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DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D087
BCP54; BCP55; BCP56 NPN medium power transistors
Product specification Supersedes data of 2001 Oct 10 2003 Feb 06
Philips Semiconductors
Product specification
NPN medium power transistors
FEATURES * High collector current * 1.3 W power dissipation. APPLICATIONS * General purpose medium power DC applications * Low and medium frequency AC applications * Peripheral drivers * Linear voltage regulators and battery chargers.
handbook, halfpage
BCP54; BCP55; BCP56
PINNING PIN 1 2, 4 3 base collector emitter DESCRIPTION
4
2, 4 1
DESCRIPTION NPN medium power transistor in a SOT223 plastic package. PNP complements: BCP51, BCP52 and BCP53.
3
1 Top view 2 3
MAM287
Fig.1
Simplified outline (SOT223) and symbol.
QUICK REFERENCE DATA SYMBOL VCEO IC ICM collector-emitter voltage collector current (DC) peak collector current PARAMETER 80 1 1.5 MAX. V A A UNIT
2003 Feb 06
2
Philips Semiconductors
Product specification
NPN medium power transistors
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCBO BCP54 BCP55 BCP56 VCEO collector-emitter voltage BCP54 BCP55 BCP56 VEBO IC ICM IBM Ptot Tstg Tj Tamb Note emitter-base voltage collector current (DC) peak collector current peak base current total power dissipation storage temperature junction temperature operating ambient temperature Tamb 25 C; note 1 open collector open base PARAMETER collector-base voltage CONDITIONS open emitter
BCP54; BCP55; BCP56
MIN. - - - - - - - - - - - -65 - -65
MAX. 45 60 100 45 60 80 5 1 1.5 0.2 1.33 +150 150 +150 V V V V V V V A A A W
UNIT
C C C
1. Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2. For other mounting conditions, see "Thermal considerations for SOT223 in the General Part of associated Handbook". THERMAL CHARACTERISTICS SYMBOL Rth j-a Rth j-s Note 1. Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2. For other mounting conditions, see "Thermal considerations for SOT223 in the General Part of associated Handbook". PARAMETER thermal resistance from junction to ambient thermal resistance from junction to soldering point CONDITIONS note 1 VALUE 94 13 UNIT K/W K/W
2003 Feb 06
3
Philips Semiconductors
Product specification
NPN medium power transistors
CHARACTERISTICS Tamb = 25 C unless otherwise specified. SYMBOL ICBO IEBO hFE PARAMETER collector cut-off current emitter cut-off current DC current gain CONDITIONS IE = 0; VCB = 30 V
BCP54; BCP55; BCP56
MIN. - - - 63 63 40 63 100
TYP. MAX. UNIT - - - - - - - - - - - 130 - 160 250 500 1 - 1.6 mV V MHz 100 10 100 - 250 - nA A nA
IE = 0; VCB = 30 V; Tj = 125 C IC = 0; VEB = 5 V IC = 5 mA; VCE = 2 V IC = 150 mA; VCE = 2 V IC = 500 mA; VCE = 2 V hFE DC current gain BCP54-10; BCP55-10; BCP56-10 BCP54-16; BCP55-16; BCP56-16 VCEsat VBE fT h FE1 ----------h FE2 collector-emitter saturation voltage base-emitter voltage transition frequency DC current gain ratio of the complementary pairs IC = 0.5 A; IB = 50 mA IC = 0.5 A; VCE = 2 V IC = 10 mA; VCE = 5 V; f = 100 MHz IC = 150 mA; VCE = 2 V IC = 150 mA; VCE = 2 V
- - - -
2003 Feb 06
4
Philips Semiconductors
Product specification
NPN medium power transistors
PACKAGE OUTLINE
BCP54; BCP55; BCP56
Plastic surface mounted package; collector pad for good heat transfer; 4 leads
SOT223
D
B
E
A
X
c y HE b1 vMA
4
Q A A1
1
e1 e
2
bp
3
wM B detail X
Lp
0
2 scale
4 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.8 1.5 A1 0.10 0.01 bp 0.80 0.60 b1 3.1 2.9 c 0.32 0.22 D 6.7 6.3 E 3.7 3.3 e 4.6 e1 2.3 HE 7.3 6.7 Lp 1.1 0.7 Q 0.95 0.85 v 0.2 w 0.1 y 0.1
OUTLINE VERSION SOT223
REFERENCES IEC JEDEC EIAJ SC-73
EUROPEAN PROJECTION
ISSUE DATE 97-02-28 99-09-13
2003 Feb 06
5
Philips Semiconductors
Product specification
NPN medium power transistors
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development
BCP54; BCP55; BCP56
DEFINITION This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 Feb 06
6
Philips Semiconductors
Product specification
NPN medium power transistors
NOTES
BCP54; BCP55; BCP56
2003 Feb 06
7
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613514/05/pp8
Date of release: 2003
Feb 06
Document order number:
9397 750 10763

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