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 MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document by MOCZ500/D
GlobalOptoisolatorTM
MOCZ500
Motorola Preferred Device
Mini Zero-Crossing AC SSR
This device consists of a gallium arsenide infrared emitting diode optically coupled to a zero-cross triac circuit and a power triac. It is capable of driving loads up to 500 mA rms on AC voltages from 20 to 280 V rms. * * * * * * * * * * * * * Provides Normally Open AC Output with 500 mA Rating @ 40_C Small Outline, Standard 6-PIN DIP Package Simplified Logic Control of 240 Vac Power High Input-Output Isolation of 7500 Vac (rms) 7 Amp Single Cycle Surge Capability Wide Load Power Factor Range 0.1-1 Low Input/Output Capacitance * * * *
OPTOISOLATOR ZERO CROSS TRIAC OUTPUT
Applications: Logic to AC Line Interface Microprocessor to AC Line Peripheral Industrial Controls EM Relays and Contactors Small AC Motor Drives Incandescent Lamp Drive Appliance Solenoids Appliance Actuators Appliance Fan Motors Appliance Lights
CASE 730J-01 STYLE 1
PINOUT
Rating Symbol Value Unit 1 2 VR IF 6 50 V mA 3 MOCZ500 4 6 1. LED Anode 2. LED Cathode 3. Not Connected 4. MT2 6. MT1 Connected to Internal Triac Heat Spreader
MAXIMUM RATINGS (TA = 25C unless otherwise noted)
INPUT LED Reverse Voltage Forward Current -- Continuous OUTPUT TRIAC Off-State Output Terminal Voltage (1) Peak Repetitive Surge Current (1 Cycle) Main Terminal Fusing Current (t = 8.3 ms) On-State Current Range Load Power Factor Range TOTAL DEVICE Isolation Surge Voltage (2) Total Power Dissipation @ TA = 40C (Device Soldered on PCB) Junction Temperature Range Ambient Operating Temperature Range Ambient Operating Relative Humidity @ TA = 85C Storage Temperature Range Soldering Temperature (10 sec) VISO PD TJ TA RHA Tstg TL 7500 600 - 40 to +125 - 40 to +85 85 - 40 to +125 260 Vac(pk) mW Cathode C C % C C Anode 1 2 VDRM ITSM I2T IT(rms) pF 600 7 0.4 0.030 to 0.500 0.1 - 1.0 V A A2sec A --
COUPLER SCHEMATIC
LED Drive Triac 6 MT1
*
4
MT2
* ZERO VOLTAGE * ACTIVATION
1. Test voltages must be applied within dv/dt rating. 2. Input-Output isolation voltage, VISO. is an internal device dielectric breakdown rating. For this test, pins 1 and 2 are common and pins 4 and 6 are common.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
(c)Motorola Optoelectronics Device Data Motorola, Inc. 1997
1
MOCZ500
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction to Air (Device Soldered on PCB) Thermal Resistance, Junction to Case (Pin 4) (Device Soldered on PCB) Symbol RJA RJC Value 130 40 Unit
_C/W _C/W
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic INPUT LED Reverse Leakage Current (VR = 6 V) Forward Voltage (IF = 10 mA) OUTPUT TRIAC Leakage with LED Off @ TA = 85C (VDRM = 600 V) Critical Rate of Rise of Off-State Voltage (Static) (1) (Vp = 400 V) LED On, Driver Holding Current COUPLED LED Trigger Current Required to Latch Output (2) (3) (Main Terminal Voltage = 5 V) On-State Voltage (IT = 500 mA) Inhibit Voltage (IF = IFT) Commutating dv/dt Common-Mode Input-Output dv/dt Input-Output Capacitance Isolation Resistance @ 500 Vdc IFT(on) VTM VINH dv/dt (c) dv/dt (cm) CISO RISO -- -- -- 10 40,000 -- 1012 -- 1.2 10 -- -- -- -- 10 1.5 20 -- -- 1 -- mA V V V/s V/s pF Ohms IDRM dv/dt(s) IH1 -- -- -- -- 2,000 150 100 -- 500 A V/s A IR VF -- -- 0.05 1.2 100 1.5 A V Symbol Min Typ Max Unit
1. Additional dv/dt information, including test methods, can be found in Motorola applications note AN1048/D, Figure 40. 2. All devices are guaranteed to trigger at as IF value less than or equal to the max IFT. Therefore, the recommended operating IF lies between the device's maximum IFT(on) limit and the Maximum Rating of 60 mA. 3. Current-limiting resistor required in series with LED.
ENVIRONMENTAL TEST REQUIREMENTS
Test Autoclave Moisture Resistance Temp Cycle Resistance to Solder Heat Lead Pull Test Conditions TA = 121C, RH = 100%, P = 15 PSIG, 48 Hr. Mil-Std-883, Method 1004 TA = -40/+125C, Air to Air, Dwell
w15 min., Transfer v5 min., 200 Cycles
Mil-Std-750, Method 2031, 260C followed by VISO Mil-Std-750, Method 2036, Condition A, 2 lbs., 1 min.
