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 SEMICONDUCTOR
TECHNICAL DATA
General Description
KHB019N20P1/F1
N CHANNEL MOS FIELD EFFECT TRANSISTOR
KHB019N20P1
This planar stripe MOSFET has better characteristics, such as fast switching time, low on resistance, low gate charge and excellent avalanche characteristics. It is mainly suitable for DC/DC converters and switching mode power supplies.
A
O C F
E
G B Q
I
FEATURES
VDSS=200V, ID=19A Drain-Source ON Resistance : RDS(ON)=0.18 Qg(typ.)=35nC @VGS = 10V
K M L J D N N
P
H
1
2
3
DIM MILLIMETERS _ 9.9 + 0.2 A 15.95 MAX B 1.3+0.1/-0.05 C _ D 0.8 + 0.1 _ E 3.6 + 0.2 _ F 2.8 + 0.1 3.7 G H 0.5+0.1/-0.05 1.5 I _ 13.08 + 0.3 J K 1.46 _ 1.4 + 0.1 L _ 1.27+ 0.1 M _ 2.54 + 0.2 N _ 4.5 + 0.2 O _ 2.4 + 0.2 P _ 9.2 + 0.2 Q
MAXIMUM RATING (Tc=25
CHARACTERISTIC Drain-Source Voltage Gate-Source Voltage @TC=25 Drain Current @TC=100 Pulsed (Note1) Single Pulsed Avalanche Energy (Note 2) Repetitive Avalanche Energy (Note 1) Peak Diode Recovery dv/dt (Note 3) Drain Power Dissipation Tc=25 Derate above 25
)
SYMBOL VDSS VGSS ID IDP EAS EAR dv/dt PD Tj Tstg RthJC RthCS RthJA 140 1.12 150 -55 150 0.89 0.5 62.5 2.5 62.5 /W /W /W 19 12.1 76 250 14 4.5 50 0.4 RATING KHB019N20P1 KHB019N20F1 200 30 19* 12.1* 76*
F
1. GATE 2. DRAIN 3. SOURCE
UNIT V V
KHB019N20F1
TO-220AB
A
A
C
mJ mJ
O E G P B
V/ns
K
W
L
W/
D M M
J
Q
Maximum Junction Temperature Storage Temperature Range Thermal Characteristics Thermal Resistance, Junction-to-Case Thermal Resistance, Case-to-Sink Thermal Resistance, Junction-toAmbient
H
DIM MILLIMETERS _ 10.16 + 0.2 A _ 15.87 + 0.2 B _ C 2.54 + 0.2 _ D 0.8 + 0.1 _ E 3.18 + 0.1 _ F 3.3 + 0.1 _ 12.57 + 0.2 G _ 0.5 + 0.1 H J 13.0 MAX _ K 3.23 + 0.1 L 1.47 MAX _ 2.54 + 0.2 M _ N 4.7 + 0.2 _ O 6.68 + 0.2 P 6.5 _ Q 2.76 + 0.2
N
1
2
3
1. GATE 2. DRAIN 3. SOURCE
* : Drain current limited by maximum junction temperature.
TO-220IS
D
G
S
2006. 2. 20
Revision No : 1
1/7
KHB019N20P1/F1
ELECTRICAL CHARACTERISTICS (Tc=25
CHARACTERISTIC
)
TEST CONDITION MIN. TYP. MAX. UNIT
SYMBOL
Static
Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Drain Cut-off Current Gate Threshold Voltage Gate Leakage Current Drain-Source ON Resistance BVDSS BVDSS/ Tj IDSS Vth IGSS RDS(ON) ID=250 A, VGS=0V ID=250 A, Referenced to 25 VDS=200V, VGS=0V, VDS=VGS, ID=250 A VGS= 30V, VDS=0V VGS=10V, ID=9.5A 200 2 0.18 0.14 10 4 100 0.18 V V/ A V nA
Dynamic
Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-on Delay time Turn-on Rise time Turn-off Delay time Turn-off Fall time Input Capacitance Reverse Transfer Capacitance Output Capacitance Source-Drain Diode Ratings Continuous Source Current Pulsed Source Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge IS ISP VSD trr Qrr VGSNote 1) Repetivity rating : Pulse width limited by junction temperature. Note 2) L =1mH, IS=19A, VDD=50V, RG=25 , Starting Tj=25 Note 3) IS 19A, dI/dt 200A/ , VDD 300 Note 4) Pulse Test : Pulse width , Duty Cycle 2%. BVDSS, Starting Tj=25 .
Note 5) Essentially independent of operating temperature.
