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MSC1200 MS C12 00 SBAS289 - JUNE 2003 Precision Analog-to-Digital Converter (ADC) and Digital-to-Analog Converter (DAC) with 8051 Microcontroller and Flash Memory FEATURES ANALOG FEATURES q 24-BITS NO MISSING CODES q 22-BITS EFFECTIVE RESOLUTION AT 10Hz Low Noise: 75nV q PGA FROM 1 TO 128 q PRECISION ON-CHIP VOLTAGE REFERENCE: Accuracy: 0.2% Drift: 5ppm/C q 8 DIFFERENTIAL/SINGLE-ENDED CHANNELS q ON-CHIP OFFSET/GAIN CALIBRATION q OFFSET DRIFT: 0.02ppm/C q GAIN DRIFT: 0.5ppm/C q ON-CHIP TEMPERATURE SENSOR q SELECTABLE BUFFER INPUT q BURNOUT DETECT q 8-BIT CURRENT DAC DIGITAL FEATURES Microcontroller Core q 8051 COMPATIBLE q HIGH SPEED CORE: 4 Clocks per Instruction Cycle q DC TO 33MHz q ON-CHIP OSCILLATOR q PLL WITH 32kHz CAPABILITY q SINGLE INSTRUCTION 121ns q DUAL DATA POINTER Memory q UP TO 8kB FLASH DATA MEMORY q FLASH MEMORY PARTITIONING q ENDURANCE 1M ERASE/WRITE CYCLES, 100 YEAR DATA RETENTION q IN-SYSTEM SERIALLY PROGRAMMABLE q FLASH MEMORY SECURITY q 1kB BOOT ROM q PROGRAMMABLE WAIT STATE CONTROL Peripheral Features q 16 I/O PINS q ADDITIONAL 32-BIT ACCUMULATOR q TWO 16-BIT TIMER/COUNTERS q SYSTEM TIMERS q PROGRAMMABLE WATCHDOG TIMER q FULL DUPLEX UART q BASIC SPITM q BASIC I2CTM q POWER MANAGEMENT CONTROL q INTERNAL CLOCK DIVIDER q IDLE MODE CURRENT < 200A q STOP MODE CURRENT < 100nA q PROGRAMMABLE BROWNOUT RESET q PROGRAMMABLE LOW VOLTAGE DETECT q 20 INTERRUPT SOURCES GENERAL FEATURES q PACKAGE: TQFP-48 q LOW POWER: 4mW q INDUSTRIAL TEMPERATURE RANGE: -40C to +85C q POWER SUPPLY: 2.7V to 5.25V APPLICATIONS q q q q q q q q q q q INDUSTRIAL PROCESS CONTROL INSTRUMENTATION LIQUID/GAS CHROMATOGRAPHY BLOOD ANALYSIS SMART TRANSMITTERS PORTABLE INSTRUMENTS WEIGH SCALES PRESSURE TRANSDUCERS INTELLIGENT SENSORS PORTABLE APPLICATIONS DAS SYSTEMS Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright (c) 2003, Texas Instruments Incorporated www.ti.com PRODUCT PREVIEW PACKAGE/ORDERING INFORMATION FLASH MEMORY PACKAGE-LEAD 4k 4k 8k 8k TQFP-48 PACKAGE DESIGNATOR(1) PFB SPECIFIED TEMPERATURE RANGE -40C to +85C PACKAGE MARKING MSC1200Y2 ORDERING NUMBER MSC1200Y2PFBT MSC1200Y2PFBR MSC1200Y3PFBT MSC1200Y3PFBR TRANSPORT MEDIA, QUANTITY Tape and Reel, 250 Tape and Reel, 2000 Tape and Reel, 250 Tape and Reel, 2000 PRODUCT MSC1200Y2 MSC1200Y2 MSC1200Y3 MSC1200Y3 " TQFP-48 " PFB " -40C to +85C " MSC1200Y3 " " " " NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com/msc. ABSOLUTE MAXIMUM RATINGS(1) Analog Inputs Input Current ............................................................ 100mA, Momentary Input Current .............................................................. 10mA, Continuous Input Voltage ............................................. AGND - 0.5V to AVDD + 0.5V Power Supply DVDD to DGND ...................................................................... -0.3V to 6V AVDD to AGND ...................................................................... -0.3V to 6V AGND to DGND .............................................................. -0.3V to +0.3V VREF to AGND ....................................................... -0.3V to AVDD + 0.3V Digital Input Voltage to DGND .............................. -0.3V to DVDD + 0.3V Digital Output Voltage to DGND ........................... -0.3V to DVDD + 0.3V Maximum Junction Temperature ................................................ +150C Operating Temperature Range ...................................... -40C to +85C Storage Temperature Range ....................................... -65C to +150C Lead Temperature (soldering, 10s) ............................................ +300C Package Power Dissipation ........................................................ 822mW Output Current All Pins ................................................................ 200mA Output Pin Short Circuit ..................................................................... 10s Thermal Resistance, Junction-to-Ambient (JA) .......................... 73C/W Thermal Resistance, Junction-to-Case (JC) ........................... 12.8C/W Digital Outputs Output Current ......................................................... 100mA, Continuous I/O Source/Sink Current ............................................................... 100mA Power Pin Maximum .................................................................... 300mA NOTE: (1) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to absolute-maximumrated conditions for extended periods may affect device reliability. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PRODUCT PREVIEW MSC1200Yx FAMILY FEATURES FEATURES(1) Flash Program Memory (Bytes) Flash Data Memory (Bytes) Internal Scratchpad RAM (Bytes) MSC1200Y2(2) Up to 4k Up to 4k 128 MSC1200Y3(2) Up to 8k Up to 8k 128 NOTES: (1) All peripheral features are the same on all devices; the flash memory size is the only difference. (2) The last digit of the part number (N) represents the onboard flash size = (2N)kBytes. ELECTRICAL CHARACTERISTICS: AVDD = 5V All specifications from TMIN to TMAX, DVDD = +2.7V to 5.25V, fMOD = 15.625kHz, PGA = 1, Buffer ON, fDATA = 10Hz, Bipolar, and VREF (REF IN+) - (REF IN-) = +2.5V, unless otherwise noted. MSC1200Yx PARAMETER ANALOG INPUT (AIN0-AIN7, AINCOM) Analog Input Range Full-Scale Input Voltage Range Differential Input Impedance Input Current Bandwidth Fast Settling Filter Sinc2 Filter Sinc3 Filter Programmable Gain Amplifier Input Capacitance Input Leakage Current Burnout Current Sources ADC OFFSET DAC Offset DAC Range Offset DAC Monotonicity Offset DAC Gain Error Offset DAC Gain Error Drift CONDITION Buffer OFF Buffer ON (In+) - (In-) See Figure 4 Buffer OFF Buffer ON -3dB -3dB -3dB User-Selectable Gain Ranges Buffer ON Multiplexer Channel Off, T = +25C Sensor Input Open Circuit MIN AGND - 0.1 AGND + 50mV 5/PGA 0.5 0.469 * fDATA 0.318 * fDATA 0.262 * fDATA 1 4 0.5 2 VREF/(2 * PGA) 8 1.5 1 128 pF pA A V Bits % of Range ppm/C TYP MAX AVDD + 0.1 AVDD - 1.5 VREF/PGA UNITS V V V M nA 2 MSC1200 www.ti.com SBAS289 ELECTRICAL CHARACTERISTICS: AVDD = 5V (Cont.) All specifications from TMIN to TMAX, DVDD = +2.7V to 5.25V, fMOD = 15.625kHz, PGA = 1, Buffer ON, fDATA = 10Hz, Bipolar, and VREF (REF IN+) - (REF IN-) = +2.5V, unless otherwise noted. MSC1200Yx