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FOD815 Series 4-Pin High Operating Temperature Photodarlington Optocoupler
May 2006
FOD815 Series 4-Pin High Operating Temperature Photodarlington Optocoupler
Features
Applicable to Pb-free IR reflow soldering Compact 4-pin package High current transfer ratio: 600% minimum C-UL, UL, and VDE approved High input-output isolation voltage of 5000Vrms Higher operating temperature (versus H11B815)
tm
Applications
Power supply regulators Digital logic inputs Microprocessor inputs
Description
The FOD815 consists of a gallium arsenide infrared emitting diode, driving a silicon photodarlington output in a 4-pin dual in-line package.
Functional Block Diagram
ANODE 1
4 COLLECTOR
4
CATHODE 2 3 EMITTER
1
Absolute Maximum Ratings (TA = 25C Unless otherwise specified.)
Symbol
TOTAL DEVICE TSTG TOPR TSOL PTOT INPUT IF P OUTPUT VCEO VECO IC PC Collector-Emitter Voltage Emitter-Collector Voltage Collector Current Collector Power Dissipation 35 6 80 150 V V mA mW Forward Current Power Dissipation 50 70 mA mW Storage Temperature Operating Temperature Lead Solder Temperature Total Power Dissipation -55 to +125 -30 to +105 260 for 10 sec 200 C C C mW
Parameter
Value
Units
(c)2006 Fairchild Semiconductor Corporation
1
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FOD815 Series Rev. 1.0.4
FOD815 Series 4-Pin High Operating Temperature Photodarlington Optocoupler
Electrical Characteristics (TA = 25C Unless otherwise specified.)
Individual Component Characteristics Symbol
INPUT VF Ct OUTPUT ICEO BVCEO BVECO Collector Dark Current Collector-Emitter Breakdown Voltage Emitter-Collector Breakdown Voltage VCE = 10V, IF = 0 IC = 0.1mA, IF = 0 IE = 10A, IF = 0 - 35 6 - - - 1 - - A V V Forward Voltage Terminal Capacitance IF = 20mA V = 0, f = 1kHz - - 1.2 50 1.4 250 V pF
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Transfer Characteristics (TA = 25C Unless otherwise specified.) Symbol DC Characteristic
IC CTR VCE(sat) fC tr tf Collector Current Current Transfer Ratio(1) Collector-Emitter Saturation Voltage Cut-Off Frequency Response Time (Rise) Response Time (Fall) IF = 20mA, IC = 5mA VCE = 5V, IC = 2mA, RL = 100, -3dB VCE = 2 V, IC = 10mA, RL = 100
Test Conditions
IF = 1mA, VCE = 2V
Min.
6 600 - 1 - -
Typ.
- - 0.8 6 60 53
Max.
75 7,500 1 - 300 250
Unit
mA % V KHz s s
Isolation Characteristics Symbol
VISO Riso Cf
Characteristic
Input-Output Isolation Voltage Isolation Resistance Floating Capacitance
Test Conditions
f = 60Hz, t = 1 min, II-O 2A DC500V 40~60% R.H. V = 0, f = 1MHz
Min.
5000 5x1010 -
Typ.
- 1x1011 0.6
Max.
- - 1
Units
Vac(rms) pF
Note: 1. Current Transfer Ratio (CTR) = IC/IF x 100%.
2 FOD815 Series Rev. 1.0.4
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FOD815 Series 4-Pin High Operating Temperature Photodarlington Optocoupler
Typical Electrical/Optical Characteristic Curves (TA = 25C Unless otherwise specified.)
