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THE
WORLD
LEADER
IN
LOGIC
PRODUCTS
Increase the speed of parallel backplanes 3x with GTLP
For high-speed parallel backplanes, GTLP is the answer.
Users of the Internet, wireless communications or the traditional wireline infrastructure are clamoring for more bandwidth. As a result, the parallel backplanes used in switches, routers, hubs and other communications equipment is quickly evolving to faster speeds. GTLP logic is an easy first step toward higher data throughput.
Migrate to next-generation speed In today's interconnected, bandwidthhungry world, designers can easily increase by two to three times the data throughput speed of their networking, communications and telecommunications systems by migrating to TI's new GTL-Plus (GTLP) logic family for parallel backplanes. And since GTLP is backwardly compatible with traditional logic such as ABT, ALVT, LVT, LVC and FutureBus+, the migration to higher throughput is simple and direct. Building upon its pioneering work with Gunning Transceiver Logic (GTL), TI has optimized the Output Edge
ControlTM circuitry and added live insertion and removal capabilities to produce devices specifically designed for medium and heavily loaded parallel backplanes. GTLP brings the benefits of GTL - higher frequencies and lower EMI and transmission noise - to parallel backplanes in excess of 20 slots. Combining Output Edge Control circuitry with GTLP's narrow signal voltage swing gives GTLP clock speeds in excess of 80 MHz and data throughput rates of at least 3.2 gigabytes per second (Gbps) across a 32-bit backplane.
Improving on a good thing In recent years, GTL logic has become increasingly popular in point-to-point applications and backplane systems with a limited number of slots. Now, GTLP brings the high-speed advantages of GTL to medium- and heavily loaded parallel backplanes. GTLP transceivers are differential input, open-drain n-channel devices. TI has optimized the Output Edge Control circuitry in GTLP transceivers to ensure
good signal integrity (See chart below), reduce line reflections and limit the electromagnetic emissions at frequencies greater than 80 MHz. GTLP devices have been optimized for a narrow signaling range between 0.55 and 1.5V with a threshold at 1.0V. Additionally, GTLP transceivers will operate at the GTL signal levels of 0.4 to 1.2V with a threshold at 0.8V. GTLP transceivers are 3.3V CMOS devices, but they have 5V-tolerant
LVTTL inputs and outputs which allows them to act as 5V-to-GTLP translators or 3.3V LVTTL-to-GTLP translators. As CMOS devices, GTLP transceivers consume less than a third of the power that is typical for BiCMOS GTL devices. Designing GTLP transceivers into next-generation systems with significantly higher data throughput speeds is relatively easy because GTLP is backwards compatible with the logic currently used in parallel backplanes.
Output Edge Control (OECTM) Circuitry Comparison ( VTT = 1.5V)
1.80 1.60 1.40 Voltage (V) 1.20
Optimized OEC
1.00 0.80 0.60 0.40 0 10 Time (ns) 20 30
Original OEC
Matching your backplane needs For maximum flexibility in matching the needs of your backplane, the GTLP family comes in medium- and high-drive devices. High-drive devices sink 100 milli-Amperes (mA) of current, while medium-drive devices sink 50mA. Low impedance, heavily loaded backplanes achieve better data throughput performance with high-drive GTLP devices. High-drive GTLP devices also feature
TI's innovative variable edge rate control circuitry which allows you to adjust the signal's edge rate to better match the conditions of your backplane. An Easy Migration To help the designer make an easy migration to GTLP, this new logic family is fully supported with tools like application notes, application support, free samples, demonstration backplane models, and IBIS and SPICE simulation models.
The many packaging options as well as pin-outs that are similar to previousgeneration devices simplify the designer's task.
Live board insertion Many backplane systems are used in communication and networking applications where availability 24 hours a day, seven days a week (24/7) is a must. As a result, boards must be inserted or removed from the system while it is still running. TI has included three kinds of internal circuitry to accomplish faultproof live insertion. First, by including a blocking diode and removing a clamping diode, unexpected device behavior is eliminated when power is fully or partially removed. Second, new circuitry avoids driver conflict by ensuring that outputs are disabled during power up or down. And third, an internal pre-charging circuit prevents data corruption which can result from voltage spikes caused by inserting a board into a live backplane.
High - Data On Bus
Volts Max peak with precharge
Low - Data On Bus
Max peak with precharge
V High
Possible peak without precharge
V Threshold
precharge level= TH
V
time Possible peak without precharge Point of life insertion during high on bus Point of life insertion during low on bus
For more information on the GTLP family of high-speed parallel backplane logic or to find out how TI can help you make the switch to GTLP logic, visit our web site at www.ti.com/sc/gtlp or to reserve a copy of our GTLP Product Information book visit www.ti.com/sc/gtlpbook.