PARAMETER SYSTEM PERFORMANCE Resolution ENOB Output Noise No Missing Codes Integral Nonlinearity Offset Error Offset Drift(1) Gain Error(2) Gain Error Drift(1) System Gain Calibration Range System Offset Calibration Range Common-Mode Rejection CONDITION MIN TYP MAX UNITS 24 22 See Typical Characteristics Sinc3 Filter End Point Fit, Differential Input After Calibration Before Calibration After Calibration Before Calibration 24 0.0015 7.5 0.02 0.005 0.5 80 -50 100 120 50 115 130 120 120 100 100 88 AVDD(2) AVDD Bits Bits Bits %FSR ppm of FS ppm of FS/C % ppm/C % of FS % of FS dB dB dB dB dB dB dB V V dB A A V V dB mA A ppm/C ms mV V/C mA V of FSR of FSR of FSR of FSR V nA A A A A A A Normal Mode Rejection Power-Supply Rejection VOLTAGE REFERENCE INPUTS Reference Input Range ADC VREF Common-Mode Rejection Input Current(4) DAC Reference Current ON-CHIP VOLTAGE REFERENCE Output Voltage Power-Supply Rejection Ratio Short-Circuit Current Source Short-Circuit Current Sink Short-Circuit Duration Drift Output Impedance Startup Time from Power ON Temperature Sensor Temperature Sensor Voltage Temperature Sensor Coefficient IDAC OUTPUT CHARACTERISTICS Full-Scale Output Current Maximum Short-Circuit Current Duration Compliance Voltage Relative Accuracy Zero Code Error Full-Scale Error Gain Error ANALOG POWER-SUPPLY REQUIREMENTS Power-Supply Voltage Analog Current IADC + IVREF ADC Current IADC At DC fCM = 60Hz, fDATA = 10Hz fCM = 50Hz, fDATA = 50Hz fCM = 60Hz, fDATA = 60Hz fSIG = 50Hz, fDATA = 50Hz fSIG = 60Hz, fDATA = 60Hz At DC, dB = -20log(VOUT/VDD)(3) REF IN+, REF IN- VREF (REF IN+) - (REF IN-) At DC VREF = 2.5V, ADC Only For Each DAC, 5V Reference VREFH = 1 at +25C, PGA = 1, 2, 4, 8 VREFH = 0 0.0 0.3 2.495 Sink or Source Sourcing 100A CREFOUT = 0.1F T = +25C 2.5 1.25 65 8 50 Indefinite 5 3 8 115 375 25 Indefinite AVDD - 1.5 0.185 0.5 -0.4 -0.6 2.505 Maximum VREF = 2.5V Over Full Range % % % % 5.25 VDAC Current VREF Supply Current IVDAC IVREF AVDD Analog OFF, PDAD = 1 PGA = 1, Buffer OFF PGA = 128, Buffer OFF PGA = 1, Buffer ON PGA = 128, Buffer ON Excluding Load Current External Reference ADC ON, VDAC OFF 4.75 <1 200 500 240 850 250 250 NOTES: (1) Calibration can minimize these errors. (2) The gain calibration cannot have a REF IN+ of more than AVDD - 1.5V with buffer ON. To calibrate gain, turn buffer off. (3) DVOUT is change in digital result. (4) 12pF switched capacitor at fSAMP clock frequency. MSC1200 SBAS289 www.ti.com 3 PRODUCT PREVIEW 2.5 110 10 25 ELECTRICAL CHARACTERISTICS: AVDD = 3V All specifications from TMIN to TMAX, AVDD = +3V, DVDD = +2.7V to 5.25V, fMOD = 15.625kHz, PGA = 1, Buffer ON, fDATA = 10Hz, Bipolar, and VREF (REF IN+) - (REF IN-) = +1.25V, unless otherwise noted. MSC1200Yx PARAMETER ANALOG INPUT (AIN0-AIN7, AINCOM) Analog Input Range Full-Scale Input Voltage Range Differential Input Impedance Input Current Bandwidth Fast Settling Filter Sinc2 Filter Sinc3 Filter Programmable Gain Amplifier Input Capacitance Input Leakage Current Burnout Current Sources ADC OFFSET DAC Offset DAC Range Offset DAC Monotonicity Offset DAC Gain Error Offset DAC Gain Error Drift SYSTEM