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 CD74FCT821A BiCMOS 10-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS
SCBS731 - JULY 2000
D D D D D D D D D D D D
BiCMOS Technology With Low Quiescent Power Buffered Inputs Noninverted Outputs Input/Output Isolation From VCC Controlled Output Edge Rates 48-mA Output Sink Current Output Voltage Swing Limited to 3.7 V SCR Latch-Up-Resistant BiCMOS Process and Circuit Design Provide Extra Data Width Necessary for Wider Address/Data Paths or Buses With Parity Outputs Have Undershoot-Protection Circuitry Buffered Control Inputs Reduce dc Loading Effects Package Options Include Plastic Small-Outline (M) Package and Standard Plastic (EN) DIP
EN OR M PACKAGE (TOP VIEW)
OE 1D 2D 3D 4D 5D 6D 7D 8D 9D 10D GND
1 2 3 4 5 6 7 8 9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
VCC 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q 9Q 10Q CLK
description
The CD74FCT821A is a 10-bit flip-flop that features 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. It is particularly suitable for implementing wider buffer registers, I/O ports, bidirectional bus drivers with parity, and working registers. This device uses a small-geometry BiCMOS technology. The output stage is a combination of bipolar and CMOS transistors that limits the output high level to two diode drops below VCC. This resultant lowering of output swing (0 V to 3.7 V) reduces power-bus ringing [a source of electromagnetic interference (EMI)] and minimizes VCC bounce and ground bounce and their effects during simultaneous output switching. The output configuration also enhances switching speed and is capable of sinking 48 mA. The flip-flops enter data into their registers on the low-to-high transition of the clock (CLK). The Q outputs are noninverted data. The output-enable (OE) input controls the 3-state outputs and is independent of register operation. When OE is high, the outputs are in the high-impedance state. The CD74FCT821A is characterized for operation from 0C to 70C.
FUNCTION TABLE (each flip-flop) INPUTS OE L L L H CLK L X D H L X X OUTPUT Q H L Q0 Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
1
CD74FCT821A BiCMOS 10-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS
SCBS731 - JULY 2000
logic symbol
OE CLK 1D 2D 3D 4D 5D 6D 7D 8D 9D 10D 1 13 2 3 4 5 6 7 8 9 10 11 EN C1 1D 23 22 21 20 19 18 17 16 15 14 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q 9Q 10Q
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
OE CLK 1 13
C1 1D 2 1D
23
1Q
To Nine Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
DC supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 6 V DC input clamp current, IIK (VI < -0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20 mA DC output clamp current, IOK (VO < -0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA DC output sink current per output pin, IOL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA DC output source current per output pin, IOH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -30 mA Continuous current through VCC, (ICC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260 mA Continuous current through GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mA Package thermal impedance, JA (see Note 1): EN package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67C/W M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51.
2
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
CD74FCT821A BiCMOS 10-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS
SCBS731 - JULY 2000
recommended operating conditions (see Note 2)
MIN VCC VIH VIL VI VO IOH IOL t/v Supply voltage High-level input voltage Low-level input voltage Input voltage Output voltage High-level output current Low-level output current Input transition rise or fall rate 0 0 0 4.75 2 0.8 VCC VCC -15 48 10 MAX 5.25 UNIT V V V V V mA mA ns/V
TA Operating free-air temperature 0 70 C NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER VIK VOH VOL II IOZ IOS ICC ICC Ci Co II = -18 mA IOH = -15 mA IOL = 48 mA VI = VCC or GND VO = VCC or GND VI = VCC or GND, VI = VCC or GND, One input at 3.4 V, Other inputs at VCC or GND VI = VCC or GND VO = VCC or GND VO = 0 IO = 0 TEST CONDITIONS VCC 4.75 V 4.75 V 4.75 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V -75 8 1.6 10 15 2.4 0.55 0.1 0.5 -75 80 1.6 10 15 TA = 25C MIN MAX -1.2 2.4 0.55 1 10 MIN MAX -1.2 UNIT V V V
mA mA
mA
mA
mA pF pF
Not more than one output should be tested at a time, and the duration of the test should not exceed 100 ms. This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V or VCC.
timing requirements over recommended operating temperature conditions (unless otherwise noted) (see Figure 1)
MIN fclock tw tsu th Clock frequency Pulse duration Setup time Hold time CLK high or low Data before CLK Data after CLK 7 4 2 MAX 70 UNIT MHz ns ns ns
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
3
CD74FCT821A BiCMOS 10-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS
SCBS731 - JULY 2000
switching characteristics over recommended operating conditions (unless otherwise noted) (see Figure 1)
PARAMETER fmax tpd ten tdis CLK OE OE Q Q Q 7.5 9 6 FROM (INPUT) TO (OUTPUT) TA = 25C TYP MIN 70 1.5 1.5 1.5 10 12 8 MAX UNIT MHz ns ns ns
noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25C
PARAMETER VOL(P) VOH(V) VIH(D) VIL(D) Quiet output, maximum dynamic VOL Quiet output, minimum dynamic VOH High-level dynamic input voltage Low-level dynamic input voltage 2 0.8 MIN TYP 1 0.5 MAX UNIT V V V V
4
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
CD74FCT821A BiCMOS 10-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS
SCBS731 - JULY 2000
PARAMETER MEASUREMENT INFORMATION
7V From Output Under Test CL = 50 pF (see Note A) Test Point 500 From Output Under Test CL = 50 pF (see Note A) 500 S1 Open GND 500 TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS S1 Open 7V Open 7V
1.5 V 10%
90%
90%
3V 1.5 V 10% 0 V tf 3V Timing Input 1.5 V 0V 3V tsu Data Input 0V 1.5 V th 3V 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 3V 1.5 V tPZL VOH Output Waveform 1 (see Note B) tPZH VOH Output Waveform 2 (see Note B) 1.5 V 1.5 V 1.5 V 0V tPLZ 3.5 V VOL + 0.3 V VOL tPHZ V VOH - 0.3 V OH 0 V
tr VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES tw
Input
1.5 V
1.5 V
VOLTAGE WAVEFORMS PULSE DURATION
Input tPLH In-Phase Output tPHL Out-of-Phase Output
1.5 V
1.5 V 0V tPHL 1.5 V 1.5 V VOL tPLH 1.5 V 1.5 V VOL
Output Control
VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr and tf = 2.5 ns. D. The outputs are measured one at a time with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPHL and tPLH are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
5
IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer's applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI's publication of information regarding any third party's products or services does not constitute TI's approval, warranty or endorsement thereof.
Copyright (c) 2000, Texas Instruments Incorporated


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