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CXG1166AER
High Power 3 x 5 Antenna Switch MMIC with Integrated Control Logic
Description The CXG1166AER is a high power antenna switch MMIC for PDC handsets. There are two modes which are TDMA mode and Packet mode. The CXG1166AER is suited to connect Tx/Rx/ Duplexer to one of 4 antennas. This switch has onchip logic circuit for operation with 4 CMOS inputs. The Sony Junction-gate PHEMT (JPHEMT) process is used for low insertion loss and low voltage operation. Features * Low insertion loss: 0.7dB @1.44GHz * Low loss bypass mode in TDMA * High linearity: Harmonic < - 60dBc * CMOS compatible input control * Small package: 24-pin VQFN (3.3mm x 3.3mm) Applications 3 x 5 antenna switch for digital cellular such as PDC handsets Structure GaAs Junction-gate PHEMT Absolute Maximum Ratings (Ta = 25C) * Bias voltage VDD 7 * Control voltage Vctl 5 * Operating temperature Topr -35 to +85 * Storage temperature Tstg -65 to +150 24 pin VQFN (Plastic)
V V C C
GaAs MMICs are ESD sensitive devices. Special handling precautions are required.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
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E04Y19
CXG1166AER
Block Diagram
F13 Tx F15 Dup_In F16 GND3 Dup_Out F4 F17 F5 GND4 GND1 F10 F3 Ant F14 F9 F1 Ext
F2
F6
F7 Rx F18 F11 D_Ant
F8 D_Ext F12
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CXG1166AER
Pin Configuration/Recommended Circuit
GND1 Ant
8 7 6 CRF (100pF) 14 5 GND Ext
CRF (100pF)
Tx
12 Dup_In CRF (100pF) GND3 Z3 13
11
10
9
GND
15
CRF (100pF)
GND
GND
Z1
GND
4 CRF (100pF)
D_Ext
GND4
Z4
16
3
GND
Dup_Out CRF (100pF) GND
17
2 CRF (100pF)
D_Ant
18 19 20 21 22 23 24
1
GND
CRF (100pF)
Cbypass (100pF)
Cbypass (100pF) CTLD VDD
Cbypass (100pF)
Cbypass (100pF)
When using this IC, the following external components should be used: This capacitor is used for RF decoupling and must be used for all applications. CRF: 100pF is recommended. Cbypass: This capacitor is used for DC line filtering. 100pF is recommended.
Rx
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CTLC
CTLA
CTLB
Cbypass (100pF)
CXG1166AER
Truth Table A: Rx/Tx B: Main/diversity C: External/antenna D: TDMA/28.8k
State 1 2 3 4 5 6 7 On Pass Tx - Ext Tx - Ant Rx - Ext Rx - Ant Rx - D_Ext Rx - D_Ant Dup_Out - Ant Rx - Ant 8 Dup_Out - Ant Rx - D_Ant 9 Dup_Out - Ext Rx - Ext 10 Dup_Out - Ext Rx - D_Ext -- H L H L L H L -- L L H L L H L -- H H H L L L H A H H L L L L -- B -- -- L L H H L C L H L H L H H D L L L L L L H F1 F2 F3 F4 F5 F6 F7 F8 F9 F10 F11 F12 F13 F14 F15 F16 F17 F18 H L L L L L L L H L L L L L L L L L L L L L L L L L L H L L H L L L L L L L H L L H L L L L L H L L L L L H L L L H L H H H H H L H L H H L H H H H H L H H H H H L H H H H L L L L L L L H H H H H L L L L L L H H H H H H H L H H H H H H L H H L L L L L
L
L
H
L
H
L
L
H
L
H
H
L
L
L
H
L
L
L
L
H
H
H
L
H
H
L
L
L
L
L
L
H
L
H
H
L
L
H
H
L
L
L
DC Bias Condition Item VDD Vctl (H) Vctl (L) Min. 2.7 2.2 0 Typ. 3.0 3.0 Max. 3.5 3.5 0.4
(Ta = 25C) Unit V V V
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CXG1166AER
Electrical Characteristics Item Symbol Port Tx - Ext Tx - Ant Tx - Dup_In Rx - Ext Rx - Ant Rx - D_Ext Rx - D_Ant Insertion loss IL Dup_Out - Ext Rx - Ext Dup_Out - Ant Rx - Ant Dup_Out - Ext Rx - D_Ext Dup_Out - Ant Rx - D_Ant Tx - Ext Tx - Ant Tx - Dup_In Rx - Ext Rx - Ant Rx - D_Ext Rx - D_Ant Isolation ISO. Dup_Out - Ext Rx - Ext Dup_Out - Ant Rx - Ant Dup_Out - Ext Rx - D_Ext Dup_Out - Ant Rx - D_Ant Tx - Rx 1 1 1 2 2 2 2 1, 4 2, 5 1, 4 2, 5 1, 4 2, 5 1, 4 2, 5 1 1 1 2 2 2 2 1, 4 2, 5 1, 4 2, 5 1, 4 2, 5 1, 4 2, 5 1 Condition
(Ta = 25C) Min. Typ. Max. Unit -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 24 24 19 24 24 24 24 29 29 29 29 24 24 24 24 43 0.75 0.7 0.25 0.65 0.65 0.45 0.45 0.75 0.8 0.9 0.95 0.45 0.5 0.45 0.5 30 30 25 30 30 30 30 35 35 35 35 30 30 30 30 50 1.0 0.95 0.5 0.9 0.9 0.7 0.7 1.0 1.05 1.15 1.2 0.7 0.75 0.7 0.75 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB
1 Pin = 29.5dBm, 0/3V control, VDD = 2.7V to 3.5V, 1,429MHz to 1,453MHz 2 Pin = 10dBm, 0/3V control, VDD = 2.7V to 3.5V, 1,477MHz to 1,501MHz 3 /4-shifted DQPSK, Pin = 29.5dBm, 0/3V control, VDD = 3.0V, 1,429MHz to 1,453MHz, ACP (50kHz) < - 70dBc, ACP (100kHz) < - 75dBc, 2nd harmonics < - 75dBc, 3rd harmonics < - 75dBc 4 Rx terminal end is OPEN (Pattern cut). 5 Dup_Out terminal end is OPEN (Pattern cut).
