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DICE SPECIFICATION RH137 Negative Adjustable Regulator
PAD FUNCTION
2 3 2 3
This pad is NO CONNECT on H Package
DIE CROSS REFERENCE
LTC Finished Part Number RH137K RH137K RH137H RH137H Order DICE CANDIDATE Part Number Below RH137K DICE RH137K DWF RH137H DICE RH137H DWF
1. ADJUST 2. OUTPUT 3. INPUT
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85 x 89 mils
DICE ELECTRICAL TEST LI ITS
SYMBOL PARAMETER VREF Reference Voltage CONDITIONS
VIN - VOUT = 5V, IOUT = 10mA 3V VIN - VOUT 30V, 10mA IOUT 200mA P PMAX 3V VIN - VOUT 30V 10mA IOUT IMAX, VOUT 5V (Note 2) 10mA IOUT IMAX, VOUT 5V (Note 2)
VOUT VIN VOUT IOUT IADJ IADJ IMIN
Line Regulation Load Regulation Adjust Pin Current
Adjust Pin Current Change 10mA IOUT IMAX 3V VIN - VOUT 30V Minimum Load Current Current Limit VIN - VOUT = 30V VIN - VOUT = 3V VIN - VOUT 15V VIN - VOUT = 30V H Package K Package H Package K Package 0.5 1.5 0.15 0.24
Note 1: Dice are probe tsted at 25C to the limits shown except for high current tests. Dice are tested under low current conditions which assure full load current specifications when assembled in packaging systems approved by Linear Technology. For absolute maximum ratings, typical specifications, performance curves and finished product specifications, please refer to the standard product RH data sheet.
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
W
(Note 1)
TA = 25C MIN -1.225 -1.200 MAX -1.275 -1.300 0.02 25 0.5 100 5 5 5 3 1.5 3.2 0.5 1.0 0.5 1.5 - 55C TA 150C MIN MAX -1.200 -1.300 0.05 50 1 100 5 5 5 3 UNITS V V %/V mV % A A A mA mA A A A A
Note 2: Testing is done using a pulsed low duty cycle technique. See thermal regulation specifications for output changes due to heating effects.
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DICE SPECIFICATION RH137
Rad Hard die require special handling as compared to standard IC chips. Rad Hard die are susceptible to surface damage because there is no silicon nitride passivation as on standard die. Silicon nitride protects the die surface from scratches by its hard and dense properties. The passivation on Rad Hard die is silicon dioxide that is much "softer" than silicon nitride. LTC recommends that die handling be performed with extreme care so as to protect the die surface from scratches. If the need arises to move the die around from the chip tray, use a Teflon-tipped vacuum wand. This wand can be made by pushing a small diameter Teflon tubing onto the tip of a steel-tipped wand. The inside diameter of the Teflon tip should match the die size for efficient pickup. The tip of the Teflon should be cut square and flat to ensure good vacuum to die surface. Ensure the Teflon tip remains clean from debris by inspecting under stereoscope. During die attach, care must be exercised to ensure no tweezers touch the top of the die.
Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information on dice performance and lot qualifications via lot sampling test procedures. Dice data sheet subject to change. Please consult factory for current revision in production.
I.D.No. 66-13-0136
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Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 FAX: (408) 434-0507
LT/LT 0402 50 REV A * PRINTED IN USA
www.linear.com
(c) LINEAR TECHNOLOGY CORPORATION 1998

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