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INTEGRATED CIRCUITS
DATA SHEET
TDA8793 8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
Preliminary specification Supersedes data of 1998 May 14 File under Integrated Circuits, IC02 1999 Oct 06
Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
FEATURES * 8-bit low-power ADC (170 mW typical) * 2.7 to 3.6 V operation * Sampling rate up to 100 Msps * Track-and-hold circuit * CMOS/TTL compatible digital inputs and outputs * Internal references * Adjustable full scale range possibility with external reference * Power-down mode; 5 mW. APPLICATIONS * Radio communications * Digital data storage read channels * Medical imaging * Digital instrumentation. QUICK REFERENCE DATA SYMBOL VCCA VCCD VCCO ICCA ICCD ICCO INL DNL fCLK(max) Ptot PARAMETER analog supply voltage digital supply voltage output stages supply voltage analog supply current digital supply current output stages supply current integral non-linearity differential non-linearity maximum clock input frequency total power dissipation VCC = 3 V ramp input; fCLK = 2 MHz; VCCA = VCCD = 3 V ramp input; fCLK = 2 MHz; VCCA = VCCD = 3 V operating standby operating standby CONDITIONS MIN. 2.7 2.7 2.7 32 0 13 0 - - - 100 - TYP. 3.0 3.0 3.0 40 5 16 0.65 0.1 0.8 GENERAL DESCRIPTION
TDA8793
The TDA8793 is an 8-bit low-power Analog-to-Digital Converter (ADC) which includes a track-and-hold circuit and internal references. The device converts an analog input signal, up to 100 MHz, into 8-bit binary codes at a maximum sample rate of 100 Msps. All digital inputs and output are TTL/CMOS compatible. A sine wave clock input signal can also by used. The Power-down mode enables the device power consumption to be reduced to 5 mW.
MAX. 3.6 3.6 3.6 48 100 22 1.1 - tbf
UNIT V V V mA A mA mA mA LSB LSB MHz mW
0.25 tbf - 170 - -
ORDERING INFORMATION TYPE NUMBER TDA8793HL PACKAGE NAME LQFP32 DESCRIPTION plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm VERSION SOT401-1
1999 Oct 06
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
BLOCK DIAGRAM
TDA8793
handbook, full pagewidth
TEN 12
VCCA 7
VCCD 10
VCCO2 22
VCCO1 20 26 25 24 D7 D6 D5 D4 D3 D2 D1 D0 CLK
INP INN
4 3 TRACK-ANDHOLD ADC LATCHES CMOS OUTPUTS
23 18 17 16 15 11
REFOUT REFIN
5 2 CLOCK DRIVER VREFOUT = 1.85 V REFERENCE VSDN = 1.25 V 31 DEC 6 AGND 9 DGND
SDN
32
TDA8793
STDBY
8 19 21
MGR016
OGND1 ODGND2
Fig.1 Block diagram.
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
PINNING SYMBOL n.c. REFIN INN INP REFOUT AGND VCCA STDBY DGND VCCD CLK TEN n.c. n.c. D0 D1 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION not connected reference input for ADC negative input positive input reference for AC coupling analog ground analog supply voltage standby mode input digital ground digital supply voltage clock input track enable input (active LOW) not connected not connected data output bit 0 (LSB) data output bit 1 SYMBOL D2 D3 OGND1 VCCO1 OGND2 VCCO2 D4 D5 D6 D7 n.c n.c n.c n.c DEC SDN PIN 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
TDA8793
DESCRIPTION data output bit 2 data output bit 3 output ground 1 output supply voltage 1 output ground 2 output supply voltage 2 data output bit 4 data output bit 5 data output bit 6 data output bit 7 (MSB) not connected not connected not connected not connected decoupling stabilized decoupling node
30 n.c.
27 n.c.
29 n.c.
28 n.c.
n.c. REFIN INN INP REFOUT AGND VCCA STDBY
1 2 3 4
25 D6
26 D7
handbook, full pagewidth
32 SDN
31 DEC
24 D5 23 D4 22 VCCO2 21 OGND2
TDA8793
5 6 7 8 20 VCCO1 19 OGND1 18 D2 17 D3
VCCD 10
CLK 11
TEN 12
n.c. 13
n.c. 14
D0 15
D1 16
9
DGND
MGR017
Fig.2 Pin configuration.
