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| w w w .D ta a Sh et e 4U . omAgilent HSMM/MN-C110, c Data Sheet C170, C190, C191, and C150 SMT ChipLEDs Description These small chip-type LEDs utilize high efficient InGaN/SiC material to deliver competitively priced high performance blue and green. These 525 nm green and 470 nm blue are unique hues which provide color differentiation to a product. These ChipLEDs come in either top emitting packages (HSMx-C170, C190, C191, and C150) or in a side emitting package (HSMx-C110). The side emitting package is especially suitable for LCD Device Selection Guide Package Dimension (mm) [1], [2] 1.6 (L) x 0.8 (W) x 0.6 (H) 1.6 (L) x 0.8 (W) x 0.8 (H) 2.0 (L) x 1.25 (W) x 0.8 (H) 3.2 (L) x 1.0 (W) x 1.5 (H) 3.2 (L) x 1.6 (W) x 1.1 (H) w w w .D backlighting application. The top emitting packages with their wide viewing angle are suitable for direct backlighting application or being used with light pipes. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel with 4000 units per reel for HSMx-C170, C190, and C191 packages, and 3000 units per reel for HSMx-C110 and C150 packages. All packages are compatible with IR soldering and binned by both color and intensity. t a S a e h t e U 4 Features * High brightness * Small size * Industrial standard footprint * Diffused optics * Top emitting or right angle emitting * Compatible with IR soldering * Compatible for use with light piping * Available in 8 mm tape on 7" diameter reel * Reel sealed in zip locked moisture barrier bags .c m o Applications * LCD backlighting * Pushbutton backlighting * Front panel indicator * Symbol indicator * Microdisplays * Small message panel signage Ingan Green HSMM-C191 HSMM-C190 HSMM-C170 HSMM-C110 HSMM-C150 Ingan Blue HSMN-C191 HSMN-C190 HSMN-C170 HSMN-C110 HSMN-C150 Package Description Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Nondiffused Notes: 1. Dimensions in mm. 2. Tolerance 0.1 mm unless otherwise noted. CAUTION: HSMM-C1xx and HSMN-C1xx are Class 1 ESD sensitive per MIL-STD-1686. Please observe appropriate precautions during handling and processing. Refer to Agilent Technologies Application Note AN-1142 for additional details. w w w .D at Sh a et e 4U . om c Package Dimensions LED DIE CATHODE MARK LED DIE CATHODE MARK 1.0 (0.039) 1.25 (0.049) 2.6 (0.102 ) 0.62 (0.024) 2.0 (0.079 ) POLARITY 3.2 (0.126 ) CLEAR EPOXY DIFFUSED EPOXY 1.5 (0.059) 1.4 (0.055) POLARITY 0.3 (0.012) PC BOARD 0.8 (0.031) PC BOARD 0.5 (0.020) 1.6 (0.063 ) 3.2 (0.126 ) 3.2 (0.126 ) 0.9 (0.035) 0.3 (0.012) CATHODE LINE 0.4 0.15 (0.016 0.006) 0.4 0.15 (0.016 0.006) 1.0 (0.039) SOLDERING TERMINAL CATHODE LINE SOLDERING TERMINAL HSMx-C110 HSMx-C170 LED DIE CATHODE MARK LED DIE CATHODE MARK 0.8 (0.031) 0.4 (0.016) 0.8 (0.031) 0.4 (0.016) 1.6 (0.063 ) 1.6 (0.063 ) 1.0 (0.039) 0.3 (0.012) DIFFUSED EPOXY PC BOARD POLARITY 0.3 (0.012) DIFFUSED EPOXY PC BOARD 0.8 (0.031) 0.3 (0.012) 1.0 (0.039) POLARITY 0.6 (0.023) 0.3 (0.012) CATHODE LINE 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN. CATHODE LINE 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C190 HSMx-C191 2 Package Dimensions, continued LED DIE CATHODE MARK 1.6 (0.063) 0.8 (0.031) 3.2 (0.126 ) DIFFUSED EPOXY 0.6 (0.024) 2.0 (0.079) POLARITY 1.1 (0.043) PC BOARD CATHODE LINE 0.50 0.2 (0.020 0.008) 0.5 (0.020) 0.50 0.2 (0.020 0.008) SOLDERING TERMINAL HSMx-C150 NOTES: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. Absolute Maximum Ratings at TA = 25C Parameter DC Forward Current [1] Power Dissipation Reverse Voltage (IR = 100 A) Led Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature Note: 1. Derate linearly as shown in Figure 4. HSMM-C110/C170/C190/C191/C150 HSMN-C110/C170/C190/C191/C150 20 78 5 95 -30 to +85 -40 to +85 See IR soldering profile (Figure 7) Units mA mW V C C C Electrical Characteristics at TA = 25C Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 3.3 3.3 3.3 3.3 3.9 3.9 3.9 3.9 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 70 70 70 70 Thermal Resistance RJ-PIN (C/W) Typ. 450 450 300 300 Part Number HSMM-C110/C150 HSMN-C110/C150 HSMM-C170/C190/C191 HSMN-C170/C190/C191 VF Tolerance: 0.1 V. 3 Optical Characteristics at TA = 25C Luminous Intensity IV (mcd) @ 20 mA[1] Min. Typ. 40 40 10 10 126 120 39 35 Peak Wavelength peak (nm) Typ. 523 523 468 468 Color, Dominant Wavelength d[2] (nm) Typ. 525 525 470 470 Viewing Angle 2 1/2 Degrees[3] Typ. 130 170 130 170 Luminous Efficacy V (lm/w) Typ. 490 490 77 77 Part Number HSMM-C110 HSMM-C170/C190/ C191/C150 HSMN-C110 HSMN-C170/C190/ C191/C150 Color Green Green Blue Blue Notes: 1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Color Bin Limits[1] Blue Color Bins[1] Dom. Wavelength (nm) Bin ID A B C D Tolerance: 1 nm Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Bin ID A B C D E F G H J K L M Tolerance: 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. Intensity (mcd) Bin ID N P Q R S T U V W X Y Min. 28.50 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 Max. 