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| PD - 94353 IRGC49B120KB Die in Wafer Form Features * * * * * * * * * GEN5 Non Punch Through (NPT) Technology Low VCE(on) 10s Short Circuit Capability Square RBSOA Positive VCE(on) Temperature Coefficient Benchmark Efficiency for Motor Control Applications Rugged Transient Performance Excellent Current Sharing in Parallel Operation Qualified for Industrial Market C Benefits G E 1200V IC(nom)= 50A VCE(on) typ.=2.33V @ IC(nom) @ 25C Motor Control IGBT Short Circuit Rated 150mm Wafer Reference Standard IR Package Part: IRGPS60B120KD Electrical Characteristics (Wafer Form) Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Guaranteed (min, max) Collector-to-Emitter Saturation Voltage 1.35V min, 1.60V max Colletor-to-Emitter Breakdown Voltage 1200V min Gate Threshold Voltage 4.4V min, 6.0V max Zero Gate Voltage Collector Current 20A max Gate-to-Emitter Leakage Current 1.1A max Test Conditions IC = 10A, TJ = 25C, VGE = 15V TJ = 25C, ICES = 500A, VGE = 0V VGE = VCE , TJ =25C, IC = 500A TJ = 25C, VCE = 1200V TJ = 25C, VGE = +/-20V Mechanical Data Nominal Backmetal Composition, (Thickness) Nominal Front Metal Composition, (Thickness) Dimensions Wafer Diameter Wafer Thickness, Tolerance Relevant Die Mechanical Dwg. Number Minimum Street Width Reject Ink Dot Size Ink Dot Location Recommended Storage Environment Recommended Die Attach Conditions Al - Ti - Ni/V - Ag, (1kA - 1kA - 4kA - 6kA) 99% Al/1% Si, (4m) 0.305" x 0.390" 150mm, with std. < 100 > flat 185m, +/-15m 01-5405 100m 0.25mm diameter minimum Consistent throughout same wafer lot Store in original container, in dessicated nitrogen, with no contamination For optimum electrical results, die attach temperature should not exceed 300C Die Outline 7.747 [.305] 6.354 [.250] NOT ES : 1. ALL DIMENS IONS ARE S HOWN IN MILLIMETERS [INCHES ]. 2. CONT ROLLING DIMENSION: [INCH]. 3. LETT ER DES IGNAT ION: S = S OURCE G = GATE S K = S OURCE KELVIN IS = CURRENTS ENS E < 0.635 T OLERANCE = + /- 0.013 < [.0250] T OLERANCE = + /- [.0005] > 0.635 T OLERANCE = + /- 0.025 > [.0250] T OLERANCE = + /- [.0010] < 1.270 T OLERANCE = + /- 0.102 < [.050] T OLERANCE = + /- [.004] > 1.270 T OLERANCE = + /- 0.203 > [.050] T OLERANCE = + /- [.008] E = EMIT TER 4. DIMENS IONAL T OLERANCES : 9.906 [.390] 8.429 [.332] BONDING PADS : WIDT H & LENGTH OVERALL DIE: EMIT T ER 1.205 [.047] G 1.196 [.047] WIDT H & LENGTH www.irf.com 01/09/02 |
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