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 PD -94313C
IRG4MC30F
INSULATED GATE BIPOLAR TRANSISTOR
Features
* * * * * * * Electrically Isolated and Hermetically Sealed Simple Drive Requirements Latch-proof Fast Speed operation 3 kHz - 8 kHz High operating frequency Switching-loss rating includes all "tail" losses Ceramic eyelets
C
Fast Speed IGBT
VCES = 600V
G E
VCE(on) max =1.7V
@VGE = 15V, IC = 15A
n-channel
Benefits
* Generation 4 IGBT's offer highest efficiency available * IGBT's optimized for specified application conditions * Designed to be a "drop-in" replacement for equivalent IR Hi-Rel Generation 3 IGBT's Insulated Gate Bipolar Transistors (IGBTs) from International Rectifier have higher usable current densities than comparable bipolar transistors, while at the same time having simpler gate-drive requirements of the familiar power MOSFET. They provide substantial benefits to a host of high-voltage, highcurrent applications.
TO-254AA
Absolute Maximum Ratings
Parameter
VCES IC @ TC = 25C IC @ TC = 100C ICM ILM VGE PD @ TC = 25C PD @ T C = 100C TJ TSTG Collector-to-Emitter Breakdown Voltage Continuous Collector Current Continuous Collector Current Pulsed Collector Current Clamped Inductive Load Current Gate-to-Emitter Voltage Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range Lead Temperature Weight
Max.
600 28 15 112 112 20 75 30 -55 to + 150 300 (0.063in./1.6mm from case for 10s) 9.3 (typical)
Units
V A
V W
C g
Thermal Resistance
Parameter
R thJC Junction-to-Case
Min Typ Max Units
-- -- 1.67
C/W
Test Conditions
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1
02/08/02
IRG4MC30F
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
V(BR)CES V(BR)ECS Parameter Min. Typ. Collector-to-Emitter Breakdown Voltage 600 --- Emitter-to-Collector Breakdown Voltage S 18 --- V(BR)CES/TJ Temperature Coeff. of Breakdown Voltage --- 0.63 --- --- VCE(ON) Collector-to-Emitter Saturation Voltage --- --- --- --- VGE(th) Gate Threshold Voltage 3.0 --- VGE(th)/TJ Temperature Coeff. of Threshold Voltage --- -11 gfe Forward Transconductance T 14 --- --- --- ICES Zero Gate Voltage Collector Current --- --- IGES Gate-to-Emitter Leakage Current --- --- Max. Units Conditions --- V VGE = 0V, IC = 1.0 mA --- V VGE = 0V, IC = 1.0 A --- V/C VGE = 0V, IC = 1.0 mA VGE = 15V 1.7 IC = 15A 2.2 V IC = 28A See Fig.2, 5 2.7 IC = 15A , TJ = 125C 6.0 VCE = VGE, IC = 1.0 mA --- mV/C VCE = VGE, IC = 250 A --- S VCE 15V, IC = 15A 50 VGE = 0V, VCE = 480V A 1000 VGE = 0V, VCE = 480V, TJ = 125C 100 nA VGE = 20V
Switching Characteristics @ TJ = 25C (unless otherwise specified)
Qg Qge Qgc td(on) tr td(off) tf Ets td(on) tr td(off) tr Ets LC+LE Parameter Total Gate Charge (turn-on) Gate - Emitter Charge (turn-on) Gate - Collector Charge (turn-on) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Rise Time Total Switching Loss Total Inductance Min. --- --- --- --- --- --- --- --- --- --- --- --- --- --- Max. Units Conditions 77 IC = 15A 12 nC VCC = 300V See Fig. 8 24 VGE = 15V 42 TJ = 25C 30 IC = 15A, VCC = 480V ns 300 VGE = 15V, RG = 7.5 300 Energy losses include "tail" 2.0 mJ See Fig. 10, 11, 13, 14 25 TJ = 125C, 20 ns IC = 15A, VCC = 480V 450 VGE = 15V, RG = 7.5 550 Energy losses include "tail" 3.0 mJ See Fig. 13, 14 --- nH Measured from Collector lead (6mm/ 0.25in. from package) to Emitter lead (6mm / 0.25in. from package) --- 1100 --- VGE = 0V --- 74 --- pF VCC = 30V See Fig. 7 --- 14 --- = 1.0MHz Typ. --- --- --- --- --- --- --- --- --- --- --- --- --- 6.8
Cies Coes Cres Notes:
Input Capacitance Output Capacitance Reverse Transfer Capacitance
Q Repetitive rating; VGE = 20V, pulse width limited by
max. junction temperature. ( See fig. 13b )
S Pulse width 80s; duty factor 0.1%. T Pulse width 5.0s, single shot.