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 4500.00 Min. 0.11 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 Max. 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 28.50 Min. 460.0 465.0 470.0 475.0 Max. 465.0 470.0 475.0 480.0 InGaN Green Color Bins[1] Dom. Wavelength (nm) Bin ID A B C D Tolerance: 1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. Min. 515.0 520.0 525.0 530.0 Max. 520.0 525.0 530.0 535.0 4 1.0 IF - FORWARD CURRENT - mA 100 RELATIVE INTENSITY - % BLUE GREEN 10 0.5 1 0 0.1 350 400 450 500 WAVELENGTH - nm 550 600 650 2.0 2.5 3.0 3.5 4.0 VF - FORWARD VOLTAGE - V Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. 1.2 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.0 0.8 0.6 0.4 0.2 0 1.00 0 5 10 15 20 25 RELATIVE INTENSITY - % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 IF - FORWARD CURRENT - mA Figure 3. Luminous intensity vs. forward current. IF MAX. - MAXIMUM FORWARD CURRENT - mA 25 20 ANGLE 15 RJ-A = 800C/W 10 RELATIVE INTENSITY - % 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 RJ-A = 600C/W 5 0 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE - C Figure 4. Maximum forward current vs. ambient temperature. ANGLE Figure 5. Relative intensity vs. angle for HSMx-C110. 5 1.00 0.90 RELATIVE INTENSITY - % 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150. 5.0 (0.200) 0.9 (0.035) 0.9 (0.035) TEMPERATURE 10 SEC. MAX. 230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 1.5 (0.059) 2.0 (0.079) 4C/SEC. MAX. 1.0 (0.039) -3C/SEC. MAX. 0.2 (0.008) CENTERING BOARD 1.5 (0.059) Figure 7. Recommended reflow soldering profile. Figure 8. Recommended soldering pattern for HSMx-C110. 0.8 (0.031) 1.2 (0.047) 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) Figure 9. Recommended soldering pattern for HSMx-C170. Figure 10. Recommended soldering pattern for HSMx-C190 and HSMx-C191. NOTE: 1. All dimensions in millimeters (inches). 6 USER FEED DIRECTION 1.5 (0.059) CATHODE SIDE 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) PRINTED LABEL Figure 11. Recommended soldering pattern for HSMx-C150. Figure 12. Reeling orientation. 8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) O 20.20 MIN. (O 0.795 MIN.) O 13.1 0.5 (O 0.516 0.020) 3.0 0.5 (0.118 0.020) 178.40 1.00 (7.024 0.039) 59.60 1.00 (2.346 0.039) 4.0 0.5 (0.157 0.020) 6 PS 5.0 0.5 (0.197 0.020) Figure 13. Reel dimensions. NOTE: 1. All dimensions in millimeters (inches). 7 4.00 (0.157) 1.50 (0.059) CATHODE DIM. C (SEE TABLE 1) 0.20 0.05 (0.008 0.002) 1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012) DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.00 (0.157) CARRIER TAPE USER FEED DIRECTION COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) HSMx-C110 POSITION IN CARRIER TAPE PART NUMBER HSMx-C191 SERIES HSMx-C190 SERIES DIM. A (SEE TABLE 1) HSMx-C170 SERIES HSMx-C110 SERIES HSMx-C150 SERIES R 1.0 0.05 (0.039 0.002) DIM. B (SEE TABLE 1) DIM. A DIM. B DIM. C 0.10 ( 0.004) 0.10 ( 0.004) 0.10 ( 0.004) 1.80 (0.071) 1.80 (0.071) 2.40 (0.094) 3.40 (0.134) 3.75 (0.148) 0.95 (0.037) 0.95 (0.037) 1.60 (0.063) 1.70 (0.067) 2.10 (0.083) 0.75 (0.030) 0.87 (0.034) 1.20 (0.047) 1.20 (0.047) 1.30 (0.051) Figure 14. Tape dimensions. END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 15. Tape leader and trailer dimensions. NOTES: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. Storage Condition: 5 to 30C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/- 5C for 20 hours. For product information and a complete list of Agilent contacts and distributors, please go to our web site. www.agilent.com/semiconductors E-mail: SemiconductorSupport@agilent.com Data subject to change. Copyright (c) 2002 Agilent Technologies, Inc. Obsoletes 5988-4471EN March 11, 2002 5988-5213EN |
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