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 ISSUE
THIS DRAWING I S THE PROPERTY OF SAMSUNG PROTECTED IN ACCORDANCE WITH PREVAILING LAW. DESIGN CHANGE DATE SHEET DESIGN CHANGE NOTICE
CHECK
APPR.
2005.04.12 2005.04.25 2005.05.04
Ver 1.00 Ver 1.01 Ver 1.02
JW Kim JW Kim JW Kim
WH KIm WH KIm WH KIm
CONFIDENTIAL
GPS Engine Module Product No. : GPM13B03-005 Hardware Specification ver 1.02
TECHNICAL DOCUMENT
NAME
SGEM
PRINTED BY DEPT. DRAWN. TYPE GROUP CHECK APPR.PROD. DRAWING NO.
(Samsung GPS Engine Module) Tech. Description
APPR.
www..com
PAGE ISSUE
www..com
CONFIDENTIAL Revision history
1. 2. 3. 2005.04.12 : Doc ver 1.00 , Original draft 2005.04.25 : Doc ver 1.01 , 2005.05.04 : Doc ver 1.02 ,
MANAGEMENT No.
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CONTENTS 1. RELEVANT DOCUMENTS ..................................................................................................................................................... 5 2. DEFINITIONS.......................................................................................................................................................................... 5 3. PRODUCT DESCRIPTION ..................................................................................................................................................... 5 4. SUPPLIER'S RESPONSIBILITY ............................................................................................................................................ 5 4.1 LIFE EXPECTANCY ............................................................................................................................................................. 5 4.2 RELIABILITY ........................................................................................................................................................................ 5 4.3 CHANGE CONTROL ............................................................................................................................................................ 6 5. PRODUCT REQUIREMENTS................................................................................................................................................. 6 5.1 MARKING ............................................................................................................................................................................. 6 5.1.1 EXTERNAL LABEL ........................................................................................................................................................... 6 5.1.2 SOFTWARE....................................................................................................................................................................... 6 5.2 MECHANICAL SPECIFICATION.......................................................................................................................................... 6 5.3 ELECTRICAL CONNECTION............................................................................................................................................... 6 5.4 MATERIAL REQUIREMENTS .............................................................................................................................................. 6 5.5 PRINTED CIRCUIT BOARD ................................................................................................................................................. 6 5.6 TEMPERATURE REQUIREMENTS ..................................................................................................................................... 7 5.7 ELECTRICAL PROTECTION REQUIREMENTS ................................................................................................................. 7 5.8 ELECTRICAL REQUIREMENTS.......................................................................................................................................... 7 5.8.1 POWER SUPPLY .............................................................................................................................................................. 7 5.8.2 INPUTS .............................................................................................................................................................................. 7 5.8.2.1 DIGITAL INPUT .............................................................................................................................................................. 7 5.8.2.1.1 MODE SELECTOR ...................................................................................................................................................... 7 5.8.2.1.2 BOOT ........................................................................................................................................................................... 8 5.8.2.1.3 RESET ......................................................................................................................................................................... 8 5.8.2.1.4 BACK_UP(BATTERY)................................................................................................................................................. 8 5.8.3 GPIO .................................................................................................................................................................................. 8 5.8.3.1 GPIO 3 ............................................................................................................................................................................ 8 5.8.3.2 GPIO 4 ............................................................................................................................................................................ 8
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5.8.3.3 GPIO 6 ............................................................................................................................................................................ 8 5.8.4 RF CONNECTIONS ........................................................................................................................................................... 9 5.8.5 PERFORMANCE ............................................................................................................................................................... 9 5.8.5.1 ACQUISITION TIME (TTFF) ........................................................................................................................................... 9 5.8.5.3 POSITION ACCURACY(HORZ.) .................................................................................................................................. 10 5.8.5.4 SENSITIVITY ................................................................................................................................................................ 