![]() |
|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
ZHX2010 Side-Look FIR Transceiver Product Specification PS007009-0302 ZiLOG Worldwide Headquarters * 532 Race Street * San Jose, CA 95126-3432 Telephone: 408.558.8500 * Fax: 408.558.8300 * www.ZiLOG.com This publication is subject to replacement by a later edition. To determine whether a later edition exists, or to request copies of publications, contact: ZiLOG Worldwide Headquarters 532 Race Street San Jose, CA 95126-3432 Telephone: 408.558.8500 Fax: 408.558.8300 www.ZiLOG.com ZiLOG is a registered trademark of ZiLOG Inc. in the United States and in other countries. All other products and/or service names mentioned herein may be trademarks of the companies with which they are associated. Document Disclaimer (c)2002 by ZiLOG, Inc. All rights reserved. Information in this publication concerning the devices, applications, or technology described is intended to suggest possible uses and may be superseded. ZiLOG, INC. DOES NOT ASSUME LIABILITY FOR OR PROVIDE A REPRESENTATION OF ACCURACY OF THE INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED IN THIS DOCUMENT. ZiLOG ALSO DOES NOT ASSUME LIABILITY FOR INTELLECTUAL PROPERTY INFRINGEMENT RELATED IN ANY MANNER TO USE OF INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED HEREIN OR OTHERWISE. Devices sold by ZiLOG, Inc. are covered by warranty and limitation of liability provisions appearing in the ZiLOG, Inc. Terms and Conditions of Sale. ZiLOG, Inc. makes no warranty of merchantability or fitness for any purpose. Except with the express written approval of ZiLOG, use of information, devices, or technology as critical components of life support systems is not authorized. No licenses are conveyed, implicitly or otherwise, by this document under any intellectual property rights. PS007009-0302 ZHX2010 Side-Look FIR Transceiver iii Table of Contents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC Positive Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TAB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TXD Transmit Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RXD Receive Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SD Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 4 4 5 5 5 Electrical and Timing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Transceiver Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Soldering and Cleaning Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . Reflow Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Manual Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packing, Storing, and Baking Recommendations . . . . . . . . . . . . . . . . . . . . . . . Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Baking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Moisture-Proof Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13 13 14 15 15 15 16 Taping Specifications (in accordance with JIS C 0806) . . . . . . . . . . . . . . . . . . 17 Customer Feedback Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Customer Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Product Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Return Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Problem Description or Suggestion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 18 18 18 18 PS007009-0302 ZHX2010 Side-Look FIR Transceiver iv List of Figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. FIR Transceiver Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Application Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Timings for 4 Mbit/s Bandwidth Operation . . . . . . . . . . . . . . . . . . . . . 6 Typical Ie Versus Angle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Typical SIR Ee Versus Angle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Typical FIR Ee Versus Angle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 ZHX2010 Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . . . 12 Temperature Profile for the Top Surface . . . . . . . . . . . . . . . . . . . . . 13 FIR Transceiver Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Reel Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Tape Dimensions and Configuration . . . . . . . . . . . . . . . . . . . . . . . . 