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1300 nm ESCON(R) Parallel Transceiver
FEATURES * Complies with ESCON and SBCON standards * Fully compatible with Siemens former parallel transceiver V23806-A6-X1 * Includes clock recovery module, parallel-serial/ serial-parallel and ESCON/SBCON receptacle * SMT component for easy mounting on surface mount PC boards * Mates keyed ESCON/SBCON connector * Data rates for ESCON/SBCON applications * Data rates for individual applications from 100 to 300 MBaud * Transmission distance of 3 km and more * All inputs and outputs TTL compatible * System optimized for 62.5 and 50 m graded index fiber * 0.7" spacing between optical interface of transmitter and receiver * Low profile for high slot density APPLICATIONS * ESCON architecture * High speed computer links * Local area networks * High definition/digital television * Switching systems * Control systems Regulatory Compliance
Feature Electromagnetic Interference (EMI) Immunity: Electrostatic Discharge Standard Comments FCC Class B Noise frequency EN 55022 Class B range: 30 MHz to CISPR 22 1 GHz EN 61000-4-2 IEC 1000-4-2 Discharges of 15 kV with an air discharge probe on the receptacle cause no damage. With a field strength of 10 V/m rms, noise frequency ranges from 10 MHz to 1 GHz Class 1
(31.90.15) 1.256.006
V23809-E1-E30
Dimensions in inches (mm)
(0.3) .012 17x (0.5) M A M
Receptacle fully complies with ESCON/SBCON specification M2.5x6 (PCB thickness 1.2 . . . 2 mm) M2.5x8 (PCB thickness 2 . . . 4 mm)
A
(30.48) 1.2 (35.4) 1.4 max. (350.3) 1.38.012 (20.32) .8 (1.27) .05 16x
(2.250.2) .089.008 (2.46) .097
Module fixing with 4 metric screws (11.9) .469 Optical Reference Plane
16x (1.27) .05 (0.3) .012 34x (0.5) M B M
(20.32) 8 (30.48) 1.2 B (85) 3.35
4x .146
(3.7)
PCB (1.2) min. .047 min. (44.80.25) 1.765.006
(11.4) .449
Absolute Maximum Ratings Exceeding any one of these values may destroy the device immediately. Supply Voltage (VCC-VEE).................................................... -0.5 V to7 V Maximum Input Voltage (VIN) ............................................... VEE to VCC Operating Ambient Temperature (TAMB) ............................. 0 C to 85C Humidity/Temperature Test Condition (RH).............................85%/85C Life Test Condition (TAMB/LIfe)........................................... 115C/1000h Soldering Conditions Temp/Time (TSOLD)...............................260C/10s ESD Resistance (all pins to VEE, human body) ..............................1.5 kV Output Current (lO).......................................................................50 mA
Immunity: Radio Frequency Electromagnetic Field
EN 61000-4-3 IEC 1000-4-3
Eye Safety
IEC 825-1
ESCON(R) is a registered trademark of IBM.
Semiconductor Group
FEBRUARY 1998
DESCRIPTION The Siemens ESCON/SBCON optical device, along with the ESCON/SBCON optical duplex connector, is best suited for high speed fiber optic duplex transmission systems operating at a wavelength of 1300 nm. The system is fully compatible with the IBM ESCON standard and the ANSI SBCON standard. The ESCON parallel transceiver includes a transmitter, a receiver, a clock recovery function and serial/parallel interfaces. It is designed for data rates of up to 300 MBaud. A non-dissipative plastic receptacle matches the ESCON duplex connector. The inputs/outputs are TTL compatible and the unit operates from a single power supply of 4.5 V to 5.5 V. The optical interfaces of the transmitter and receiver have standard 0.7" spacing. Receptacle and connector have been keyed to prevent reverse insertion of the connector into the receptacle. After proper insertion, the connector is securely held by a snap-in lock mechanism. The transmitter converts parallel electrical TTL input signals into an optical serial signal at data rates of between 100 and 300 MBaud. The receiver performs clock recovery on the incoming data stream and converts data into parallel output. Functionality
Transmitter Electro-Optical Characteristics
Transmitter Data Rate Supply Current(1) Launched Power (Ave.) BOL into 62.5 m Fiber(2, 3, 4) Launched Power (Ave.) EOL into 62.5 m Fiber(2, 3. 4, 5) Center Wavelength(6) Spectral Width (FWHM)(7) Temperature Coefficient, Optical Output Power C TCp Symbol Min. DR lCC P
O
Typ.