10 5.8.5.4.1 TRACKING SENSITIVITY.......................................................................................................................................... 10 5.8.5.4.2 NAVIGATION SENSITIVITY ...................................................................................................................................... 11 5.8.5.4.3 ACQUISITION SENSITIVITY ..................................................................................................................................... 11 5.8.6 GPS ANTENNA SPECIFICATION (RECOMMENDED) .................................................................................................. 11 5.8.7 INTERFACES .................................................................................................................................................................. 12 5.8.7.1 INTERFACE DEBUG PORT (PORT B) ........................................................................................................................ 12 5.8.7.2 NETWORK PORT(PORT A) ......................................................................................................................................... 12 6. TESTING............................................................................................................................................................................... 12 6.1 TEST CONDITIONS............................................................................................................................................................ 12 6.2 FIELD TEST........................................................................................................................................................................ 12 6.2.1 FIELD TEST, NORMAL CLIMATE .................................................................................................................................. 12 6.2.2 FIELD TEST, COLD ENVIRONMENT ........................................................................................................................... 122 6.2.3 FIELD TEST, HOT ENVIRONMENT.............................................................................................................................. 132 7. SGEM CONNECTOR CONFIGURATION .......................................................................................................................... 133
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APPENDIX A. APPLICATION CIRCUITS ................................................................................................................................ 14 APPENDIX B. FOOT-PRINT & OUTLINE DRAWING.............................................................................................................. 15 APPENDIX C. PACKAGE SPECIFICATION............................................................................................................................ 18 APPENDIX C-1. TAPING & REEL............................................................................................................................................ 18 APPENDIX C-2. REEL PACKING METHOD(INCLUDE MARKING SPEC.)............................................................................ 19 APPENDIX C-3. INNER BOX PACKING METHOD ................................................................................................................. 20 APPENDIX C-4. MBB BAG PACKING METHOD .................................................................................................................... 21 APPENDIX C-4-1. THE GIST OF A MSD/LSD LABEL ............................................................................................................ 22 APPENDIX C-5. OUTER BOX PACKAGING QUANTITY........................................................................................................ 23 APPENDIX C-6. VINYL BAG (STATIC ELECTRICITY PREVENTION)................................................................................... 24 APPENDIX C-7. INNER BOX PACKAGING QUANTITY ......................................................................................................... 25 APPENDIX C-8. OUTER BOX AND INNER BOX AFFIX LABEL ............................................................................................ 26 APPENDIX C-9. OUTER BOX PACKAGING QUANTITY........................................................................................................ 27 APPENDIX D. SEMCO REFLOW OVEN PROFILE ................................................................................................................. 28
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1. Relevant Documents
Marking Electromagnetic Compatibility IN-HOUSE RULES TBD
2. Definitions
GPS MODULE : SAMSUNG E.M GPS ENGINE MODULE.
3. Product Description
This product is GPS Engine Module (SGEM) which tracks GPS satellites to compute current position, velocity and time information. SGEM interfaces Vehicle electronic processor (navigator, telematic product) or phone call processor to communicate for data and command. The SGEM shall be available in a 2.95V ~ 5V version. The SAMSUNG E.M SGEM has 1 LNA amplifiers, voltage regulator,micro-processor and 8M flash, 3 GPIOs (USER can control 1 GPIO), TCXO, 32.768kHz slow clock crystal. The installation of the SGEM is intended to be inside the application products for protection. To operate SGEM, S/W protocol and external circuit described in this document are needed.
4. Supplier's Responsibility 4.1 Life Expectancy
SGEM has MTBF>5000000 hrs with at least 90% confidence. A prediction of life expectancy according to MIL-HDKB 217F or similar database will be made by Samsung E.M. The result will be discussed with customers.
4.2 Reliability
Design FMEA of SGEM at the part level will be made and documented by Samsung E.M. Design FMEA will include the function of the component, failure mode, failure cause, frequency of failure occurrence, and severity of failure. To detect critical process risks, process FMEA will be made and documented by the Samsung E.M. Process FMEA will include the function of the component, process stage, failure mode, failure cause, frequency of failure occurrence, severity of failure, and the ability of failure detection.
4.3 Change Control
Request for the change of software, layout and so on should always be made in advance to the customer.
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CONFIDENTIAL 5. Product Requirements 5.1 Marking 5.1.1 External label
In-House Rule Logo, Product Date, Product number, Lot Number.
MANAGEMENT No.
5.1.2 Software
The following data shall be programmed in SGEM. Hardware version. Additional supplier data (optional).
5.2 Mechanical specification
Size : Typ 19.15mm * 17.65mm * 2.50mm Weight: : Typ 1.7g Note: Please refer to Appendix B for the details.
5.3 Electrical connection
32 semi-circle ports Note: Please see 7. Pin configuration.
5.4 Material requirements
The shield case is made of metallic material for suppressive RF radiation.