1999 Oct 06
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCCA VCCD VCCO VCC PARAMETER analog supply voltage digital supply voltage output stages supply voltage supply voltage differences between VCCA and VCCD VCCO and VCCD VCCA and VCCO VINP, INN IO Tstg Tamb Tj HANDLING input voltage range output current storage temperature ambient temperature junction temperature referenced to AGND -1.0 -1.0 -1.0 -0.3 - -55 0 - +1.0 +1.0 +1.0 +7.0 10 CONDITIONS MIN. -0.3 -0.3 -0.3
TDA8793
MAX. +7.0 +7.0 +7.0 V V V V V V V
UNIT
mA C C C
+150 70 -
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 94 UNIT K/W
1999 Oct 06
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
TDA8793
CHARACTERISTICS VCCA = V7 to V6 = 2.7 to 3.6 V; VCCD = V10 to V9 = 2.7 to 3.6 V; VCCO = V20 (or V22) to V19 (or V21) = 2.7 to 3.6 V; AGND to DGND and OGND shorted together; VCCA to VCCD = -0.15 to +0.15 V; VCCD to VCCO = -0.15 to +0.15 V; VCCA to VCCO = -0.15 to +0.15 V; Tamb = 0 to 70 C; typical values measured at VCCA = VCCD = VCCO = 3.0 V and Tamb = 25 C; single-ended input; unless otherwise specified. SYMBOL Supplies VCCA VCCD VCCO ICCA ICCD ICCO analog supply voltage digital supply voltage output stages supply voltage analog supply current digital supply current output stages supply current fi = ramp input fi = 20 MHz Internal reference (pin SDN); note 1 Vref Vreg TC IL Vo(ref) Vo(reg) TC IL Iref VIL VIH IIL IIH tr tf Zi Ci VIL VIH IIL IIH reference voltage line regulation voltage temperature coefficient load current 2.7 < VCCA < 3.6 V 1.21 - - -1 1.76 2.7 < VCCA < 3.6 V - - -1 VREFIN = 1.25 V - 0 2 VCLK = 0 VCLK = VCCD -2 - 0.75 0.75 fCLK = 100 MHz fCLK = 100 MHz - - 0 2 VSTDBY = 0 VSTDBY = VCCD -5 - 1.25 0.4 18 - 1.82 1.5 18 - -0.87 - - - - - - 32 2 - - - - 1.29 3 - - 1.88 4 - - - 0.8 VCCD +2 5 tbf tbf - - 0.8 VCCD - 5 V mV ppm/K mA 2.7 2.7 2.7 32 13 - - 3.0 3.0 3.0 40 16 0.1 4 3.6 3.6 3.6 48 22 tbf tbf V V V mA mA mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Internal reference (pin REFOUT) reference voltage line regulation voltage temperature coefficient load current V mV ppm/K mA
Adjustable full scale input (pin REFIN); see Figs 3, 4, and 7 input current mA
Clock input (pin CLK); note 2 LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current clock rise time clock fall time input impedance input capacitance V V A A ns ns k pF
Standby input (pin STDBY); see Table 1 LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current V V A A
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
SYMBOL PARAMETER CONDITIONS MIN. - - - - TYP.
TDA8793
MAX.
UNIT
Track enable input (pin TEN); see Table 2 VIL VIH IIL IIH LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current VTEN = 0 VTEN = VCCD Vi = VINP - VINN; Tamb = 25 C output code = 127 fINP = 50 MHz fINP = 50 MHz VINP = VREFOUT + 0.5 VINP = VREFOUT - 0.5 IIH HIGH-level input current VINP = VREFOUT + 0.5 VINP = VREFOUT - 0.5 Adjustable full scale range; VREFIN = 1.2 to 1.35 V; see Fig.3 VI(p-p) input voltage range (peak-to-peak value) Vi = VINP - VINN; Tamb = 25 C - 1 - V 0 2 -5 - 0.8 VCCD - 5 V V A A
Inputs (pins INP and INN); analog input voltage referenced to AGND; VREFIN = 1.27 V; see Table 3 Vi(p-p) TCI Vi(os) Zi Ci IIL input voltage range (peak-to-peak value) input voltage range drift input offset voltage input impedance input capacitance LOW-level input current 0.90 - -25 - - -1 -1 - - 0.97 0.5 - 90 2 - - - - 1.040 - +25 - - - - 40 40 V mV/K mV k pF A A A A
Voltage controlled regulator input pin VREFIN (referenced to AGND); note 3 Vi(ref) Ii(ref) VOL VOH CL v/t fCLK(min) fCLK(max) tW(CLKH) tW(CLKL) reference voltage input current on pin VREFIN LOW-level output voltage HIGH-level output voltage output load capacitance slew rate 10% to 90%; CL = 10 pF track = LOW IO = 1 mA IO = -0.4 mA tbf - - - - - 100 4 4 1.25 tbf - - 1.2 - - - - tbf 1.1 V mA
Outputs; ADC data outputs 0.5 VCCO 10 - 6 - - - V V pF V/ns VCCO - 0.5 -
Switching characteristics; note 2; see Table 1 minimum clock frequency maximum clock frequency clock pulse width HIGH clock pulse width LOW MHz MHz ns ns
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
SYMBOL PARAMETER CONDITIONS - - MIN. TYP. 0.8 0.25
TDA8793
MAX.