R VCC = 80%(VCES), VGE = 20V, L = 100H, RG = 7.5,
(See fig. 13a)
2
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IRG4MC30F
40
Square wave: 60% of rated voltage
Triangular wave:
30
Load Current ( A )
Ideal diodes
Clamp voltage: 80% of rated
20
10
For both: Duty cycle : 50% Tj = 125C Tsink = 90C Gate drive as specified Power Dissipation = 19W
0.1 1 10 100
0
f , Frequency ( kHz )
Fig. 1 - Typical Load Current vs. Frequency
(For square wave, I=IRMS of fundamental; for triangular wave, I=IPK)
1000
1000
I C , Collector-to-Emitter Current (A)
100
I C , Collector-to-Emitter Current (A)
100
TJ = 150 C
10
10
TJ = 150 C
GE
TJ = 25 C V = 15V 20s PULSE WIDTH
1 10
TJ = 25 C V = 50V 5s PULSE WIDTH
CC 5 10 15 20
1 0.1
1
VCE , Collector-to-Emitter Voltage (V)
VGE , Gate-to-Emitter Voltage (V)
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
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3
IRG4MC30F
30
2.5
VGE = 15V 80s PULSE WIDTH
Maximum DC Collector Current(A)
25
VCE , Collector-to Emitter Voltage (V)
IC = 30A
20
2.0
15
IC = 15A
10
1.5
IC = 7.5A
5
0 25 50 75 100 125 150
1.0 -60 -40 -20 0 20 40 60 80 100 120 140 160
T C , Case Temperature ( C)
T J , Junction Temperature (C)
Fig. 4 - Maximum Collector Current vs. Case Temperature
Fig. 5 - Collector-to-Emitter Voltage vs. Junction Temperature
10
Thermal Response (Z thJC )
1
D = 0.50 0.20 0.10 0.05
0.1
0.02 0.01
SINGLE PULSE (THERMAL RESPONSE)
0.01 0.00001
Notes: 1. Duty factor D =t 1 / t2 2. Peak T = PDM x Z thJC + TC J 0.1 0.001 0.01 1
P DM t1 t2
0.0001
t1 , Rectangular Pulse Duration (sec)
Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
4
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IRG4MC30F
2000
VGE , Gate-to-Emitter Voltage (V)
1600
VGE = 0V, f = 1MHz Cies = Cge + Cgc , Cce SHORTED Cres = Cgc Coes = Cce + Cgc
20
VCC = 300V 400V I C = 15A
16
C, Capacitance (pF)
Cies
1200
12
800
8
C oes
400
4
C res
0 1 10 100
0 0 10 20 30 40 50
VCE , Collector-to-Emitter Voltage (V)
QG , Total Gate Charge (nC)
Fig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage
Fig. 8 - Typical Gate Charge vs. Gate-to-Emitter Voltage
1.55 VCC = 480V VGE = 15V
100 RG = 7.5 VGE = 15V
Total Switching Losses (mJ)
1.50
Total Switching Losses (mJ)
TJ = 25C I C = 15A
VCC = 480V 10
IC = 30A IC = 15A IC = 7.5A
1.45
1
1.40
1.35 0 10 20 30 40 50
0.1 -60 -40 -20 0 20 40 60 80 100 120 140 160
R G, Gate Resistance ( )
T J, Junction Temperature (C)
Fig. 9 - Typical Switching Losses vs. Gate Resistance
Fig. 10 - Typical Switching Losses vs. Junction Temperature
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5
IRG4MC30F
6.0 RG = 7.5 TJ = 125C 150C VGE = 15V VCC = 480V 4.0 1000 5.0
IC, Collector-to-Emitter Current (A)
VGE = 20V T J = 125
Total Switching Losses (mJ)
100
3.0
SAFE OPERATING AREA
10
2.0
1.0
0.0 5 10 15 20 25 30
1 0.1 1 10 100 1000
IC , Collector Current (A)
VCE , Collector-to-Emitter Voltage (V)
Fig. 11 - Typical Switching Losses vs. Collector-to-Emitter Current
Fig. 12 - Turn-Off SOA
6
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IRG4MC30F
L 50V 1 00 0V VC *
D .U .T.
