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INTEGRATED CIRCUITS
DATA SHEET
TJA1050 High speed CAN transceiver
Preliminary specification Supersedes data of 1999 Sep 27 File under Integrated Circuits, IC18 2000 May 26
Philips Semiconductors
Preliminary specification
High speed CAN transceiver
FEATURES * Fully compatible with the "ISO 11898" standard * High speed (up to 1 Mbaud) * Very low ElectroMagnetic Emission (EME) * Differential receiver with wide common-mode range for high ElectroMagnetic Immunity (EMI) * An unpowered node does not disturb the bus lines * Transmit Data (TXD) dominant time-out function * Silent mode in which the transmitter is disabled * Bus pins protected against transients in an automotive environment * Input levels compatible with 3.3 V devices * Thermally protected * Short-circuit proof to supply voltage and ground * At least 110 nodes can be connected. QUICK REFERENCE DATA SYMBOL VCC VCANH VCANL Vi(dif)(bus) tPD(TXD-RXD) Tamb PARAMETER supply voltage DC voltage at pin CANH DC voltage at pin CANL differential bus input voltage propagation delay TXD to RXD ambient temperature 0 < VCC < 5.25 V; no time limit 0 < VCC < 5.25 V; no time limit dominant VS = 0 V; see Fig.7 CONDITIONS MIN. 4.75 -27 -27 1.5 - -40 GENERAL DESCRIPTION
TJA1050
The TJA1050 is the interface between the Controller Area Network (CAN) protocol controller and the physical bus. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. The TJA1050 is the successor to the PCA82C250 high-speed CAN transceiver. The most important improvements are: * Much lower electromagnetic emission due to optimal matching of the output signals CANH and CANL * Improved behaviour in case of an unpowered node.
MAX. 5.25 +40 +40 3 250 +125
UNIT V V V V ns C
ORDERING INFORMATION TYPE NUMBER TJA1050T TJA1050U PACKAGE NAME SO8 - DESCRIPTION plastic small outline package; 8 leads; body width 3.9 mm bare die; die dimensions 1700 x 1280 x 380 m VERSION SOT96-1 -
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
BLOCK DIAGRAM
TJA1050
handbook, full pagewidth
VCC 3 30 A VCC 200 A GND TEMPERATURE PROTECTION
S
8
TXD
1
TXD DOMINANT TIME-OUT TIMER VCC
DRIVER 7 25 k 0.5VCC GND 6
CANH
RXD
4
RECEIVER GND 5 REFERENCE VOLTAGE
25 k CANL
Vref
TJA1050
2
MGS374
GND
Fig.1 Block diagram.
PINNING SYMBOL TXD PIN 1 DESCRIPTION transmit data input; reads in data from the CAN controller to the bus line drivers ground supply voltage receive data output; reads out data from the bus lines to the CAN controller reference voltage output LOW-level CAN bus line HIGH-level CAN bus line select input for high-speed mode or silent mode Fig.2 Pin configuration.
handbook, halfpage
GND VCC RXD
2 3 4
TXD 1 GND 2
8S 7 CANH CANL Vref
TJA1050T
VCC RXD 3 4
MGS375
6 5
Vref CANL CANH S
5 6 7 8
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
FUNCTIONAL DESCRIPTION The TJA1050 is the interface between the CAN protocol controller and the physical bus. It is primarily intended for high-speed automotive applications using baud rates from 60 kbaud up to 1 Mbaud. It provides differential transmit capability to the bus and differential receiver capability to the CAN protocol controller. It is fully compatible to the "ISO 11898" standard. A current-limiting circuit protects the transmitter output stage from damage caused by accidental short-circuit to either positive or negative supply voltage, although power dissipation increases during this fault condition. A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of approximately 165 C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TXD goes HIGH. The thermal protection circuit is particularly needed when a bus line short-circuits. The pins CANH and CANL are protected from automotive electrical transients (according to "ISO 7637"; see Fig.4). Table 1 Function table of the CAN transceiver; X = don't care VCC 4.75 to 5.25 V 4.75 to 5.25 V 4.75 to 5.25 V <2 V (not powered) 2 V < VCC < 4.75 V TXD 0 X 1 (or floating) X >2 V S 0 (or floating) 1 X X X CANH HIGH 0.5VCC 0.5VCC CANL LOW 0.5VCC 0.5VCC
TJA1050
Control pin S allows two operating modes to be selected: high-speed mode or silent mode. The high-speed mode is the normal operating mode and is selected by connecting pin S to ground. It is the default mode if pin S is not connected. In the silent mode, the transmitter is disabled. All other IC functions continue to operate. The silent mode is selected by connecting pin S to VCC and can be used to prevent network communication from being blocked, due to a CAN controller which is out of control. A `TXD dominant time-out' timer circuit prevents the bus lines being driven to a permanent dominant state (blocking all network communication) if pin TXD is forced permanently LOW by a hardware and/or software application failure. The timer is triggered by a negative edge on pin TXD. If the duration of the LOW-level on pin TXD exceeds the internal timer value, the transmitter is disabled, driving the bus into a recessive state. The timer is reset by a positive edge on pin TXD.