UNIT
Analog signal processing; note 3; see Figs 4, 5, 6 and 7 INL DNL S/N integral non-linearity differential non-linearity signal-to-noise ratio (full scale) ramp input; fCLK = 2 MHz; VCCA = VCCD = 3 V ramp input; fCLK = 2 MHz; VCCA = VCCD = 3 V without harmonics; fCLK = 100 MHz fi = 20 MHz fi = 50 MHz BW(-3dB) THD Hfund(FS) -3 dB analog bandwidth total harmonics distortion full scale fundamental harmonics fi = 20 MHz fi = 50 MHz fCLK = 100 MHz fi = 20 MHz fi = 50 MHz HD2(FS) second harmonic distortion (full scale) all components included differential inputs; fCLK = 100 MHz fi = 20 MHz fi = 50 MHz single-ended input; fCLK = 100 MHz fi = 20 MHz fi = 50 MHz HD3(FS) third harmonic distortion (full scale) all components included differential inputs; fCLK = 100 MHz fi = 20 MHz fi = 50 MHz single-ended input; fCLK = 100 MHz fi = 20 MHz fi = 50 MHz SFDR spurious free dynamic range fCLK = 100 MHz fi = 20 MHz fi = 50 MHz EB effective bits fCLK = 100 MHz; note 4 fi = 20 MHz fi = 50 MHz Data timing; fCLK = 100 MHz; CL = 10 pF; see Fig.8 tds th td sampling delay output hold time output delay time - 3 - - - 5 1.5 - 8 ns ns ns 7.0 - 7.4 7.2 - - - - 57 54 - - - - 64 59 - - dB dB dB dB dB bits bits bits - - 64 61 - - dB dB - - 66 55 - - dB dB - - 66 57 - - dB dB - - - - 0 0 dB dB 42 - - - - 45 45 350 -56 -52 - - - - - dB dB MHz dB dB tbf tbf LSB LSB
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
Notes
TDA8793
1. It is possible to use the reference output voltage (pin SDN) to drive other analog circuits under the limits indicated. 2. In addition to a good layout of the digital and analog grounds, it is recommended that the rise and fall times of the clock must be not less than 0.75 ns. 3. It is possible with an external reference voltage connected to REFIN pin to adjust the ADC input range. The input range variation will be fixed. 4. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8 k acquisition points per equivalent fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency (nyquist frequency). Conversion to signal-to-noise ratio: SINAD = 6.02 x EB + 1.76 dB. Table 1 Standby selection PIN STDBY LOW HIGH Table 2 Track-and-hold selection PIN TEN LOW HIGH Table 3 TRACK-AND-HOLD active inactive; tracking mode D0 TO D7 inactive active; output logic state LOW ICCA + ICCD 56 mA 0.7 mA
Output coding and input voltage (typical values; referenced to AGND); VREFIN = 1.27 V BINARY OUTPUT BITS VINP (V) <1.6 1.6 ... ... 1.85 ... ... 2.1 >2.1 VINN (V) >2.1 2.1 ... ... 1.85 ... ... 1.6 <1.6
STEP Underflow 0 1 ... 127 ... 254 255 Overflow
D7 0 0 0 ... ... ... 1 1 1
D6 0 0 0 ... ... ... 1 1 1
D5 0 0 0 ... ... ... 1 1 1
D4 0 0 0 ... ... ... 1 1 1
D3 0 0 0 ... ... ... 1 1 1
D2 0 0 0 ... ... ... 1 1 1
D1 0 0 0 ... ... ... 1 1 1
D0 0 0 1 ... ... ... 0 1 1
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
TDA8793
handbook, halfpage
1.4
FCE421
handbook, halfpage
67
FCE423
Vi(p-p) (V) 1.2
SFDR S/N (dB)
(1)
62
57 1 52
(2)
0.8 47
0.6 1.15
1.25
1.35
1.45 VREFIN (V)
42 1.15
1.25
1.35
1.45 VREFIN (V)
Typical values measured at VCCA = VCCD = VCCO = 3.0 V, fCLK = 100 MHz, Tamb = 25 C and single-ended input.