GTLP Chip Configurations
GTLP Device LVTTL-to-GTLP Function Pin Count SOIC SSOP TSSOP TVSOP LFBGA Medium Drive (50 mA) SN74GTLP817 GTLP to LVTTL 1 to 6 Fanout Driver 8-Bit Bus Transceiver 16-Bit Bus Transceiver 18-Bit Universal Bus Transceiver 32-Bit Bus Transceiver 36-Bit Universal Bus Transceiver High Drive (100 mA) SN74GTLP1394 SN74GTLPH1645 SN74GTLPH1655 SN74GTLPH1612 SN74GTLPH3245 2-Bit 3-Wire Transceiver 16-Bit Bus Transceiver 16-Bit Universal Bus Transceiver 18-Bit Universal Bus Transceiver 32- Bit Bus Transceiver 16 56 64 64 114 * * * * * * * * * * * * * * * * 24 * * * * * * * * * *
SN74GTLPH306 SN74GTLPH16945 SN74GTLPH16912 SN74GTLPH32945 SN74GTLPH32912
24 48 56 96 114
* * *
* * *
The Pluses of GTLP * Two to three times faster data throughput on heavily loaded parallel backplanes * 3.2 gigabits per second (Gbps) with a 32-bit backplane * Easy migration path from traditional backplane logic like ABT, FCT, LVT, ALVT, LVC or FutureBus+ * Live insertion of cards into GTLP backplanes for high-availability systems * Wide selection of high drive devices * Wide selection of packaging options * Consumes one-third the power of BiCMOS GTL devices
MicroStar BGA
TM
A wide range of GTLP packaging options is available to satisfy all design needs. TI's MicroStar BGATM package reduces by 45 to 65 percent the board space needed for traditional surface mount packages.
With an easy migration to Texas Instruments' new Gunning Transceiver Logic-Plus (GTLP) family, designers can increase the data throughput of parallel backplane systems by 100 to 200 percent. GTLP extends the success of GTL logic in point-to-point applications to parallel backplane systems without requiring a radical redesign of the system. And for high-availability systems in communications, telecommunications and networking, GTLP supports live insertion and removal of boards into a backplane.
Three times the speed That's what a simple migration to GTLP logic can do for your parallel backplane system.
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Packaging Options
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96-Ball BGA Area = 74mm2 HT. = 1.4mm LP = 0.8mm
114-Ball BGA GTLP Area = 88mm2 HT. = 1.4mm LP = 0.8mm 48-Pin TSSOP Area = 105mm2 HT. = 1.2mm LP = 0.65mm GTLP
GTLP
24-Pin SOIC Area = 160mm2 GTLP HT. = 2.65mm LP = 1.27mm 48-Pin TVSOP 2 Area = 63mmGTLP HT. = 1.2mm LP = 0.4mm
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48-Pin SSOP Area = 171mm2 HT. = 2.0mm LP = 0.65mm
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GTLP TI Worldwide Technical Support
LP Internet
TI Semiconductor Home Page
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Japan
GTLP
www.ti.com/sc
TI Distributors
GTLP
www.ti.com/sc/docs/general/distrib.htm
Product Information Centers
GTLP
Americas
Phone Fax Internet Phone Belgium (English) France Germany Israel (English) Italy Netherlands (English) Spain Sweden (English) United Kingdom Fax Email Internet
GTLP
GTLP
Phone International Domestic Fax International GTLP Domestic Internet International Domestic
+81-3-3344-5311 0120-81-0026 +81-3-3344-5317 0120-81-0036 www.ti.com/sc/jpic www.tij.co.jp/pic
+1(972) 644-5580 +1(214) 480-7800 www.ti.com/sc/ampic
Asia
Phone International Domestic Australia China Hong Kong India Indonesia Korea Malaysia New Zealand Philippines Singapore Taiwan Thailand Fax Email Internet +886-2-23786800 Local Access Code 1-800-881-011 10810 800-96-1111 000-117 001-801-10 080-551-2804 1-800-800-011 000-911 105-11 800-0111-111 080-006800 0019-991-1111 886-2-2378-6808 tiasia@ti.com www.ti.com/sc/apic TI Number -800-800-1450 -800-800-1450 -800-800-1450 -800-800-1450 -800-800-1450 -800-800-1450 -800-800-1450 -800-800-1450 -800-800-1450 -800-800-1450
Europe, Middle East, and Africa
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Important Notice: The products and services of Texas Instruments and its subsidiaries described herein are sold subject to TI's standard terms and conditions of sale. Customers are advised to obtain the most current and complete information about TI products and services before placing orders. TI assumes no liability for applications assistance, customer's applications or product designs, software performance, or infringement of patents. The publication of information regarding any other company's products or services does not constitute TI's approval, warranty or endorsement thereof. B010300
Microstar BGA and Output Edge Control (OEC) are registered trademarks of Texas Instruments. (c) 2000 Texas Instruments Printed in the U.S.A. at Millet the Printer, Inc., Dallas, Texas Printed on recycled paper.
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