BUS STATE RXD dominant recessive recessive recessive recessive 0 1 1 X X
0 V < VCANH < VCC 0 V < VCANL < VCC 0 V < VCANH < VCC 0 V < VCANL < VCC
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND (pin 2). Positive currents flow into the IC. SYMBOL VCC VCANH VCANL VTXD VRXD Vref VS Vtrt(CANH) Vtrt(CANL) Ves Tstg Tamb Tvj Notes 1. The waveforms of the applied transients shall be in accordance with "ISO 7637 part 1", test pulses 1, 2, 3a and 3b (see Fig.4). 2. Human body model: C = 100 pF and R = 1.5 k. In case of a discharge from pin CANH to all other non-supply pins: -3750 V < Ves < +3750 V. 3. Machine model: C = 200 pF, R = 10 and L = 0.75 H. In case of a discharge from pin CANL to pin GND: -100 V < Ves < +100 V; in case of a discharge from pin CANH to VCC: -150 V < Ves < +150 V. 4. In accordance with "IEC 60747-1". An alternative definition of Tvj is: Tvj = Tamb + P x Rth(vj-a), where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). THERMAL CHARACTERISTICS According to IEC 60747-1. SYMBOL Rth(vj-a) Rth(vj-s) PARAMETER thermal resistance from junction to ambient in SO8 package thermal resistance from junction to substrate of bare die CONDITIONS in free air in free air VALUE 145 50 UNIT K/W K/W PARAMETER supply voltage DC voltage at pin CANH DC voltage at pin CANL DC voltage at pin TXD DC voltage at pin RXD DC voltage at pin Vref DC voltage at pin S transient voltage at pin CANH transient voltage at pin CANL note 1 note 1 note 3 storage temperature ambient temperature virtual junction temperature note 4 0 < VCC < 5.25 V; no time limit 0 < VCC < 5.25 V; no time limit CONDITIONS MIN. -0.3 -27 -27 -0.3 -0.3 -0.3 -0.3 -200 -200 -4000 -200 -55 -40 -40 MAX. +6 +40 +40 V V V UNIT
VCC + 0.3 V VCC + 0.3 V VCC + 0.3 V VCC + 0.3 V +200 +200 +4000 +200 +150 +125 +150 V V V V C C C
electrostatic discharge voltage at all pins note 2
QUALITY SPECIFICATION Quality specification "SNW-FQ-611 part D" is applicable.