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CXG1166AER
(Ta = 25C) Item Symbol Port Tx - Ext Tx - Ant Tx - Dup_In 2fo Dup_Out - Ext (Main) Dup_Out - Ext (Div) Dup_Out - Ant (Main) Harmonics Dup_Out - Ant (Div) Tx - Ext Tx - Ant Tx - Dup_In 3fo Dup_Out - Ext (Main) Dup_Out - Ext (Div) Dup_Out - Ant (Main) Dup_Out - Ant (Div) Tx - Ext Tx - Ant Tx - Dup_In 50kHz Dup_Out - Ext (Main) Dup_Out - Ext (Div) Dup_Out - Ant (Main) ACP Dup_Out - Ant (Div) Tx - Ext Tx - Ant Tx - Dup_In 100kHz Dup_Out - Ext (Main) Dup_Out - Ext (Div) Dup_Out - Ant (Main) Dup_Out - Ant (Div) Bias current Control current IDD Ictl 3 3 3 3, 4 3, 4 3, 4 3, 4 3 3 3 3, 4 3, 4 3, 4 3, 4 3 3 3 3, 4 3, 4 3, 4 3, 4 3 3 3 3, 4 3, 4 3, 4 3, 4 VDD = 3.0V Vctl (H) = 3.0V Condition Min. Typ. Max. Unit -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -70 -70 -75 -75 -70 -70 -70 -67 -67 -70 -67 -67 -67 -67 -70 -70 -70 -70 -70 -70 -70 -73 -73 -73 -73 -73 -73 -73 235 15 -60 -60 -60 -60 -60 -60 -60 -60 -60 -60 -60 -60 -60 -60 -57 -57 -57 -57 -57 -57 -57 -65 -65 -65 -65 -65 -65 -65 350 30 dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc A A
1 Pin = 29.5dBm, 0/3V control, VDD = 2.7V to 3.5V, 1,429MHz to 1,453MHz 2 Pin = 10dBm, 0/3V control, VDD = 2.7V to 3.5V, 1,477MHz to 1,501MHz 3 /4-shifted DQPSK, Pin = 29.5dBm, 0/3V control, VDD = 3.0V, 1,429MHz to 1,453MHz, ACP (50kHz) < - 70dBc, ACP (100kHz) < - 75dBc, 2nd harmonics < - 75dBc, 3rd harmonics < - 75dBc 4 Rx terminal end is OPEN (Pattern cut). 5 Dup_Out terminal end is OPEN (Pattern cut).
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CXG1166AER
Pin Description Pin No. 2 4 6 7 12 13 17 19 20 21 22 23 24 Symbol D_Ant D_Ext Ext Ant Tx Dup_In Dup_Out Rx CTLA CTLB CTLC CTLD VDD Description RF signal output (Use it, connecting capacity.) (100pF is recommended.) RF signal output (Use it, connecting capacity.) (100pF is recommended.) RF signal output (Use it, connecting capacity.) (100pF is recommended.) RF signal output (Use it, connecting capacity.) (100pF is recommended.) RF signal input (Use it, connecting capacity.) (100pF is recommended.) RF signal output (Use it, connecting capacity.) (100pF is recommended.) RF signal input (Use it, connecting capacity.) (100pF is recommended.) RF signal input (Use it, connecting capacity.) (100pF is recommended.) Logic control A Logic control B Logic control C Logic control D Power supply input GND
1, 3, 5, 8, 9, 10, 11, 14, GND 15, 16, 18
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CXG1166AER
Package Outline
Unit: mm
24PIN VQFN
PLASTIC
x4 0.2 3.3 18 19 13 12 A
3.3
S
A-B C
0.8 0.1
0.4 0.1 1.5
4-R0.3
B
24 1 PIN 1 INDEX 6
7
0.425
0.425 0.4
C PIN 1 INDEX S A-B C
0.05 M
0.05 S
S
S Solder Plating
+ 0.09 0.14 - 0.03
TERMINAL SECTION
Note:Cutting burr of lead are 0.05mm MAX.
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g LEAD TREATMENT LEAD MATERIAL PACKAGE MASS
SONY CODE EIAJ CODE JEDEC CODE
VQFN-24P-05
LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18m
MAX0.02
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Sony Corporation

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