5.5 Printed circuit board
Circuit board selection to be made by Samsung E.M. with customer's approval. Completed circuits may be selectively coated with an acrylic resin, air / oven cured conformal coating, clear lacquer or corresponding method which gives electrical insulation and sufficient resistance to corrosion
5.6 Temperature requirements
Operating temperature: Storage temperature: Max temperature -30C to +80C -40C to +85C ( possible to output Data.) 235C 10sec
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CONFIDENTIAL 5.7 Electrical protection requirements
MANAGEMENT No.
Some inputs and outputs of SGEM must be protected against all RF radiation by using external capacitors.
5.8 Electrical requirements 5.8.1 Power supply
Rated Voltage Operating Voltage Test Voltage Power Consumption Max. 6 VDC VDD 2.95 ~ 3.3 VDC 3.0 VDC Typ 270mW, 90mA @ 3.0VDC (Tracking mode) Typ 24uW , 8uA @ 3.0VDC ( Back-up mode)
NOTE. As SGEM includes Dual regulator for the isolation of each power source, the supplied voltage to Voltage input pin should be larger than the used voltage of each regulator. (If there is no specific request from Customer, Standard model will use 2.85V regulator.)
5.8.2 Inputs
All inputs have EMI filtering (27pF) on the external circuit except Antenna. All inputs have the external protection circuit and EMI filtering capacitor.
5.8.2.1 Digital Input 5.8.2.1.1 Mode selector
This input is for power management. SGEM can support power management for power saving according to loaded software.. Power GSW2 X-trac Management Trickle Power No Support mode *Only support when user request Advanced No No Power mangement MODE_SEL MODE_SEL Pin * refer to Attaced Application circuit Connect to Connect to connection GPIO 4 GPIO 4
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CONFIDENTIAL 5.8.2.1.2 Boot
MANAGEMENT No.
This pin is for the factory mode. SGEM use this pin for booting the internal flash memory. If this pin is high(3Vdc) status, this pin wait to download to internal flash. Note: User has to keep GND for normal operation
5.8.2.1.3 Reset
This input is active low. Power-on reset time Min 200usec Note: User has to get confirmation about reset time and VDD power transient time from SEMCO
5.8.2.1.4 Back_Up (Battery)
This input is power supply input for back-up power Recommand voltage@Pin15 : 1.9V ~ 3.3V. Custommers have to consider charging the back-up battery. Note: User has to get confirmation about reset time and VDD power transient time from SEMCO
5.8.3 GPIO
Some outputs might have EMI filtering capacitors (27pF/50V) in external circuit for protecting RF radiation and keeping SGEM isolated from other devices.
5.8.3.1 GPIO3
This GPIO pin of SGEM is for power management of SGEM. These outputs can be used as power controller of system processor. * Only when use SiRF Loc(AGPS system), connect to MODE_SEL. Otherwise keep the no connection.
5.8.3.2 GPIO4
This GPIO pin of SGEM is for power management of SGEM. These outputs can be used as power controller of system .(Only GSW2) * Only when use SiRF XTrac and GSW2 software ,connect to MODE_SEL. Otherwise keep the no connection.(Please refer to Application Circuit)
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CONFIDENTIAL 5.8.3.1 GPIO6
MANAGEMENT No.
This GPIO is not defined. This pin can be used as GPIO of system processor. * Keep the no connection.
5.8.4 RF Connections
SGEM has 32 semi-circle ports. Port 1 is connected to the GPS antenna input. * The antenna input should have the proper impedance matching.
5.8.5 Performance 5.8.5.1. Acquisition Time (TTFF)
The acquisition test is best carried out by allowing the receiver to establish a position fix and then download a full almanac and ephemeris database, which may take up to 1 minute. The acquisition tests can then be carried out in the following order. Hot Start A Hot start procedure occurs when the receiver is reset without disturbing any data held by the receiver. This can be done by toggling the system power on H/W side or selecting hot start mode in the analyzer software on S/W side. Warm start A Warm start procedure occurs when the receiver is reset but with invalid ephemeris data. This test is similar to keeping the receiver to be left off overnight, when almanac data, time and last known position are still valid. Cold start Cold start procedure occurs when the receiver is reset and no aiding data is available. This test is similar to the receiver being powered in the first time. On MDT(phone), this can be achieved by disconnecting the power while the main power (battery) is removed without information. (no store command) Acquisition Modem TTFF COLD TTFF WARM TTFF HOT Max 90secs 45secs 15secs Typ. 55 secs 35 secs 8 secs Condition Mask Angle : 7Degree -130dBm 4 sat fix, 9 sat search
** TTFF Max base on 95% probability, TTFF Typ. Base on 50% probability. ** Location: Open Sky (Mask Angle: 7) and use simulator STR4500, -130dBm signal level
Table 5.8.5.1-1. Acquisition time (TTFF)
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CONFIDENTIAL
Clock No < 3s error < 3s error Position No < 100km error < 100km error
MANAGEMENT No.