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
CHARACTERISTICS VCC = 4.75 to 5.25 V; Tvj = -40 to +150 C; RL = 60 unless specified otherwise; all voltages are referenced to GND (pin 2); positive currents flow into the IC; see notes 1 and 2. SYMBOL Supply (pin VCC) ICC supply current dominant; VTXD = 0 V recessive; VTXD = VCC Transmitter data input (pin TXD) VIH VIL IIH IIL Ci VIH VIL IIH IIL IOH IOL HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current input capacitance output recessive output dominant VTXD = VCC VTXD = 0 V not tested 2.0 -0.3 -5 -100 - 2.0 -0.3 20 15 -2 2 - - 0 -200 5 - - 30 30 -6 8.5 VCC + 0.3 V +0.8 +5 -300 10 V A A pF 25 2.5 50 5 75 10 mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Mode select input (pin S) HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current silent mode high-speed mode VS = 2 V VS = 0.8 V VRXD = 0.7VCC VRXD = 0.45 V -50 A < IVref < +50 A VTXD = VCC; no load VTXD = VCC; no load VCC + 0.3 V +0.8 50 45 -15 20 V A A mA mA
Receiver data output (pin RXD) HIGH-level output current LOW-level output current
Reference voltage output (pin Vref) Vref Vo(reces)(CANH) Vo(reces)(CANL) Io(reces)(CANH) Io(reces)(CANL) Vo(dom)(CANH) Vo(dom)(CANL) Vi(dif)(bus) reference output voltage 0.45VCC 2.0 2.0 0.5VCC 2.5 2.5 - - 3.6 1.4 2.25 0 0.55VCC 3.0 3.0 +2.5 +2.5 4.25 1.75 3.0 +50 V
Bus lines (pins CANH and CANL) recessive bus voltage at pin CANH recessive bus voltage at pin CANL recessive output current at pin CANH recessive output current at pin CANL dominant output voltage at pin CANH dominant output voltage at pin CANL differential bus input voltage (VCANH - VCANL) V V mA mA V V V mV
-27 V < VCANH < +32 V; -2.0 0 V < VCC < 5.25 V -27 V < VCANL < +32 V; 0 V < VCC < 5.25 V VTXD = 0 V VTXD = 0 V VTXD = 0 V; dominant; 42.5 < RL < 60 VTXD = VCC; recessive; no load -2.0 3.0 0.5 1.5 -50
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
SYMBOL Io(sc)(CANH) Io(sc)(CANL) Vi(dif)(th)
PARAMETER
CONDITIONS
MIN.
TYP. -70 70 0.7
MAX. -95 100 0.9
UNIT mA mA V
short-circuit output current at VCANH = 0 V; VTXD = 0 V -45 pin CANH short-circuit output current at VCANL = 36 V; pin CANL VTXD = 0 V 45
differential receiver threshold -12 V < VCANL < +12 V; 0.5 voltage -12 V < VCANH < +12 V; see Fig.5 differential receiver input voltage hysteresis common mode input resistance at pin CANH common mode input resistance at pin CANL matching between pin CANH and pin CANL common mode input resistance differential input resistance input capacitance at pin CANH input capacitance at pin CANL input leakage current at pin CANH input leakage current at pin CANL VTXD = VCC; not tested VTXD = VCC; not tested VCANH = VCANL -12 V < VCANL < +12 V; 50 -12 V < VCANH < +12 V; see Fig.5 15 15 -3
Vi(dif)(hys)
70
100
mV
Ri(cm)(CANH) Ri(cm)(CANL) Ri(cm)(m)
25 25 0
35 35 +3
k k %
Ri(dif) Ci(CANH) Ci(CANL) Ci(dif) ILI(CANH) ILI(CANL)
25 - - - 100 100
50 7.5 7.5 3.75 170 170
75 20 20 10 250 250
k pF pF pF A A
differential input capacitance VTXD = VCC; not tested VCC = 0 V; VCANH = 5 V VCC = 0 V; VCANL = 5 V
Thermal shutdown Tj(sd) shutdown junction temperature 155 165 180 C
Timing characteristics (see Figs.6 and 7) td(TXD-BUSon) td(TXD-BUSoff) td(BUSon-RXD) td(BUSoff-RXD) tdom(TXD) Notes 1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at 125 C ambient temperature for dies on wafer level and in addition to this 100% tested at 25 C ambient temperature for cased products, unless specified otherwise. 2. For bare die, all parameters are only guaranteed if the backside of the bare die is connected to ground. delay TXD to bus active delay TXD to bus inactive delay bus active to RXD delay bus inactive to RXD TXD dominant time for time-out VS = 0 V VS = 0 V VS = 0 V VS = 0 V VTXD = 0 V 25 25 20 45 250 55 60 50 95 450 110 95 110 155 750 ns ns ns ns s
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
APPLICATION AND TEST INFORMATION
TJA1050
handbook, full pagewidth
+5 V 100 nF VCC TX0 TXD Vref 3 1 7 CANH 60
47 nF 60
SJA1000
CAN CONTROLLER RX0
5
TJA1050
6 CANL
CAN BUS LINE
RXD
4 2 GND 8 S 60 60 47 nF
MGS380
MICROCONTROLLER
Fig.3 Application information.