60 FORWARD CURRENT IF (mA) 50 40 30 20 10 0 -30 COLLECTOR POWER DISSIPATION PC (mW) Fig. 1 Forward Current vs. Ambient Temperature Fig. 2 Collector Power Dissipation vs. Ambient Temperature 200
150
100
50
0 -30 0 25 50 75 100 125 AMBIENT TEMPERATURE TA (C)
100 125 AMBIENT TEMPERATURE TA (C)
0
25
50
75
Fig. 3 Collector-Emitted Saturation Voltage vs. Forward Current 8 COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V)
5mA 7mA
Fig. 4 Forward Current vs. Forward Voltage 500
FORWARD CURRENT IF (mA)
7 6 5 4 3 2 1 0 0
30mA
50mA
Ta = 25C 200 100 50 20 10 5 2 1
Ta = 75C 50C
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 FORWARD CURRENT IF (mA)
Ic = 0.5mA
1mA 3mA
25C 0C - 25C
0
0.5
1.0
1.5
2.0
2.5
3.0
FORWARD VOLTAGE VF (V)
CURRENT TRANSFER RATIO CTR ( %)
2000
Fig. 5 Current Transfer Ratio vs. Forward Current 100 VCE = 2V Ta = 25C COLLECTOR CURRENT IC (mA)
Fig. 6 Collector Current vs. Collector-Emitter Voltage Ta = 25C 80 IF = 10 mA Pc(MAX.) 5mA 40 2mA 20 1mA
1600
1200
60
800
400
0 0.1
0.2
0.5
1
2
5
10
0 0
1
2
3
4
5
FORWARD CURRENT IF (mA)
COLLECTOR-EMITTER VOLTAGE VCE (V)
3 FOD815 Series Rev. 1.0.4
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FOD815 Series 4-Pin High Operating Temperature Photodarlington Optocoupler
Typical Electrical/Optical Characteristic Curves (TA = 25C Unless otherwise specified.)
Fig. 7. Relative Current Transfer Ratio vs. Ambient Temperature
COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V) 150 RELATIVE CURRENT TRANSFER RATIO (%)
Fig. 8 Collector-Emitter Saturation Voltage vs. Ambient Temperature
1.0 0.8 0.6 0.4 0.2 0 -25 0 25 50 75 100 AMBIENT TEMPERATURE TA (C)
IF = 5mA VCE = 2V
100
IF = 20mA IC = 5mA
50
0 -30
0 25 50 75 100 AMBIENT TEMPERATURE TA (C)
COLLECTOR DARK CURRENT ICEO (A)
Fig. 9 Collector Dark Current vs. Ambient Temperature
10-5 500
Fig. 10. Response Time vs. Load Resistance
VCE = 2V 200 IC = 10mA
RESPONSE TIME (s)
tr tf
VCE = 20V
10-6 10-7 10-8 10-9 10-10 10-11 -25
Ta = 25C 100
50 20 10 5 2 1 0.5
td
ts
0 25 50 75 100 AMBIENT TEMPERATURE TA (C)
0.2 0.05
0.1 0.2
0.5
1
2
5
10
LOAD RESISTANCE RL (k)
Fig. 11. Frequency Response
VCE = 2V IC = 2mA Ta = 25C
Test Circuit for Response Time
Vcc Input
RD RL
VOLTAGE GAIN AV (dB)
0
Input Output 10% Output 90% td ts tr tf
-10
RL=10k 1k 100
Test Circuit for Frequency Response Vcc
-20 0.02 0.1 1 10 100 RD RL FREQUENCY f (kHz)
Output
4 FOD815 Series Rev. 1.0.4
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FOD815 Series 4-Pin High Operating Temperature Photodarlington Optocoupler
Package Dimensions (Through Hole)
0.312 (7.92) 0.288 (7.32)
Package Dimensions (Surface Mount)
0.312 (7.92) 0.288 (7.32)
SEATING PLANE
0.157 (4.00) 0.118 (3.00)
SEATING PLANE
0.200 (5.10) 0.161 (4.10)
0.276 (7.00) 0.236 (6.00)
0.200 (5.10) 0.161 (4.10)
0.276 (7.00) 0.236 (6.00)
0.157 (4.00) 0.118 (3.00) 0.010 (0.26)
0.130 (3.30) 0.091 (2.30)
0.020 (0.51) TYP
0.051 (1.30) 0.043 (1.10)
0.024 (0.60) 0.004 (0.10)
0.049 (1.25) 0.030 (0.76) 0.412 (10.46) 0.388 (9.86)
0.150 (3.80) 0.110 (2.80) 0.024 (0.60) 0.016 (0.40)
0.010 (0.26) 0.300 (7.62) typ
0.110 (2.79) 0.090 (2.29) Lead Coplanarity 0.004 (0.10) MAX
0.110 (2.79) 0.090 (2.29)
