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| DICE SPECIFICATION RH27 Low noise, High Speed Precision Op Amp Fuse Link 6 7 4 PAD FUNCTION 1. VOS Trim 2. -In 3. +In 4. V - 5. No Connect 6. Out 7. V + 8. VOS Trim Backside (substrate) is an alloyed gold layer. Connect to V -. DIE CROSS REFERENCE LTC Finished Part Number RH27C Order DICE CANDIDATE Part Number Below RH27C DICE 3 8 2 1 99 x 83 mils DICE ELECTRICAL TEST LI ITS SYMBOL VOS IOS IB CMRR PSRR AVOL VOUT SR PD PARAMETER Input Offset Voltage Input Offset Current Input Bias Current Input Voltage Range Common-Mode Rejection Ratio Power Supply Rejection Ratio Large-Signal Voltage Gain Maximum Output Voltage Swing Slew Rate Power Dissipation Note 1. Input offset voltage measurements are performed by automatic equipment, approximately 0.5 seconds after application of power. Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. W VS = 15V, VCM = 0V, TA = 25C, unless otherwise noted. RH27C CONDITIONS (Note 1) MIN MAX 150 85 90 UNITS V nA nA V dB dB V/mV V V V/s mW VCM = 11 VS = 4V to 18V RL 2k, VO = 10V RL 2k RL 600 RL 2k 11.0 95 92 600 11.4 10.0 1.7 170 1 DICE SPECIFICATION RH27 Rad Hard die require special handling as compared to standard IC chips. Rad Hard die are susceptible to surface damage because there is no silicon nitride passivation as on standard die. Silicon nitride protects the die surface from scratches by its hard and dense properties. The passivation on Rad Hard die is silicon dioxide that is much "softer" than silicon nitride. LTC recommends that die handling be performed with extreme care so as to protect the die surface from scratches. If the need arises to move the die around from the chip tray, use a Teflon-tipped vacuum wand. This wand can be made by pushing a small diameter Teflon tubing onto the tip of a steel-tipped wand. The inside diameter of the Teflon tip should match the die size for efficient pickup. The tip of the Teflon should be cut square and flat to ensure good vacuum to die surface. Ensure the Teflon tip remains clean from debris by inspecting under stereoscope. During die attach, care must be exercised to ensure no tweezers touch the top of the die. Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information on dice performance and lot qualifications via lot sampling test procedures. Dice data sheet subject to change. Please consult factory for current revision in production. I.D. No. 66-10-155 2 Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 FAX: (408) 434-0507 TELEX: 499-3977 LT/LT 0599 50 Rev A * PRINTED IN USA (c) LINEAR TECHNOLOGY CORPORATION 1997 |
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