PERFORMANCE Resolution ENOB Output Noise No Missing Codes Integral Nonlinearity Offset Error Offset Drift(1) Gain Error(2) Gain Error Drift(1) System Gain Calibration Range System Offset Calibration Range Common-Mode Rejection CONDITION Buffer OFF Buffer ON (In+) - (In-) See Figure 4 Buffer OFF Buffer ON -3dB -3dB -3dB User-Selectable Gain Ranges Buffer On Multiplexer Channel Off, T = +25C Sensor Input Open Circuit MIN AGND - 0.1 AGND + 50mV 5/PGA 0.5 0.469 * fDATA 0.318 * fDATA 0.262 * fDATA 1 4 0.5 2 VREF/(2 * PGA) 8 1.5 1 24 22 See Typical Characteristics Sinc3 Filter End Point Fit, Differential Input After Calibration Before Calibration After Calibration Before Calibration 24 0.0015 7.5 0.02 0.005 1.0 80 -50 100 120 50 115 130 120 120 100 100 85 AVDD(2) AVDD 128 pF pA A V Bits % of Range ppm/C Bits Bits Bits %FSR ppm of FS ppm of FS/C % ppm/C % of FS % of FS dB dB dB dB dB dB dB V V dB A A V dB mA A ppm/C ms mV V/C mA TYP MAX AVDD + 0.1 AVDD - 1.5 VREF/PGA UNITS V V V M nA PRODUCT PREVIEW Normal Mode Rejection Power-Supply Rejection VOLTAGE REFERENCE INPUTS Reference Input Range ADC VREF Common-Mode Rejection Input Current(4) DAC Reference Current ON-CHIP VOLTAGE REFERENCE Output Voltage Power-Supply Rejection Ratio Short-Circuit Current Source Short-Circuit Current Sink Short-Circuit Duration Drift Output Impedance Startup Time from Power ON Temperature Sensor Temperature Sensor Voltage Temperature Sensor Coefficient IDAC OUTPUT CHARACTERISTICS Full-Scale Output Current Maximum Short-Circuit Current Duration Compliance Voltage Relative Accuracy Zero Code Error Full-Scale Error Gain Error fCM = fCM = fCM = fSIG = fSIG = At DC, dB At DC 60Hz, fDATA = 10Hz 50Hz, fDATA = 50Hz 60Hz, fDATA = 60Hz 50Hz, fDATA = 50Hz 60Hz, fDATA = 60Hz = -20log(DVOUT/DVDD)(3) REF IN+, REF IN- VREF (REF IN+) - (REF IN-) At DC VREF = 1.25V, ADC Only For each DAC, 3V Reference VREFH = 0 at +25C, PGA = 1, 2, 4, 8 0.0 0.3 1.25 110 10 25 1.25 65 2.6 50 Indefinite 5 3 8 115 375 25 Indefinite AVDD - 1.5 0.185 0.5 -0.4 -0.6 1.245 1.255 Sink or Source Sourcing 100A CREFOUT = 0.1F T = +25C Maximum VREF = 2.5V Over Full Range % % % % of of of of FSR FSR FSR FSR 4 MSC1200 www.ti.com SBAS289 ELECTRICAL CHARACTERISTICS: AVDD = 3V (Cont.) All specifications from TMIN to TMAX, AVDD = +3V, DVDD = +2.7V to 5.25V, fMOD = 15.625kHz, PGA = 1, Buffer ON, fDATA = 10Hz, and Bipolar, VREF (REF IN+) - (REF IN-) = +1.25V, unless otherwise noted. MSC1200Yx PARAMETER POWER-SUPPLY REQUIREMENTS Power-Supply Voltage Analog Current IADC + IVREF ADC Current IADC CONDITION MIN TYP MAX UNITS VDAC Current VREF Current IVDAC IVREF AVDD Analog OFF, PDAD = 1 PGA = 1, Buffer OFF PGA = 128, Buffer OFF PGA = 1, Buffer ON PGA = 128, Buffer ON Excluding Load Current External Reference 2.7 <1 200 500 240 850 250 250 3.6 V nA A A A A A A NOTES: (1) Calibration can minimize these errors. (2) The gain calibration cannot have a REF IN+ of more than AVDD - 1.5V with buffer ON. To calibrate gain, turn buffer off. (3) DVOUT is change in digital result. (4) 12pF switched capacitor at fSAMP clock frequency. DIGITAL CHARACTERISTICS: DVDD = 2.7V to 5.25V All