Footprint Dimensions (Surface Mount)) Package Dimensions (0.4" Lead Spacing)
SEATING PLANE
1.5 1.3
0.200 (5.10) 0.161 (4.10)
0.312 (7.92) 0.288 (7.32) 0.157 (4.00) 0.118 (3.00) 0.276 (7.00) 0.236 (6.00)
9
0.291 (7.40) 0.252 (6.40)
0.130 (3.30) 0.091 (2.30) 0.150 (3.80) 0.110 (2.80) 0.024 (0.60) 0.016 (0.40) 0.110 (2.79) 0.090 (2.29) 0.42 (10.66) 0.38 (9.66) 0.110 (2.80) 0.011 (1.80)
0.010 (0.26)
2.54
Note: All dimensions are in inches (millimeters)
5 FOD815 Series Rev. 1.0.4
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FOD815 Series 4-Pin High Operating Temperature Photodarlington Optocoupler
Ordering Information
Option
S SD W 300 300W 3S 3SD
Order Entry Identifier
.S .SD .W .300 .300W .3S .3SD
Description
Surface Mount Lead Bend Surface Mount; Tape and reel 0.4" Lead Spacing VDE Approved VDE Approved, 0.4" Lead Spacing VDE Approved, Surface Mount VDE Approved, Surface Mount, Tape & Reel
Marking Information
4
5
V X ZZ Y
3
6
815
1
2
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) One digit year code Two digit work week ranging from `01' to `53' Assembly package code
6 FOD815 Series Rev. 1.0.4
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FOD815 Series 4-Pin High Operating Temperature Photodarlington Optocoupler
Carrier Tape Specifications
O1.550.05 P2 P0 1.750.1
F W B0 A0 P1 0.30.05
K0
Note: All dimensions are in millimeters.
Description
Tape wide Pitch of sprocket holes Distance of compartment Distance of compartment to compartment Compartment
Symbol
W P0 F P2 P1 A0 B0 K0
Dimensions in mm (inches)
16 0.3 (.63) 4 0.1 (.15) 7.5 0.1 (.295) 2 0.1 (.079) 12 0.1 (.472) 10.45 0.1 (.411) 5.30 0.1 (.209) 4.25 0.1 (.167)
7 FOD815 Series Rev. 1.0.4
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FOD815 Series 4-Pin High Operating Temperature Photodarlington Optocoupler
Lead Free Recommended IR Reflow Condition
Tp
Temperature (C)
Tsmax
Ramp-down
Tsmin
25C ts (Preheat) Time (sec)
Profile Feature
Preheat condition (Tsmin-Tsmax / ts) Melt soldering zone Peak temperature (Tp) Ramp-down rate
Soldering zon
Pb-Sn solder assembly
100C ~ 150C 60 ~ 120 sec 183C 60 ~ 120 sec 240 +0/-5C 6C/sec max.
Lead Free assembly
150C ~ 200C 60 ~120 sec 217C 30 ~ 90 sec 260 +0/-5C 6C/sec max.
Recommended Wave Soldering condition
Profile Feature
Peak temperature (Tp)
For all solder assembly
Max 260C for 10 sec
8 FOD815 Series Rev. 1.0.4
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FOD815 Series 4-Pin High Operating Temperature Photodarlington Optocoupler
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM FAST(R) FASTrTM ActiveArrayTM FPSTM BottomlessTM FRFETTM Build it NowTM GlobalOptoisolatorTM CoolFETTM GTOTM CROSSVOLTTM HiSeCTM DOMETM I2CTM EcoSPARKTM i-LoTM E2CMOSTM ImpliedDisconnectTM EnSignaTM IntelliMAXTM FACTTM FACT Quiet SeriesTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UniFETTM UltraFET(R) VCXTM WireTM
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILDiS WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILDiS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I19
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
9 FOD815 Series Rev. 1.0.4
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