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
handbook, full pagewidth
+5 V 100 nF VCC TXD Vref 3 1 7 CANH 1 nF
5
TJA1050
6 2 8 GND S CANL 1 nF
TRANSIENT GENERATOR
RXD
4
MGS379
15 pF
The waveforms of the applied transients shall be in accordance with "ISO 7637 part 1", test pulses 1, 2, 3a and 3b.
Fig.4 Test circuit for automotive transients.
handbook, full pagewidth
MGS378
VRXD HIGH
LOW hysteresis 0.5 0.9 Vi(dif)(bus)
Fig.5 Hysteresis of the receiver.
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
+ 5 halfpage handbook, V 100 nF VCC TXD Vref 3 1 7 CANH RL 60 6 2 15 pF GND 8 S CANL CL 100 pF
5
TJA1050
RXD
4
MGS376
Fig.6 Test circuit for timing characteristics.
handbook, full pagewidth
HIGH TXD LOW
CANH CANL dominant (BUS on) 0.9 V Vi(dif)(bus)(1) 0.5 V recessive (BUS off) HIGH RXD t d(TXD-BUSon) t d(BUSon - RXD) t PD(TXD - RXD) t PD(TXD - RXD) 0.3VCC 0.7VCC LOW t d(TXD-BUSoff) t d(BUSoff - RXD)
MGS377
(1) Vi(dif)(bus) = VCANH - VCANL.
Fig.7 Timing diagram for AC characteristics.
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
handbook, full pagewidth
CANL TX
6.2 k 6.2 k 30 30
10 nF ACTIVE PROBE
TJA1050 CANH
SPECTRUMANALYZER 47 nF test PCB
MGT229
GND
Fig.8 Basic test set-up (with split termination) for electromagnetic emission measurement (see Figs 9 and 10).
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
handbook, full pagewidth
80
MGT231
A (dBV) 60
40
20
0 0 10 20 30 40 f (MHz) 50
Data rate of 500 kbits/s.
Fig.9 Typical electromagnetic emission up to 50 MHz (peak amplitude measurement).
handbook, full pagewidth
80
MGT233
A (dBV) 60
40
20
0 0 Data rate of 500 kbits/s. 2 4 6 8 f (MHz) 10
Fig.10 Typical electromagnetic emission up to 10 MHz (peak amplitude measurement and envelope on peak amplitudes).
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
handbook, full pagewidth
CANL TX
30 30
4.7 nF
TJA1050
CANH
RF VOLTMETER AND POWER AMPLIFIER 50
RF SIGNAL GENERATOR
RX
TJA1050
GND test PCB
MGT230
Fig.11 Basic test set-up for electromagnetic immunity measurement (see Fig.12).
handbook, full pagewidth
30
MGT232
VRF(rms) (V)
max RF voltage reached with no errors
20
10
0 10-1 Data rate of 500 kbits/s.
1
10
102
f (MHz)
103
Fig.12 Typical electromagnetic immunity.
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
BONDING PAD LOCATIONS COORDINATES(1) SYMBOL TXD GND VCC RXD Vref CANL CANH S Note 1. All x/y coordinates represent the position of the centre of each pad (in m) with respect to x/y = 0 of the die (see Fig.13). PAD x 1 2 3 4 5 6 7 8 103 740 886.5 1371.5 1394 998 538.5 103 y 103 85 111 111 1094 1115 1115 1097
x 0 0 y
handbook, halfpage
TJA1050
8
7
6
5
TJA1050U
test pad
1
23
4
MGS381
The backside of the bare die must be connected to ground.
Fig.13 Bonding pad locations.
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
PACKAGE OUTLINE SO8: plastic small outline package; 8 leads; body width 3.9 mm
TJA1050
SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024
0.028 0.004 0.012
8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
TJA1050
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable suitable(2) recommended(3)(4) recommended(5) suitable not not suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not
TJA1050
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1)
TJA1050
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. BARE DIE DISCLAIMER All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used.
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
NOTES
TJA1050
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Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 69
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
02/pp20
Date of release: 2000
May 26
Document order number:
9397 750 07004

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