17 List of Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. FIR Transceiver Pin Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . DC Electrical Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Optical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 7 7 9 9 PS007009-0302 ZHX2010 Side-Look FIR Transceiver 1 Description The ZiLOG ZHX2010 is an ideal side-look transceiver for applications in today's ultracompact power-conscious portable products, such as notebook PCs, mobile phones, digital cameras, portable printers, handheld computers, or personal data assistants (PDAs). Designed to support all IrDA at up to 4 Mb/s and LocalTalkTM and Sharp ASKTM modes, the transceiver combines an infrared emitting diode (IRED) emitter, a PIN photodiode detector, a programmable LED driver, and a differential receiver in a single, miniature package. The ZiLOG ZHX2010 provides an efficient implementation of the IrDA-Data 1.4 standard in a small footprint format. Application circuit space is also minimized, as only two external components (a terminating resistor and a decoupling capacitor) are required to implement a complete IrDA transceiver solution. The ZHX2010 is capable of legacy-mode power management and bandwidth switching. Features * * * * * * * * * * * IrDA-Data, SIR, LocalTalkTM, and Sharp ASKTM Data rates from 2400 bps-4 Mbits/s Ultracompact package: 9.8 mm long x 4.8 mm wide x 4.0 mm high On-chip LED protection circuit Supply voltage 2.7-5.25 V Low power consumption: 2 mA at 2.7 V / 3 mA at 5.25 V (typical) Ambient light and noise rejection circuitry Power shutdown mode (~50 nA typical) No external resistor required for LED bias Extended operating temperature range (-30 C to +85 C) Meets IEC 825-1 Class 1 Eye Safety Specifications PS007009-0302 ZHX2010 Side-Look FIR Transceiver 2 Block Diagram Figure 1 is the block diagram for the FIR transceiver. VCC Amp Comp Driver RXD LEDA SD TXD Mode & Power Control Driver GND Figure 1. FIR Transceiver Block Diagram PS007009-0302 ZHX2010 Side-Look FIR Transceiver 3 Applications The ZHX2010 can be used in the following applications: * * * * * * Notebook PCs Digital still or video cameras Portable printers Cellular telephones Personal digital assistants Handheld or battery-operated equipment Figure 2 shows a typical application of the FIR transceiver. Figure 2. Application Block Diagram PS007009-0302 ZHX2010 Side-Look FIR Transceiver 4 Pin Description Table 1 lists the pin out for the FIR transceiver. The pins are described in this section. Table 1. FIR Transceiver Pin Out Pin 1 2 3 4 5 6 7 8 -- Name LEDA Function IRED anode I/O -- -- I O I -- -- -- -- NC(LEDC) Do not connect TXD RXD SD VCC NC GND TAB Transmitter input Receiver output Enables shutdown Supply voltage Not connected Ground Shield ground VCC Positive Supply (Power) Connect to positive power supply (2.7-5.25 V). Place a 0.33 F, 6 V, +/-20% ceramic bypass capacitor as close as possible to the VCC pin. GND (Power) Connect to ground of the power supply. A solid ground plane is recommended for proper operation. TAB (Shield) The Shield tab must be soldered to the ground plane. PS007009-0302 ZHX2010 Side-Look FIR Transceiver 5 TXD Transmit Data (Input, active high) This CMOS input is used to transmit serial data when SD is low. An on-chip protection circuit disables the IRED driver if the TX pin is asserted for longer than 100 s. When used in conjunction with the SD pin, this pin also provides control signals to the internal digital serial control interface and legacy mode subsystems. This input has an internal pull-down resistor that is disabled (open-circuited) during shutdown. TXD has integrated digital AC coupling that prevents inadvertent "always on" IREDs; therefore, no external AC coupling components are required for input signals between GND and VCC. RXD Receive Data (Output, active low) This output indicates received serial data. It is a push-pull CMOS driver capable of driving a standard CMOS or TTL load. No external pull-up or pull-down resistor is required. SD Shutdown (Input, active high) This CMOS input pad functions as a shutdown switch and as a mode switch, allowing bandwidth changes. Shutdown and Legacy Mode Bandwidth Switching Assertion of this pin high for a period of time exceeding 500 m places the module into legacy shutdown mode, reducing current consumption to ~50 nA. On the falling edge of this signal, the