RL = 0 - 720V 720V 4 X IC@25C
480F 960V R
Q
* Driver s am e ty pe as D .U .T.; Vc = 80% of V ce (m ax ) * Note: D ue to the 50V pow er s upply, pulse w idth a nd inductor w ill inc rea se to obta in ra ted Id.
Fig. 13a - Clamped Inductive
Load Test Circuit
Fig. 13b - Pulsed Collector
Current Test Circuit
IC L D river* 50V 1000V Q R S
* Driver same type as D.U.T., VC = 720V
D .U .T. VC
Fig. 14a - Switching Loss
Test Circuit
Q
R
9 0%
S
1 0% 90 %
VC
t d (o ff)
Fig. 14b - Switching Loss
Waveforms
10 % IC 5% t d (o n )
tr E on E ts = ( Eo n +E o ff )
tf t=5 s E o ff
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7
IRG4MC30F
Case Outline and Dimensions -- TO-254AA
0.12 [.005] 3.78 [.149] 3.53 [.139] A 13.84 [.545] 13.59 [.535] 6.60 [.260] 6.32 [.249] 1.27 [.050] 1.02 [.040]
3.78 [.149] 3.53 [.139] A 13.84 [.545] 13.59 [.535] 6.60 [.260] 6.32 [.249] 1.27 [.050] 1.02 [.040] 0.12 [.005]
17.40 [.685] 16.89 [.665] 1 2 3
20.32 [.800] 20.07 [.790]
13.84 [.545] 13.59 [.535]
B
22.73 [.895] 21.21 [.835]
17.40 [.685] 16.89 [.665] 1 2 3
20.32 [.800] 20.07 [.790]
13.84 [.545] 13.59 [.535]
B R 1.52 [.060]
C
17.40 [.685] 16.89 [.665]
0.84 [.033] MAX.
4.82 [.190] 3.81 [.150] 3.81 [.150]
4.06 [.160] 3.56 [.140] 3X 1.14 [.045] 0.89 [.035] 0.36 [.014] B A
3X 3.81 [.150]
1.14 [.045] 0.89 [.035] 0.36 [.014] BA
2X
3.81 [.150]
NOTE S: 1. DIME NSIONING & T OLERANCING PER ASME Y14.5M-1994. 2. ALL DIME NSIONS ARE SHOWN IN MILLIMETE RS [INCHES]. 3. CONT ROLLING DIMENSION: INCH. 4. CONF ORMS T O JEDEC OUT LINE T O-254AA.
PIN ASSIGNMENTS
1 = COLLECTOR 2 = EMITTER 3 = GATE
CAUTION BERYLLIA WARNING PER MIL-PRF-19500 Packages containing beryllia shall not be ground, sandblasted, machined, or have other operations performed on them which will produce beryllia or beryllium dust. Furthermore, beryllium oxide packages shall not be placed in acids that will produce fumes containing beryllium.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. Data and specifications subject to change without notice. 02/02
8
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