2006. 2. 20
Revision No : 1
2/7
KHB019N20P1/F1
ID - VDS
VGS TOP : 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 6.0 V 5.5 V 101 5.0 V Bottom : 4.5 V
ID - VGS
Drain Current ID (A)
Drain Current ID (A)
10
1
150 C 25 C -55 C
10
0
100 10-1 100 101 10
-1
2
4
6
8
10
Drain - Source Voltage VDS (V)
Gate - Source Voltage VGS (V)
BVDSS - Tj
Normalized Breakdown Voltage BVDSS
0.8
VGS = 0V IDS = 250
RDS(ON) - ID
On - Resistance RDS(ON) ()
1.2
0.6
1.1
0.4
VGS = 10V
1.0
VGS = 20V
0.2
0.9
0.8 -100
0.0 0 -50 0 50 100 150
10
20
30
40
50
60
Junction Temperature Tj ( C )
Drain Current ID (A)
IS - VSD
Reverse Drain Current IS (A)
3.0
RDS(ON) - Tj
VGS = 10V IDS = 9.5V
101
Normalized On Resistance
1.2 1.6 2.0 2.4
2.5 2.0 1.5 1.0 0.5
100
150 C 25 C
10-1 0.0
0.4
0.8
Source - Drain Voltage VSD (V)
0.0 -100
-50
0
50
100
150
Junction Temperature Tj ( C )
2006. 2. 20
Revision No : 1
3/7
KHB019N20P1/F1
C - VDS
5000 4500 4000
Frequency = 1MHz
Qg- VGS
12
Gate - Source Voltage VGS (V)
ID= 19A VDS = 160V VDS = 100V VDS = 40V
10 8 6 4 2 0 0 10
Capacitance (pF)
3500 3000 2500 2000 1500 1000 500 0 10-1 100 101
Crss
Coss
Ciss
20
30
40
Drain - Source Voltage VDS (V)
Gate - Charge Qg (nC)
Safe Operation Area
Operation in this area is limited by RDS(ON)
Safe Operation Area
Operation in this area is limited by RDS(ON)
Drain Current ID (A)
Drain Current ID (A)
10
2
102
100s
10 s
101
1ms 10ms
10
1
100 s 1 ms
100
Tc= 25 C Tj = 150 C 10-1 Single nonrepetitive pulse
DC
10
0 10 ms
100
101
102
10
-1
Tc= 25 C Tj = -150 C Single nonrepetitive pulse
DC
100
101
102
Drain - Source Voltage VDS (V) (KHB019N20P1)
Drain - Source Voltage VDS (V) (KHB019N20F1)
ID - Tj
20
Drain Current ID (A)
15
10
5
0 25 50 75 100 125 150
Junction Temperature Tj ( C )
2006. 2. 20
Revision No : 1
4/7
KHB019N20P1/F1
Rth
{KHB019N20P1} Normalized Transient Thermal Resistance
100
Duty=0.5
0.2
10-1
0.1 0.05 0.02 0.01
PDM t1 t2
10-2 10-5
Single Pulse
- Duty Factor, D= t1/t2 Tj(max) - Tc - RthJC = PD 10-3 10-2 10-1 100 101
10-4
Square Wave Pulse Duration (sec)
Rth
{KHB019N20F1} Normalized Transient Thermal Resistance
Duty=0.5
100
0.2 0.1 0.05 PDM t1 t2 Single Pulse
10-1
0.02 0.01
10-2
- Duty Factor, D= t1/t2 Tj(max) - Tc - RthJC = PD 10-3 10-2 10-1 100 101
10-5
10-4
Square Wave Pulse Duration (sec)
2006. 2. 20
Revision No : 1
5/7
KHB019N20P1/F1
- Gate Charge
VGS Fast Recovery Diode 10 V
ID
0.8 VDSS 1.0 mA
ID Q Qgs Qgd Qg VGS
VDS
- Single Pulsed Avalanche Energy
1 EAS= LIAS2 2 BVDSS BVDSS - VDD
BVDSS
L
IAS
50V 25 VDS 10 V ID(t)
VGS
VDD
VDS(t)
Time
- Resistive Load Switching
tp
VDS 90% RL
0.5
VDSS 25 VDS 10V VGS 10% td(on) ton tr tf td(off) toff
VGS
2006. 2. 20
Revision No : 1
6/7
KHB019N20P1/F1
- Source - Drain Diode Reverse Recovery and dv /dt
DUT IF
VDS
Body Diode Forword Current
ISD
(DUT)
di/dt IRM
IS
Body Diode Reverse Current
0.8 VDSS
VDS (DUT) driver Body Diode Recovery dv/dt VSD VDD 10V
VGS
Body Diode Forword Voltage drop
2006. 2. 20
Revision No : 1
7/7


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