Cold Warm Hot
Ephemeris No < 4 hours old < 25 min old
Temp comp No Yes Yes
Table 5.8.5.1-2. Explanation of condition for TTFF measurement Condition of Cold, Warm and Hot start are related to ION-101 Reference [12] specification, and are defined by the availability and age of stored information.
5.8.5.2 Position accuracy (Horiz.)
Position accuracy verifies SGEM long time static accuracy and stability. Accuracy Typ. 5 Typ. 5 Unit m m
Cold . (67%) Warm (67%)
** Condition : HDOP<2.5 ,24Hour, static
Table 5.8.5.3. GPS System Accuracy
5.8.5.3 Sensitivity
Sensitivity means the ability of SGEM to track GPS-signal in certain power level.
5.8.5.3.1 Tracking sensitivity
Tracking sensitivity: Sensitivity Max. -150 Unit dBm
Table 5.8.5.4.1. Tracking sensitivity (1 sat search)
5.8.5.3.2 Navigation Sensitivity
Navigation sensitivity: Sensitivity Max. -145 Unit dBm
Table 5.8.5.4.2. Navigation sensitivity (3 sat fix)
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CONFIDENTIAL 5.8.5.3.3 Acquisition Sensitivity
Acquisition sensitivity: Sensitivity Max. -135 Unit dBm
MANAGEMENT No.
Table 5.8.5.4.3. Acquisition sensitivity (4 sat fix, 9 sat search)
5.8.6 GPS Antenna Specification (recommended)
It is important that the antenna gets a clear view of the sky and is positioned on a surface level to the horizon for best results. The following specification has to meet for the use with SGEM reference design Characteristic Polarization Receive frequency Power supply DC current Total gain Output VSWR Specification Right-hand circular polarized 1.57542GHz+/-1.023 MHz 3V < 15mA @ 3V +25dBi < 2.3
Table 5.8.6. Typical active antenna characteristics
5.8.7 Interfaces 5.8.7.1 Interface Debug Port (Port B)
This port is provided by SGEM through 32 semi-circle ports. This port outputs SiRF binary Data format UART driver is capable of transferring and receiving strings of characters via the serial communication port. Default Baud-rate is set to 57600 bps. This port displays executing commands and support more detail information SGEM does not include RS-232 chip. * To use serial communication, RS-232 chip should be installed in an external circuit. * Refer to the software spec.
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CONFIDENTIAL 5.8.7.2 Network Port (Port A)
MANAGEMENT No.
This port is provided by SGEM through 32 semi-circle ports. This should be RS232 compatible. This port outputs NMEA 0183Data format (ver.3.0) UART driver is capable of transferring and receiving strings of characters via the serial communication port. Max Baud-rate can be used to extend this up to 115200 baud if required. Default Baud-rate is 9600. * To use serial communication, RS-232 chip should be installed in an external circuit. * Refer to the software spec.
6. Testing
This section describes environmental requirements and test condition of SGEM.
6.1 Test condition
Test can be performed in the following order (6.2 - 6.11) If there are no special requirements, test conditions below will be applied. Voltage Ambient temperature Air pressure No. of samples 3.0V +20C to +25C Atmospheric pressure TBD
DUT is in the operation mode during each test or after each test. DUT should be stored in each temperature for at least 2 hours before test begins.
6.2 Field trial tests
The supply voltage will be set to the given reference voltage while DUT parameters are being measured. These parameters include call communication Tx and Rx performance, serial port and I/O functionality and all defined function. The product complies with the following tests over the entire voltage range.
6.2.1 Field trial test, Normal climate
Temperature: +25C
6.2.2 Field trial test, Cold environment
Temperature: -20C
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CONFIDENTIAL 6.2.3 Field trial test, Hot Environment
Temperature: +70C
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7. SGEM Connector configuration
Pin no 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name
ANT AGND AGND WAKE_UP GPIO 4 GPIO 3 DGND DGND DGND TXB RXB DGND GPIO 6 TXA BACK_UP RXA RESET AGND VDD BOOT DGND DGND DGND MODE_SEL DGND DGND AGND AGND AGND AGND AGND AGND
Description
Antenna signal input Analog ground Analog ground External Wake_up (Do Not Use) Power Control I/O for X-trac & GSW2 Power Control I/O for SiRF Loc(Do Not Use) Digital ground Digital ground Digital ground CMOS level asynchronous output for Port B CMOS level asynchronous output for Port B Digital ground General purpose I/O 6 Not defined, custom use only CMOS level asynchronous output for Port A Vdc for Back Up RTC Function(1.9VMODEL NO.