state of the TX pin is sampled and used to set receiver low bandwidth (TX = Low) or high bandwidth (TX = High) mode. The transceiver powers on with the upper limit of the receiver bandwidth set to 1.152 Mbits/s operation. To set the bandwidth for operation at 4 Mbits/s, apply the timings shown in Figure 3 to the SD and the TX inputs. PS007009-0302 ZHX2010 Side-Look FIR Transceiver 6 SD ts th TXD 50% Figure 3. Timings for 4 Mbit/s Bandwidth Operation Note: The internal LED driver is disabled when SD is active and is not enabled until the next rising edge of TX. This ensures that the LED is not active during bandwidth adjustment. It is recommended that the SD pin be connected to GND if the bandwidth adjustment and shutdown modes are not required. PS007009-0302 ZHX2010 Side-Look FIR Transceiver 7 Electrical and Timing Specifications Table 2 through Table 6 list the electrical and timing specifications. Table 2. Absolute Maximum Ratings Parameter Supply voltage Power dissipations Junction temperature Storage temperature range Soldering temperature Average IRED current Rep. pulsed IRED current Peak IRED current TXD input voltage RXD output voltage 20 s at 215 C ILED(DC) ILED(RP) ILED(PK) ITXD IRXD -0.5 -0.5 Test Conditions Symbol VCC PD TJ Tstg -25 215 Min Typical -0.5 Max 5.5 500 125 85 240 150 600 1 Unit Comment V mW C C C mA mA A <90 s, ton<25% <2 s VCC+0.5 V VCC+0.5 V Table 3. Recommended Operating Conditions Parameter Supply voltage Ambient operating temperature Symbol VCC Tamb Min 2.7 -30 Max 5.25 85 Unit V C Table 4. DC Electrical Operating Characteristics Parameter Supply current, listening Supply current, receiving Supply current, shutdown Test Conditions Symbol ICC ICC ICC Min 1 1 Typical 2.5 5 50 Max 3 7 100 Unit Comment mA mA No load; no pull-up resistors nA Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25 C unless otherwise noted. PS007009-0302 ZHX2010 Side-Look FIR Transceiver 8 Table 4. DC Electrical Operating Characteristics (Continued) Parameter Turn-on time Receiver RX output low voltage Static sink current on RX RX output high voltage VOL 0.5 1.2 VCC-0.5 1.2 20 1.9 40 2.2 50 200 1.9 V mA V mA ns Test Conditions SD-RX enable Symbol Ton Min Typical Max 200 Unit Comment s 2.2 k load IOL VOH All data rates tr, tf RLoad CLoad TAT Static source current on RX 2.2 k load IOH RX edge rates RX resistive load RX capacitive load Turnaround time Transmitter Input voltage low Input voltage high Input capacitance LED optical rise/fall time LED Peak transmit current Average transmit current SIR TX pulse width MIR TX pulse width FIR TX pulse width VIL VIH Ci tr, tf ILED ILED TXPD TXPD TXPD k pF s TXD-Min Popt. RXD 0 1.4 0.8 V TXD, SD TXD, SD VCC+0.2 V 5 40 pF ns Integrated 10 5 1.41 147 115 600 150 22.13 261 135 mA 25% duty cycle mA 25% duty cycle s ns ns Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25 C unless otherwise noted. PS007009-0302 ZHX2010 Side-Look FIR Transceiver 9 Table 5. AC Electrical Characteristics Parameter RX rise time RX fall time TX setup to SD high/low TX hold from SD high/low RX pulse width RX pulse width RX pulse width RX pulse width Output delay at 40 mW/cm Receiver latency RX valid after shutdown LED protection timeout 2 Test Conditions Symbol tr tf ts th Min 10 10 200 200 0.8 100 60 185 Typical 20 20 Max 40 40 Unit ns ns ns ns R=2 k, C=50 pF R=2 k, C=50 pF 9.6 kbps 1.152 Mbps 4 Mbps, single 4 Mbps, double <1.2 Mbps tpw tpw tpw tpw td tL tRXDEN tLEDP 20 800 165 290 1 2 100 60 100 s ns ns ns s s s s Table 6. Optical Characteristics Parameter Minimum detection irradiance Test Conditions SIR: 9.6-115 kbps MIR: 1.152 Mbps FIR: 4 Mbps Output radiant intensity Peak wavelength Optical overshoot Symbol EMIN EMIN EMIN IE IP 100 860 Min Typical 2 2.5 7 140 320 900 25 Max 3 4 Unit W/cm2 W/cm2 W/cm2 mW/sr nm % PS007009-0302 ZHX2010 Side-Look FIR Transceiver 10 Transceiver Performance Figure 4 through Figure 6 show the performance of the FIR transceiver. Figure 4. Typical Ie Versus Angle Figure 5. Typical SIR Ee Versus Angle PS007009-0302 ZHX2010 Side-Look FIR Transceiver 11 Figure 6. Typical FIR Ee Versus Angle PS007009-0302 ZHX2010 Side-Look FIR Transceiver 12 Mechanical Specifications Figure 7 shows the mechanical specifications for the FIR transceiver. Note: The ZiLOG ZHX2010 transceiver will continue to be marked as the original Calibre part number, CHX2010. Figure 7. ZHX2010 Mechanical Specifications PS007009-0302 ZHX2010 Side-Look FIR Transceiver 13 Soldering and Cleaning Recommendations Follow these recommendations to maintain the performance of the ZHX2010 transceiver. Reflow Soldering * Reflow soldering paste is recommended: Melting temperature: 178 C ~ 192 C Composition: Sn 63%, Pb 37% * * * The recommended thickness of the metal mask is between 0.2 mm and 0.25 mm for screen printing. Number of soldering times: 2 times maximum The temperature profile at the top surface of ZHX2010, shown in Figure 8, is recommended. 