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| BY268.BY269 Silicon Mesa Rectifiers Features D Glass passivated junction D Hermetically sealed package Applications High voltage fast rectifier 94 9539 Absolute Maximum Ratings Tj = 25_C Parameter Peak reverse voltage, non repetitive g, p Reverse voltage g Peak forward surge current Average forward current Junction temperature Storage temperature range tp=10ms Test Conditions Type BY268 BY269 BY268 BY269 Symbol VRSM VRSM VR VR IFSM IFAV Tj Tstg Value 1600 1800 1400 1600 20 0.8 175 -65...+175 Unit V V V V A A C C Maximum Thermal Resistance Tj = 25_C Parameter Junction ambient Test Conditions on PC board with spacing 25mm Symbol RthJA Value 110 Unit K/W TELEFUNKEN Semiconductors Rev. A1, 12-Dec-94 1 (4) BY268.BY269 Characteristics Tj = 25_C Parameter Forward voltage Reverse current Test Conditions IF=0.4A VR=1400V VR=1600V VR=1400V, Tj=100C VR=1600V, Tj=100C IF=0.5A, IR=1A, iR=0.25A Type BY268 BY269 BY268 BY269 Symbol VF IR IR IR IR trr Min Typ 1 1 Max 1.25 2 2 15 15 400 Unit V mA mA mA mA ns Reverse recovery time Typical Characteristics (Tj = 25_C unless otherwise specified) 50 3 I R - Reverse Current ( mA ) 1000 Scattering Limit 100 10 25 50 1 VR = VR RM 0 40 80 120 160 200 0.1 7 2 94 9086 94 9091 Tj - Junction Temperature ( C ) Figure 1. Epoxy glass hard tissue, board thickness 1.5 mm, RthJA K/W x100 Figure 3. Reverse Current vs. Junction Temperature R thJA - Therm. Resist. Junction / Ambient ( K/W ) 120 IF - Forward Current ( A ) 100 80 60 l 40 20 0 0 5 10 15 TL=constant 20 25 30 l - Lead Length ( mm ) l 100 10 Tj = 175C 1 Tj = 25C 0.1 0.01 0 94 9092 1 2 3 4 94 9090 VF - Forward Voltage ( V ) Figure 2. Thermal Resistance vs. Lead Length Figure 4. Forward Current vs. Forward Voltage 2 (4) TELEFUNKEN Semiconductors Rev. A1, 12-Dec-94 BY268.BY269 12 CD - Diode Capacitance ( pF ) 10 8 6 4 2 0 0.1 94 9093 f = 470 KHz Tj = 25C 1 10 100 VR - Reverse Voltage ( V ) Figure 5. Diode Capacitance vs. Reverse Voltage Dimensions in mm Sintered Glass Case SOD 57 Weight max. 0.5 g Cathode Identification 94 9538 3.6 max. technical drawings according to DIN specifications 0.82 max. 26 min. 4.2 max. 26 min. TELEFUNKEN Semiconductors Rev. A1, 12-Dec-94 3 (4) BY268.BY269 Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423 4 (4) TELEFUNKEN Semiconductors Rev. A1, 12-Dec-94 |
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