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CONFIDENTIAL Appendix A. Application circuit
MANAGEMENT No.
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CONFIDENTIAL Appendix B. Foot-print & outline drawing
MANAGEMENT No.
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CONFIDENTIAL
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CONFIDENTIAL
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CONFIDENTIAL Appendix C. Package Specifications
Appendix C-1. Taping & reel
MANAGEMENT No.
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CONFIDENTIAL
Appendix C-2. Reel packing method
MANAGEMENT No.
Carrier packs work standard
Carrier reel "ABS" 13inch*330
GPM13B03-005
Normal position direction of product Feeding Direction
Rating label "Art paper" 70*60*0.05t
Cover tape "polysyrene" spec = "32mm"
Surface resistivity = 1x10^5 ~ 1x10^11
Bar code =
Bar code contents = 500pc
model=GPM13B01-005
MODEL = GPM13B03-005
GPM13B03-005
Bar code contents =20040908/0437 contents contents
3
MSD LEVEL=
MSL = 3
3
It packs the product which is manufactured in the reel(500pcs). The reel it attaches rating label in schedule one location.
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CONFIDENTIAL
Appendix C-3. Inner box packing method
Carrier tape +label
MANAGEMENT No.
Shielding bag + rating label
silica gel 2pcs OUTER LABEL ATTACH RATING LABEL ATTACH
Surface resistivity = 1x10^5 ~ 1x10^11
1.The product which is packed in the reel in order to protect from moisture and the static
electricity, The silica-gel which it inserts in the MBB-bag.
2.The
label which attaches in the Reel, It attaches in the MBB-bag. 3.The label which attaches in the Reel, it attaches on the surface the box.
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CONFIDENTIAL
Appendix C-4. MBB bag packing method
MANAGEMENT No.
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MANAGEMENT No.
Appendix C-4-1. The gist of a MSD/LSD label
Rating Label
LEVEL
Notice Mark
Attached
ESD
Class 1C
Yes
MSL
3
Yes
For Further Reference : EIA-481-C / EIA-541
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Appendix C-5.Outer Box Packaging Quantity
The 5pcs inner box packs in outer box and the silica gel inserts. "It packs form with "H" and uses the tape.
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Appendix C-6.Vinyl bag (Static electricity prevention)
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CONFIDENTIAL
Appendix C-7.Inner Box Packaging
MANAGEMENT No.
1.wooden form empty car 1mm it does in within 2.The flood control khway is line flood control 3.Quality of material:SW3B(A):SK(210)/K2(180)SK(210) 4.Explosion burglar = 1 2.4 Kg/
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CONFIDENTIAL
Appendix C-8.Outer Box and Inner Box Affix label
MANAGEMENT No.
Outer box print label spl
Our use label it is reference explanation 1. outer box it is affix 2. Model-name change it is possible 3. The packing number it is change possible
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CONFIDENTIAL
Appendix C-9. Outer Box Packaging Quantity
MANAGEMENT No.
1.wooden form empty car 1mm it does in within 2.The flood control khway is line flood control 3.Quality of material:SW3B(A):SK(210)/K2(180)SK(210) 4.Explosion burglar = 1 2.4 Kg/
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CONFIDENTIAL
Appendix D. SEMCO Reflow Oven Profile
MANAGEMENT No.
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CONFIDENTIAL
Appendix F. Test method
MANAGEMENT No.
GPS simulator
Current meter #1 60mA
Current meter #2 60mA
Antenna Power supply 5.0V Power NMEA port Test board #1
Antenna Power NMEA port Test board #2
Test software
PC UART1 UART2
GPS Simulator SPIRENT : STR 4500
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CONFIDENTIAL
Appendix G. Test flow chart
MANAGEMENT No.
START
Port open OK Reset check
NG
NG OK NMEA check OK SW ver check NG OK HW ver check OK SNR check OK Cold time meas NG OK Hot time meas NG OK
NG
NG
NG
Display
Display
STOP
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