250 10 sec Max. 230 C Max. 200 4 C/sec Max. 150 4 C/sec Max. 60 ~ 120 sec 100 140 C ~ 160 C 40 sec Max. Temperature (degrees C) Time Figure 8. Temperature Profile for the Top Surface Manual Soldering * * * * Use 63/37 or silver solder. Use a soldering iron of 25 W or smaller. Adjust the temperature of the soldering iron below 300 C. Finish soldering within 3 seconds. Handle only after the ZHX2010 has cooled off. PS007009-0302 ZHX2010 Side-Look FIR Transceiver 14 Cleaning Perform cleaning after soldering under the following conditions: * * * Cleaning agent: Alcohol Temperature and time: 30 seconds below 50 C or 3 minutes below 30 C Ultrasonic cleaning: Below 20 W PS007009-0302 ZHX2010 Side-Look FIR Transceiver 15 Packing, Storing, and Baking Recommendations Follow these recommendations to maintain the performance of the ZHX2010 transceiver. Storage To avoid moisture absorption, ZHX2010 reels must remain in the original, unopened moisture-proof packing. Parts must be soldered within 48 hours after unpacking. Reels that have been unpacked, but will not be soldered within 48 hours, must be stored in a desiccator. Baking Parts that have been stored over 12 months or unpacked over 48 hours must be baked under the following guidelines. Reels 60 C for 48 hours or more Loose Parts * * * 100 C for 4 hours or more or 125 C for 2 hours or more or 150 C for 1 hour or more PS007009-0302 ZHX2010 Side-Look FIR Transceiver 16 Moisture-Proof Packing In order to avoid moisture absorption during transportation and storage, ZHX2010 reels are packed in aluminum envelopes (see Figure 9) that contain a desiccant with a humidity indicator. The indicator changes color from blue to pink as moisture is absorbed. Figure 9. FIR Transceiver Packaging PS007009-0302 ZHX2010 Side-Look FIR Transceiver 17 Taping Specifications (in accordance with JIS C 0806) Figure 10 shows the reel dimensions, and Figure 11 shows the tape dimensions and configuration. DETAIL 330 DIA. 80 1 DIA. 2.0 0.5 LABEL PASTED HERE R 1.0 21.0 0.8 13.0 0.5 17.5 + 2.0 - 0.0 2 0.5 (Unit:mm) Figure 10. Reel Dimensions 4 0.1 .73 0.1 1.5 + 0.1 DIA. - 0.0 1.75 0.1 VSS 10.2 0.1 ANODE 0.4 0.05 4.4 0.1 1.4 0.1 8.0 0.1 5.24 0.1 7.5 0.1 16 0.3 PULL OUT DIRECTION EMPTY (40 mm MIN) PARTS MOUNTED LEADER (400 mm MIN) QUANTITY 2,000 Pieces per reel EMPTY (40 mm MIN) (Unit:mm) Figure 11. Tape Dimensions and Configuration PS007009-0302 ZHX2010 Side-Look FIR Transceiver 18 Customer Feedback Form If you experience any problems while operating this product, or if you note any inaccuracies while reading this product specification, please copy and complete this form, then mail or fax it to ZiLOG (see Return Information, below). We also welcome your suggestions! Customer Information Name Company Address City/State/Zip Country Phone Fax email Product Information Serial # or Board Fab #/Rev # Software Version Document Number Host Computer Description/Type Return Information ZiLOG System Test/Customer Support 532 Race Street San Jose, CA 95126-3432 Fax: (408) 558-8300 Email: tools@zilog.com Problem Description or Suggestion Provide a complete description of the problem or your suggestion. If you are reporting a specific problem, include all steps leading up to the occurrence of the problem. Attach additional pages as necessary. _______________________________________________________________________________ _______________________________________________________________________________ _______________________________________________________________________________ _______________________________________________________________________________ PS007009-0302 |
Price & Availability of ZHX2010
![]() |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |