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DS2906SZ
DS2906SZ
Rectifier Diode
Replaces July 2000 version, DS4186-4.1 DS4186-5.0 October 2001
FEATURES
s s
KEY PARAMETERS VRRM 4000V IF(AV) 5651A IFSM 83000A
Double Side Cooling High Surge Capability
APPLICATIONS
s s s s s s
Rectification Freewheel Diode DC Motor Control Power Supplies Welding Battery Chargers
VOLTAGE RATINGS
Type Number Repetitive Peak Reverse Voltage VRRM V Conditions
DS2906SZ40 4000 DS2906SZ39 3900 DS2906SZ38 3800 DS2906SZ37 3700 DS2906SZ36 3600 DS2906SZ35 3500 Lower voltage grades available
VRSM = VRRM + 100V Outline type code: Z See Package Details for further information. Fig. 1 Package outline
ORDERING INFORMATION
When ordering, select the required part number shown in the Voltage Ratings selection table, e.g.: DS2906SZ39 Note: Please use the complete part number when ordering and quote this number in any future correspondance relating to your order.
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DS2906SZ
CURRENT RATINGS
Tcase = 75oC unless otherwise stated Symbol Double Side Cooled IF(AV) IF(RMS) IF Mean forward current RMS value Continuous (direct) forward current Half wave resistive load 5651 8877 8208 A A A Parameter Conditions Max. Units
Single Side Cooled (Anode side) IF(AV) IF(RMS) IF Mean forward current RMS value Continuous (direct) forward current Half wave resistive load 3707 5821 4976 A A A
Tcase = 100oC unless otherwise stated Symbol Double Side Cooled IF(AV) IF(RMS) IF Mean forward current RMS value Continuous (direct) forward current Half wave resistive load 4350 6830 6160 A A A Parameter Conditions Max. Units
Single Side Cooled (Anode side) IF(AV) IF(RMS) IF Mean forward current RMS value Continuous (direct) forward current Half wave resistive load 2795 4390 3640 A A A
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DS2906SZ
SURGE RATINGS
Symbol IFSM I2t IFSM I2t Parameter Surge (non-repetitive) forward current I2t for fusing Surge (non-repetitive) forward current I2t for fusing Conditions 10ms half sine; Tcase = 150oC VR = 50% VRRM - 1/4 sine 10ms half sine; Tcase = 150oC VR = 0 Max. 66.5 22.0 x 106 83 34.5 x 106 Units kA A2s kA A2s
THERMAL AND MECHANICAL DATA
Symbol Parameter Conditions Double side cooled Rth(j-c) Thermal resistance - junction to case Single side cooled Cathode dc Clamping force 83.0kN with mounting compound Forward (conducting) Tvj Virtual junction temperature Reverse (blocking) Tstg Storage temperature range Clamping force -55 75.0 150 150 91.0
o
Min. dc Anode dc -
Max. 0.0065 0.013 0.013 0.001 0.002 160
Units
o
C/W
o
C/W C/W C/W C/W
o
o
Double side Single side
o
Rth(c-h)
Thermal resistance - case to heatsink
o
C
C C
o
kN
CHARACTERISTICS
Symbol VFM IRM VTO rT Parameter Forward voltage Peak reverse current Threshold voltage Slope resistance Conditions At 3000A peak, Tcase = 25oC At VRRM, Tcase = 150oC At Tvj = 150C At Tvj = 150C Min. Max. 1.06 400 0.78 0.0763 Units V mA V m
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DS2906SZ
CURVES
8000
7000
7000 Instantaneous forward current, IF - (A)
6000
6000
5000
Mean power dissipation - (W)
5000
4000
4000
3000
3000
Tj = 150C
Tj = 25C
2000
2000
1000
1000
0 0.5
0
0.6 0.7 0.8 0.9 1 1.1 1.2 Instantaneous forward voltage, VF - (V) 1.3 1.4
dc 1/2 wave 3 phase 6 phase 0 1000 2000 3000 4000 5000 6000 Mean on-state current, IT(AV) - (A)
Fig. 2 Maximum (limit) forward characteristics VFM Equation:VFM = A + Bln (IF) + C.IF+D.IF Where
Fig. 3 Power loss curves A = -0.01591 B = 0.113682 C = 8.04 x 10-5 D = -0.00284 these values are valid for Tj = 125C for IF 500A to 7000A
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DS2906SZ
16000
350
14000
Reverse recovery current, IRR - (A)
300
12000
Stored charge, Qs - (C)
250
10000
200
8000
150
6000
100
4000
2000
50
0 0
1 2 3 4 5 6 7 Rate of decay of forward current, dIf/dt - (A/s)
8
0 0
1 2 3 4 5 6 7 Rate of decay of forward current, dIf/dt - (A/s)
8
Fig. 4 Stored charge
Fig. 5 Reverse recovery current
0.1
Conduction
Effective thermal resistance Junction to case C/W Double side 0.0065 0.0072 0.0073 0.0076 Single side 0.013 0.0137 0.0138 0.0141
d.c. Halfwave 3 phase 120 6 phase 60
Anode side cooled
Thermal impedance - (C/W)
0.01 Double side cooled
0.001
0.0001 0.001
0.01
0.1 1 Time - (s)
10
100
Fig. 6 Maximum (limit) transient thermal impedance junction to case - (C/W) 5/7
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DS2906SZ
PACKAGE DETAILS
For further package information, please contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
Holes O3.6 0.5 x 2.0 deep (One in each electrode)
Cathode O151 max O100
37.5 max
O100 O148 max Anode Nominal weight: 2800g Clamping force: 83kN 10%
Package outline type code: Z
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DS2906SZ
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of `T' 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or Customer Services.
http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2001 Publication No. DS4186-5 Issue No. 5.0 October 2001 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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