specifications from TMIN to TMAX, unless otherwise specified. MSC1200Yx PARAMETER POWER-SUPPLY REQUIREMENTS DVDD Normal Mode, fOSC = 1MHz Normal Mode, fOSC = 8MHz Stop Mode DVDD Normal Mode, fOSC = 1MHz Normal Mode, fOSC = 8MHz Stop Mode DIGITAL INPUT/OUTPUT (CMOS) Logic Level: VIH (except XIN pin) VIL (except XIN pin) Ports 1 and 3, Input Leakage Current, Input Mode Pin XIN Input Leakage Current VOL, Ports 1 and 3, All Output Modes VOL, Ports 1 and 3, All Output Modes VOH, Ports 1 and 3, Strong Drive Output VOH, Ports 1 and 3, Strong Drive Output Ports 1 and 3 Pull-Up Resistors Pin Pull-Up Resistors Pin RST, Pull-Down Resistor 2.7 1.3 6 100 4.75 2.2 14 100 0.6 * DVDD DGND -10 DGND DVDD - 0.4 1.5 DVDD - 0.1 DVDD - 1.5 9 9 200 DVDD 0.2 * DVDD +10 0.4 DVDD 5.25 3.6 V mA mA nA V mA mA nA V V A A V V V V k k k CONDITION MIN TYP MAX UNITS VIH = DVDD or VIH = 0V IOL = 1mA IOL = 30mA, 3V (20mA) IOH = 1mA IOH = 30mA, 3V (20mA) Flash Programming Mode Only 0 0 FLASH MEMORY CHARACTERISTICS: DVDD = 2.7V to 5.25V tUSEC = 1s, tMSEC = 1ms MSC1200Yx PARAMETER Flash Flash Mass Flash Memory Endurance Memory Data Retention and Page Erase Time Memory Write Time CONDITION MIN 100,000 100 10 30 TYP 1,000,000 MAX UNITS cycles Years ms s Set with FER Value in FTCON Set with FWR Value in FTCON 40 MSC1200 SBAS289 www.ti.com 5 PRODUCT PREVIEW AC ELECTRICAL CHARACTERISTICS(1)(2): DVDD = 2.7V to 5.25V 2.7V to 3.6V SYMBOL System Clock fOSC(3) 1/tOSC(3) fOSC(3) External Clock tHIGH tLOW tR tF FIGURE A A A A A A A PARAMETER External Crystal Frequency (fOSC) External Clock Frequency (fOSC) External Ceramic Resonator Frequency (fOSC) HIGH Time(4) LOW Time(4) Rise Time(4) Fall Time(4) MIN 1 0 1 15 15 5 5 MAX 16 16 12 4.75V to 5.25V MIN 1 1 1 10 10 5 5 MAX 33 33 12 UNITS MHz MHz MHz ns ns ns ns NOTES: (1) Parameters are valid over operating temperature range, unless otherwise specified. (2) Load capacitance for outputs = 80pF. (3) tCLK = 1/fOSC = one oscillator clock period for clock divider = 1. (4) These values are characterized but not 100% production tested. EXPLANATION OF THE AC SYMBOLS Each Timing Symbol has five characters. The first character is always `t' (= time). The other characters, depending on their positions, indicate the name of a signal or the logical status of that signal. The designators are: C--Clock D--Input Data H--Logic Level HIGH I--Instruction (program memory contents) L--Logic Level LOW Q--Output Data t--Time V--Valid X--No Longer a Valid Logic Level Z--Float Examples: (1) tAVLL = Time for address valid to ALE LOW. (2) tLLPL = Time for ALE LOW to PSEN LOW. PRODUCT PREVIEW tHIGH VIH1 0.8V VIH1 0.8V tLOW VIH1 0.8V tOSC tr VIH1 0.8V tf FIGURE A. External Clock Drive CLK. RST tRFD, P1.0 NOTE: P1.0 is internally pulled-up with ~9k during RST high. FIGURE B. Serial Flash Programming Power-On Timing. SYMBOL tRW tRRD tRFD tRS tRH PARAMETER RST width RST rise to P1.0 internal pull high RST falling to p1.0 start Input signal to RST falling setup time RST falling to input signal hold time MIN 2 tOSC -- -- tOSC (217 + 512) tOSC MAX -- 5 (217 + 512) tOSC -- -- UNIT ns s ns ns ns 6 MSC1200 www.ti.com SBAS289 PIN