LIFE TEST REQUIREMENTS
Test Conditions Test High Temperature, Reverse Bias High Humidity, High Temperature, Reverse Bias Environment TA = +100C TA = +85C RH = 85% ton = 2 min. toff = 2 min. TA = +25C Human Body Model & Machine Models 1 & 2 Bias VTM = 280 Vac VTM = 100 Vdc Pin 4 = + Pin 6 = - IF = 50 mA ITM = 60 mA N/A Duration 1000 Hr. 500 Hr.
Intermittent Operating Life
1000 Hr.
ESD
N/A
2
Motorola Optoelectronics Device Data
MOCZ500
TYPICAL ELECTRICAL CHARACTERISTICS
60 IF, FORWARD LED CURRENT (mA) 50 40 30 20 10 0 - 40 1.8
VF, FORWARD VOLTAGE (V)
1.6
1.4 TA = - 40C 25C
1.2
1 0.8
85C
- 20
0 20 40 60 TA, AMBIENT TEMPERATURE (C)
80
100
1
10 IF, FORWARD CURRENT (mA)
Figure 1. Maximum Allowable Forward LED Current versus Ambient Temperature IT = IT Max
14 IFT, FORWARD TRIGGER CURRENT (mA) IT, TERMINAL CURRENT (mA) 12 GUARANTEED 10 8 6 TYPICAL 4 2 - 40 500
Figure 2. LED Forward Voltage versus LED Forward Current
400
300
200
100
- 20
0 20 40 60 TA, AMBIENT TEMPERATURE (C)
80
100
0 - 40
- 20
0 20 40 60 TA, AMBIENT TEMPERATURE (C)
80
100
Figure 3. Forward Trigger Current versus Ambient Temperature
1.4 V TM, MAIN TERMINAL VOLTAGE (V) IDRM , LEAKAGE CURRENT (A) 1.3 1.2 1.1 1 25C 0.9 0.8 0.01 85C 0.1 ITM, MAIN TERMINAL CURRENT (A) 1 TA = - 40C 10
Figure 4. RMS ON-State Current versus Ambient Temperature
1
0.1
0.01
0.001 - 40
- 20
0 20 40 60 TA, AMBIENT TEMPERATURE (C)
80
100
Figure 5. Main Terminal Voltage versus Main Terminal Current
Figure 6. Typical Leakage Current versus Ambient Temperature
Motorola Optoelectronics Device Data
3
MOCZ500
TYPICAL ELECTRICAL CHARACTERISTICS (continued)
300 11.5
IH, HOLDING CURRENT (A)
200
VIH, INHIBIT VOLTAGE (V) - 20 0 20 40 60 TA, AMBIENT TEMPERATURE (C) 80 100
250
11
10.5
150
10
100
9.5
50 - 40
9 - 40
- 20
0 20 40 60 TA, AMBIENT TEMPERATURE (C)
80
100
Figure 7. Holding Current versus Ambient Temperature
Figure 8. Inhibit Voltage versus Ambient Temperature
APPLICATION CONSIDERATIONS
Input Drive Circuit The MOCZ500 SSR is guaranteed to trigger with an input current of 10 mA at 25C. This trigger current increases with lower ambient temperatures as shown on Figure 3 Forward Trigger Current (IFT) versus Ambient Temperature. When the input drive circuit is capable to supply the MOCZ500 input LED trigger current, only a current limiting resistor in series with the LED is required. TTL, DTL and microcontrollers with enhanced current capability output ports are able to meet this requirement. Most CMOS logic circuits and Microcontroller output ports are not rated to sink or source currents required to trigger the MOCZ500. In this case a drive circuit is required as shown in Figure 10 or a TTL buffer interface circuit as shown in Figure 9.
VCC R1 VCC
R1 MOCZ500
R2 Vin Q1
Figure 10. Noninverting Discrete NPN Buffer and Level Shifter
VCC
R1 MOCZ500 TTI/DTL R1 for VCC (low) 4.5 V, IFT = 10 mA, VF LED = 1.2 V, VOL = 0.5 V R1 = (4.5 V - 1.2 V - 0.5 V): 10 mA = 280 Choose 270 P Rs R2 Cs Q1 AC LINE LOAD
Figure 9. Input Drive Circuit Snubber Circuit Snubberless operation of resistive loads is possible, but snubbers are recommended for all applications. A typical application is shown in Figure 11. The snubber attenuates the high kickback voltages and commutating dv/dt generated by inductive loads during the turn off of the SSR. It also protects the SSR from line transients generated elsewhere within the equipment (for example inductive loads switched by mechanical contacts such as relays manual on/off switches etc.) or outside the equipment such as air conditioners, electrical heaters and motors.