Max. Units 300 300 MBaud mA dBm
100
-20
-16.5
-14
-21.5
1280
1355 175 0.03
nm
dB/C
Output Rise/Fall Time, tR, tF 20%-80%(6) Deterministic Jitter(8) Random Jitter(9) Extinction Ratio (Dynamic)(10) JD JR ER
1 0.6
1.65 0.8 0.06
ns
-16
-13
dB
Notes 1. Transmitter operating at 200 MBaud and 50% duty cycle. 2. Measured at the end of 1 meter fiber. Cladding modes removed at a data rate of between 50 and 200 MBaud, 50% duty cycle. 3. PO [dBm]=10 log (PO/1 mW). PO (BOL) >-20dBm and PO (EOL) >-21.5 dBm at TCASE=60C. Over 105 hours lifetime at TAMB=35C. Measured at TCASE=60C. Full width, half magnitude of peak wavelength. Special relationship between c, , tR/tF according to FC-PH Rev 4.3 Paragraph 6.3.2. and Fig.26. Spectral width must be considered. 8. Measured at 200 MBaud with Jitter Test Pattern (see page 4). In the Test Pattern are five positive and five negative transitions. Measure the time of the 50% crossing of all 10 transitions. The time of each crossing is then compared to the mean expected time of the crossing. Deterministic jitter is the range of the timing variations. 9. RMS value measured with 1010 pattern. Peak-to-peak value is determined as RMS multiplied by 14 for BER 1E-12. 10.Extinction ratio is the logarithmic measure of the optical power in the OFF state (POFF) to twice the average power (PO). ER=10 log [(2xPO)/POFF] (optical power measured in mW), or E=|PO+3 dB| -POFF (optical power measured in dBm). . 4. 5. 6. 7 .
TECHNICAL DATA The electro-optical characteristics described in the following tables are valid only for use under the recommended operating conditions. Recommended Operating Conditions
Parameter Ambient Temperature Power Supply Voltage Supply Current Data Input High Voltage Data Input Low Voltage Input Data Rise/Fall, 10%-90% Output Current High Output Current Low Symbol TAMB VCC-VEE ICC VIH VIL tR, tF lO lCC2 2 VEE 0.4 Min. 0 4.75 Max. 70 5.25 400 VCC 0.8 1.3 -0.4 4 ns mA Units
C
V mA V
Semiconductor Group
V23809-E1-E30, 1300 nm ESCON(R) Parallel Transceiver
2
Receiver Electro-Optical Characteristics
Receiver Data Rate Supply Current (1) Sensitivity (Average Power) BOL(2, 3, 4) Sensitivity (Average Power) EOL(2, 3, 4, 5) Saturation (Average Power) Signal Detect Assert Level(6) Signal Detect Deassert Level(6) Signal Detect Hysteresis Signal Detect Reaction Time Max. Deterministic Jitter Optical Input(7, 9) Max. Random Jitter RMS Optical Input(8, 9) PSAT PSDA PSDD PSDA- PSDD SDreac JD Symbol Dr lCC PIN -32.5 -32 -14 -44.5 -45 0.5 3 1.5 -36 -37.5 3 500 0.19 dB s % of Unit Intervals Min. 100 Typ. Max. 300 100 -35.5 -14 -35 -14 Units MBaud mA dBm
Pin Description 10 Bit Interface
Pin# Pin Name Level/Logic Description Power Supply Ground attached to the case Preamplifier positive power supply TTL out TTL in Signal detected Control input for RX PLL Control of byte alignment operation Power Supply Bipolar IC positive power supply Data output parallel 10 channels Read byte clock Parity bit out Byte synchronization operation TTL out Power Supply TTL in Parity bit error Logic positive power supply Test loop select
1, 6, 9, 26, VEE 43, 45, 48, 51 2 3 4 5 7,8 10 to 19 20 21 22 23 24, 25 27 28 29 30 31 32 33 to 42 44 46 47 49, 50 VCC PRE SIGDET LOCKREF SYNCEN VCCFAST
DOUT a to j TTL out RBCLK PAROUT BSYNC PARERR VCCSLOW Loopsel a Loopsel b RESREC RESFF TBCLK PARIN DIN j to a TESTCLK TESTMOD TXOFF VCC DRI Power Supply TTL out
JR
0.09
Notes 1. For VCC-VEE (min., max.). 50% duty cycle. 2. Measured at the end of 1 meter fiber and at a duty cycle of 50%. Cladding modes are removed. 3. PO [dBm]=10 log (PO/1mW). 4. Measured at BER=1E-12, 200 MBaud transmission rate and 50% duty cycle 27-1 PRBS pattern. For 300 MBaud the sensitivity will be decreased by 4 dB. Center wavelength between 1200 nm and 1500 nm. Fiber type 62.5/125 m/0.29 NA or 50/125 m/0.2 NA. Input optical rise and fall times 1.2 ns and 1.5 ns (20%-80%) respectively. 5. Over 105 hours lifetime at TAMB=35C. 6. Indicates the presence or absence of optical power at the receiver input. Signal detect at logic High when asserted. All powers are average power levels. Pattern 27-1 at 200 MBaud. 7 Measured at 200 MBaud with Jitter Test Pattern (see page 4). In the . test pattern are five positive and five negative transitions. Measure the time of the 50% crossing of all 10 transitions. The time of each crossing is then compared to the mean expected time of the crossing. Deterministic jitter is the range of the timing variations. 8. To convert from specified RMS value to peak-to-peak value (at BER 1E-12), multiply value by 14. 9. Jitter at optical input. Jitter magnitudes above specified level may increase the bit error rate.
Receiver reset Reset all flip-flops Transmit byte clock Parity bit in Data input parallel 10 channels Test clock. In test mode this clock is the bit clock If this signal is low TESTCLK is used Transceiver off when logical high LED driver positive power supply
Semiconductor Group
V23809-E1-E30, 1300 nm ESCON(R) Parallel Transceiver
3
Signal Detect Threshold and Hysteresis
-37.5 dBm to -45 dBm Asserted -44.5 dBm to -36 dBm
Jitter Test Pattern
00111110101100000101
Deasserted 0.5 dB 1.5 dB 3 dB
delta PSD
Block Diagram of ESCON Parallel Transceiver
TESTCLK TESTMOD TXOFF
TBCLK
PLL x10
BitClk select
AND EN OPT DATA O E
10 DIN a. . . j PARIN PARERR Parity checker 10 P S C PSC D
TXDATA EOC
TXCLK
LOOPSELa LOOPSELb
Y0 0 Y1 L1 Test- Y2 L2 loop Y3 10 select L3 10
L2 TXDATA Data Select L1 C1 PLL C0 Input Select Buffer RXDATA
DOUT a. . . j 1 PAROUT RBCLK Parity Generator 10 0 RESREC P SPC D S
D PLL L2 C Clock Select Retime Data
O
E TXCLK EOC
RESFF SYNCEN BSYNC LOCKREF SIGDET
Semiconductor Group
V23809-E1-E30, 1300 nm ESCON(R) Parallel Transceiver
4
APPLICATION NOTE Power Supply Filtering In most applications using the ESCON 200 MBd transceiver additional high speed circuits, such as a switching power supply, clock oscillator, or high speed multiplexer, are present on the application board. These often create power supply noise at a high spectral bandwidth, which is caused by very fast transitions in today's chip technology. The Siemens ESCON transceiver provides superior EMI performance immunity against conductive noise. Some basic recommendations are given here to ensure proper functionality in the field. The use of a multilayer board with ground and VCC plane is strongly recommended. The Vcc plane should be slotted to avoid crosstalk between different circuitry inside the module. The metallized package is internally connected to the VEE pins of the module. Nevertheless, the package must be connected externally to ground for best shielding characteristics. Ground contact should be made with the ground rings shown in the diagram below. Because of high switching currents at VCCDRI, the use of an external 6.8 F to 22 F capacitor is recommended at VCCDRI. The observance of normal design rules for high speed digital systems is sufficient to ensure safe operation. Slotting of VCC Plane
Recommended Footprint Avoid placing any component or non-isolated structure, like tracks or vias, under the transceiver.
Slots
1
VCCBIP VCCCMOS VCCDRI VCCPRE
VCC Plane
Note Slots are non-copper areas inside the VCC plane to avoid crosscurrent flow.
Semiconductor Group
V23809-E1-E30, 1300 nm ESCON(R) Parallel Transceiver
5
Power On Sequence
Power On
RESFF=low LOCKREF=high RESREC=low SYNCEN=low
Signal Detect >> high wait for SIGDET
wait 50 ns RESFF >> high LOCKREF >> low wait 20 ns
Frequency Lock I
RESFF=high LOCKREF=high RESREC=low SYNCEN=low
Lock to Data
RESFF=high LOCKREF=low RESREC=low SYNCEN=low
Frequency Lock II
RESFF=high LOCKREF=high RESREC=low SYNCEN=low
wait 50 ns
wait 8 s RESREC >> high
TXOFF >> low
SYNCEN >> high LOCKREF >> high
Byte Alignment Tx Ready
RESFF=high TXOFF=low RESFF=high LOCKREF=low RESREC=high SYNCEN=high Start Timer (2 s)
SYNCEN >> low
RESREC >> low (optional)
Timeout ? No Incoming Data No Comma received ? Yes Code violations ? No SYNCEN >> low
Yes
Yes
Rx Ready
RESFF=high LOCKREF=low RESREC=high SYNCEN=low
Siemens Microelectronics, Inc. * Optoelectronics Division * 19000 Homestead Road * Cupertino, CA 95014 USA Siemens Semiconductor Group * Fiber Optics * Wernerwerkdamm 16 * Berlin D-13623, Germany www.smi.siemens.com/opto.html (USA) * www.siemens.de/Semiconductor/products/37/376.htm (Germany)

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