CONFIGURATION Top View TQFP P3.0/RxD0 38 P3.1/TxD0 P3.3/INT1 P3.2/INT0 48 NC XIN XOUT DGND RST NC NC PLL CAP AVDD 1 2 3 4 5 6 7 8 9 47 46 45 44 43 42 41 40 39 37 36 DVDD 35 DVDD 34 DGND 33 DGND 32 P1.6/INT4 P1.7/INT5 31 P1.5/INT3 30 P1.4/INT2 29 P1.3/DIN 28 P1.2/DOUT 27 P1.1 26 P1.0 25 NC P3.6/SCK P3.5/T1 MSC1200 P3.4/T0 DGND DVDD P3.7 NC AGND 10 AGND 11 AINCOM 12 13 14 15 16 17 18 19 20 21 22 23 24 MSC1200 SBAS289 www.ti.com 7 PRODUCT PREVIEW REFOUT/REFIN+ IDAC AIN7 AIN6 AIN5 AIN4 AIN3 AIN2 AIN1 REFIN- AIN0 NC PIN DESCRIPTIONS PIN # 1,6,7,16,25,47 2 3 4, 33, 34, 48 5 8 9 10, 11 12 13 14 15 17 18 19 20 21 22 23 24 26-32, 37 NAME NC XIN XOUT DGND RST PLL CAP AVDD AGND AINCOM IDAC REFOUT/REF IN+ REF IN- AIN7 AIN6 AIN5 AIN4 AIN3 AIN2 AIN1 AIN0 P1.0-P1.7 DESCRIPTION No Connection The crystal oscillator pin XIN supports parallel resonant AT cut crystals and ceramic resonators. XIN can also be an input if there is an external clock source instead of a crystal. The crystal oscillator pin XOUT supports parallel resonant AT cut crystals and ceramic resonators. XOUT serves as the output of the crystal amplifier. Digital Ground A HIGH on the reset input for two tOSC periods will reset the device. Analog Power Supply Analog Ground Analog Common for Single-Ended Inputs IDAC Output Voltage Reference Output/ Voltage Reference Positive Input Voltage Reference Negative Input Analog Input Channel 7 Analog Input Channel 6 Analog Input Channel 5 Analog Input Channel 4 Analog Input Channel 3 Analog Input Channel 2 Analog Input Channel 1 Analog Input Channel 0 Port 1 is a bidirectional I/O port. The alternate functions for Port 1 are listed below. Port 1--Alternate Functions: PORT P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 38-45 P3.0-P3.7 ALTERNATE N/A N/A DOUT DIN INT2 INT3 INT4 N/A MODE PRODUCT PREVIEW Serial Data Out Serial Data In External Interrupt 2 External Interrupt 3 External Interrupt 4 Port 3 is a bidirectional I/O port. The alternate functions for Port 3 are listed below. Port 3--Alternate Functions: PORT P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 35, 36, 46 DVDD Digital Power Supply ALTERNATE RxD0 TxD0 INT0 INT1 T0 T1 SCK N/A MODE Serial Port 0 Input Serial Port 0 Output External Interrupt 0 External Interrupt 1 Timer 0 External Input Timer 1 External Input SCK 8 MSC1200 www.ti.com SBAS289 PACKAGE DRAWINGS PFB (S-PQFP-G48) PLASTIC QUAD FLATPACK 0,50 36 25 0,27 0,17 0,08 M 37 24 48 13 0,13 NOM 1 5,50 TYP 7,20 SQ 6,80 9,20 SQ 8,80 0,05 MIN 1,05 0,95 Seating Plane 0,75 0,45 Gage Plane 0,25 0- 7 12 1,20 MAX 0,08 4073176 / B 10/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC MS-026 MSC1200 SBAS289 www.ti.com 9 PRODUCT PREVIEW MECHANICAL DATA MTQF019A - JANUARY 1995 - REVISED JANUARY 1998 PFB (S-PQFP-G48) PLASTIC QUAD FLATPACK 0,50 36 25 0,27 0,17 0,08 M 37 24 48 13 0,13 NOM 1 5,50 TYP 7,20 SQ 6,80 9,20 SQ 8,80 0,05 MIN 1,05 0,95 Seating Plane 0,75 0,45 Gage Plane 0,25 0- 7 12 1,20 MAX 0,08 4073176 / B 10/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC MS-026 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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