Buffer Circuit R1 = (VCC - VFLED - Vsat Q1): IF MOCZ500 R2 = 10 k Q1 = General Purpose Trans. NPN Typical Snubber circuit: For inductive and resistive loads Rs = 45 Cs = 0.01 F
Figure 11. Typical Application with an P Output Buffer
4
Motorola Optoelectronics Device Data
MOCZ500
Snubbers are also necessary to pass noise immunity tests such as IEC1000 4-4 for fast transients. In this test fast rising high voltage spikes are superimposed onto the line voltage to simulate AC line transients. Switching Loads with Currents Below the Minimum Current Rating The MOCZ500 is capable to switch any inductive or resistive load within its rating of minimum 30 mA and a maximum of 500 mA RMS. At operating currents below the minimum specified value the Power triac remains in the off state and the triac driver carries the current. This may cause a problem, because the triac driver has a significant lower commutating dv/dt than the power triac. For loads below 30 mA AC rms a snubber is mandatory. Evaluations with various low current inductive and resistive loads concluded that a snubber of R = 100 and C = 10 nF is sufficient.
PAD FOR POWER DISSIPATION
ENLARGED PAD FOR IMPROVED POWER DISSIPATION
Motorola Optoelectronics Device Data
OOOOOOOO OOOOOOOO OOOOOOOO OOOOOOOO OOOOOOOO OOOOOOOO OOOOOOOO OOOOOOOO OOOOOOOO OOOOOOOOOOOOOOOO OOOOOOOO OOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOO
CREEPAGE AND CLEARANCE DISTANCE FOR FUNCTIONAL ISOLATION (3.5mm APPLIANCES JAPAN)
CREEPAGE AND CLEARANCE DISTANCE FOR SAFE ISOLATION (8mm FOR APPLIANCES)
Figure 12.
5
MOCZ500
Thermal Considerations Heat generated inside the MOCZ500's power triac is transferred through the leads to the circuit board where it is dissipated. It is therefore important to solder all leads to the circuit board. Pin 4 is thermally and electrically direct connected to the Power triac and carries the highest amount of thermal energy. For loads which approach the maximum current rating of the SSR it is advisable to layout the pad size for pin 4 as large as possible. See Figure 12 which considers thermal and Regulatory requirements on a PCB. Regulatory Safety Considerations The MOCZ500 is designed to meet the National and International Regulatory requirements for safe isolation between input and output and functional isolation creepage and clearance distances between the AC output pins. Many equipment standards demand a creepage and clearance distance between input and output circuit of 8mm and a thickness through insulation of 0.4mm (16 mil). All Motorola Optocouplers do meet the thickness through insulation requirement. Product with lead bend option "T" meets the creepage path requirement. The most stringent requirement for creepage and clearance between the AC output pins is 3.5mm. Figure 12 shows a PCB pattern layout which meets the regulatory requirements for 115 Vrms and 240 Vrms supply line applications.
OUTLINE DIMENSIONS
-A-
6 4
-B-
1 3
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. DIM A B C D E F G J K L M N STYLE 1: PIN 1. 2. 3. 4. 5. 6. INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.008 0.012 0.100 0.150 0.300 BSC 0_ 15 _ 0.015 0.100 MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.21 0.30 2.54 3.81 7.62 BSC 0_ 15_ 0.38 2.54
F
4 PL
N
C
L
-T-
SEATING PLANE
K J M D 5 PL 0.13 (0.005)
M 5 PL
G E
5 PL
0.13 (0.005)
M
M
TB
M
A
M
TA
B
M
LED ANODE LED CATHODE NC MAIN TERMINAL ABSENT MAIN TERMINAL
CASE 730J-01 ISSUE O
6
Motorola Optoelectronics Device Data
MOCZ500
OUTLINE DIMENSIONS (continued)
-A-
6
4
-B-
1 3
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. INCHES MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.21 0.30 2.54 3.81 10.16 10.80 0.38 1.02 MILLIMETERS MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.008 0.012 0.100 0.150 0.400 0.425 0.015 0.040
F
4 PL
N
C
L
-T-
DIM A B C D E F G J K L N
SEATING PLANE
K G
E
5 PL
D 5 PL 0.13 (0.005)
J
M
TA
M
B
M
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
LED ANODE LED CATHODE NC MAIN TERMINAL ABSENT MAIN TERMINAL
CASE 730K-01 ISSUE O
-A-
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
6
4
-B-
1 3
S
DIM A B C D E F G H J K L S
F
4 PL
H
C
L
G E
5 PL
-T- J K 5 PL 0.13 (0.005)
M M SEATING PLANE M
INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.020 0.025 0.008 0.012 0.006 0.035 0.320 BSC 0.332 0.390
MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.51 0.63 0.20 0.30 0.16 0.88 8.13 BSC 8.43 9.90
D 5 PL 0.13 (0.005)
TB
A
M
TA
M
B
M
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
LED ANODE LED CATHODE NC MAIN TERMINAL ABSENT MAIN TERMINAL
CASE 730L-01 ISSUE A
Motorola Optoelectronics Device Data
7
MOCZ500
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8
MOCZ500/D Motorola Optoelectronics Device Data


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