby Upper Specification Limit. *3: IF MAX.is shownby forward current of absolute maximumratings.
DG996030
MODEL No.
Jun/W!X
PAGE
GL5ZJ302BOS
6/10
5. Incoming inspection 5-1. Applied standard IS0 2859-l : 5-2. Samplingmethodand level : A single samplingplan,notmalinspectionlevel II : AQL Major defect : 0.065% Minor defect : 0.4% 5-3. Test items, judgementcriteria and class&a of defect No. 1 2 3 4 5 6 7 8 9 LO 11 12 13 Test items Disconnection Positionof Cuttingoff rim Reverseterminal Outline dimensions Characteristics Cut off the rim Foreign substance Scratch Void Uneven densityof materialfor scattering Unbalanced center Burr Insertionpositionof terminal judgementcriteria Not emit light Different from dimension Different from dimension Not satisfy outline specification Over the limit value of specificationat V,, Ia, andI,, Exceed -0.2mm White pint : Exceed 4 0.3mm (on top view) Black point : Exceed 4 0.3mm (on top view) String fotm : Exceed 3.Omm(on top view) Exceed o 0.3mmor O.lmm x l.Omm(on top view) Exceed Q0.3mm (on top view) Extiemely
uneven
classificaof deft
Major defect
Minor defect
density
Exceed M.25mrn from package center Exceed +0.2mm againstprovided dimension Insertion positionof terminal
5-4. Test itemsthe surfaceis be appliedfor flat type, judgementcriteria andclassificaof defect No. 14 15 Test items Chappedthesurface Hollow the surface judgementcriteria The surfacechappedis striking for seethe lamptop The surfacehollow is striking for seethe lamptop classificaof defect Minor defect
DG996030
MODEL No.
Juni16/9!
PAGE
GLEZJ302BOS
7110
6. Supplement 61. Packing 6-l-l. Inner package Put 25Cpcs same the luminousintensity rank productsinto pack andput following label by pack. Productweight : 0.28g (One Roduct.Typ.) (Indication labelsample) SHIPMEHT TABLE PART No. GLJ~J~O~BOS * Model number *clcl cloonn 250 +-- Quantity of products QUANTITY --KA99B19 * Lot number* LOT No. @co 0 0 0 G-C tLuminousintensity rank dominant wavelengthrank SHARP' MADEIN JAP.4N + Production country 0 @ @ @ @ Productionplant code(to be indicated alphabetically) Supportcode Year of production(thelast two figures of the year) Month of production (to be indicatedalphabeticallywith Januarycorresponding A) to Date of production(01w 3 1)
6-l-2. Outer package Put 8 packs (the sameluminousintensity rank) into outer package. (approximately670g per one outer package) 6-l-3. Outer package line dimension out Width: 14Omm,Depth : 225rnm, Hight: 9Omm 6-2.Luminous intensity rank (Note 1) Rank Luminousintensity K 383 746 L 552 1075 M 795 1548 (Ta=25"c ) Condition It92OnLA
unit mcd
(Note 1) Tolerance:fl5% In regardto luminousintensity , the following rankingshallbe carriedout. However the quantity of eachrank shallnot be pre scribed. In caseof the distribution of the luminousintensity shift to high, at that point new upperrank is prescribedandlower rank is delete.
1
X 1 623.5 627.0 1 I I (Note 2) The condition of measurement The measurement the light emissionfrom the front sideof lamp. : of This rank value is the setting value of whenthat classities the rank and be not a guaranteevalue. it Also I shall not ask the delivery ratio of eachrank.
DG996030
MODEL No.
Jun/16/94
PAGE 8/10
I
GL5a302BOS
-6-4. Environment 641. Ozonosphere destructive chemicals. (1) The device doesn't contain following substance. (2) The device doesn't have a production line whose process requires following substance. Restricted part: CFCsJlalones,CC&,Trichloroetha&Methychlorofom@ 642. Bromic non-burning materials The &vice doesn't contain bromic non-burning materials(PBBOs,PBBs)
DG996030
MODEL, No.
Juni16i99
PAGE
GLZJ302BOS
9110
7. Precautions use for
7 - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering `7 - 2. Notice of installation 7-2-l installation on a P W B Whenmounting an LED lamp on a PwB,do not apply physical stress to the lead pins. The lead pin pitch should match the PIB pin-hole pitch:absolutely avoid widening or narrowing the lead pins. Whenpositioning an LED lamp,basically employ an LED with tie-bar cut or use a spacer. 7-2-2 `#hen an LED1 is mounted directly on a P W B If the bottom face of an LED lamp is mounted directly on single-sided PWB,the base of the lead pins maybe subjected to physical stress due to P'#Bwarp, cutting or clinching of lead pins. Prior to use. be sure to check that no disconnection inside of the resin or damageto resin etc.,is found-when an LED lamp is mounted on a double-sided PIB,the heat during soldering affects the resin;therefore.keep the LED lamp more that 1.6mmafloat above the PIVB. 7-2-3 Installation using a holder During an LED lamp positioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat,mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 Installation to-the case Do not fix part C with adhesives when fixed to the case as shown in Figure.A hole of the case should be designed not to subject the inside of resin to any undue stress.
l l
NG
Good
DG996030
MODEL, No.
Junl16/99
PAGE
GL5ZJ302BOS
lO/lO
7 7 3. S oldering Conditions Solder the lead pins under the following conditions Conditions Type of Soldering 295'C*5"c, within 3 seconds 1. Manual soldering 260Ct5"c. within 5 seconds 2. Wave soldering Preheating 70C to 8O"C, within 30 seconds 3. Auto soldering Soldering 245"c*S"c, within 5 seconds (Note) Avoid dipping resin into soldering bath Avoid applying stress to lead pins while they are heated-For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection way occur.
iron
7 - 4. For cleaning
(1)
Solvent cleaning : Solvent temperature 45C or less Immersion for 3 min or less
( 2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output, cleaning time,PIB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. ( 3 1 Applicable solvent Ethyl alcohoLYethy1 alcohol, Isopropyl alcohol
In case when the other solvent is used,there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition.

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