(1) SFDR (2) S/N Typical values measured at VCCA = VCCD = VCCO = 3.0 V, fCLK = 100 MHz, Tamb = 25 C and single-ended input.
Fig.3
ADC input voltage as a function of VREFIN reference input voltage.
Fig.4
Noise and spurious free dynamic range as a function of VREFIN reference input voltage.
handbook, halfpage
55
FCE419
THD S/N (dB)
handbook, halfpage
(1)
8
FCE420
EB (bits) 7.5
53
(2)
(1)
(2)
51
7
49
(3)
6.5
47
6
45 1 10 fi (MHz)
102
5.5 1 10 fi (MHz)
102
(1) THD for differential inputs (2) THD for single-ended input (3) S/N Typical values measured at VCCA = VCCD = VCCO = 3.0 V, fCLK = 100 MHz and Tamb = 25 C.
(1) Differential inputs (2) Single-ended input Typical values measured at VCCA = VCCD = VCCO = 3.0 V, fCLK = 100 MHz and Tamb = 25 C.
Fig.5
Noise and distortion as a function of input frequency.
Fig.6 Effective bits as a function of input frequency.
1999 Oct 06
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
TDA8793
handbook, halfpage
8
FCE422
EB (bits) 7
6
5 1.15
1.25
1.35
VREFIN (V)
1.45
Typical values measured at VCCA = VCCD = VCCO = 3.0 V, fCLK = 100 MHz, Tamb = 25 C and single-ended input.
Fig.7
Effective bits as a function of VREFIN reference input voltage.
handbook, full pagewidth
tCPL tCPH HIGH CLK sample N + 1 sample N + 2 50 % LOW sample N
Vl
tds DATA D0 to D7 DATA N-2 DATA N-1 td
th HIGH DATA N DATA N+1
MGR018
50 % LOW
Fig.8 Timing diagram.
1999 Oct 06
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
APPLICATION INFORMATION
TDA8793
handbook, full pagewidth
100 nF SND 100 nF 10 nF 220 nF input 50 50 REFOUT 100 nF
MGR019
DEC 31
REFIN INN INP
32 2 3 4
TDA8793
5
Fig.9 Application diagram for single-ended input mode with internal reference.
handbook, full pagewidth
EXTERNAL REFERENCE 1.25 V 100 nF 10 nF 220 nF input 50 50 REFOUT 100 nF 5 31 2 3 4
100 nF DEC
REFIN INN INP
TDA8793
MGR020
Fig.10 Application diagram for single-ended input mode with external reference.
1999 Oct 06
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
TDA8793
handbook, full pagewidth
100 nF SND 100 nF 220 nF input 2 50 220 nF input 1 50 REFIN INN 32 2 3 DEC 31
TDA8793
INP 4 5
MGR021
REFOUT 100 nF
Fig.11 Application diagram for differential input mode with internal reference.
handbook, full pagewidth
100 nF SND 100 nF 220 nF input 100 REFIN INN 100 nF 100 INP REFOUT 100 nF
MGR022
DEC 31
32 2 3
1:1
TDA8793
4 5
Fig.12 Application diagram for differential input mode using a transformer.
1999 Oct 06
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
PACKAGE OUTLINE LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm
TDA8793
SOT401-1
c y X
24 25
17 16 ZE
A
e E HE wM bp 32 1 8 9 L detail X Lp A A2 A1 pin 1 index (A 3)
e bp D HD
ZD wM B
vM A
vM B
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT401-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION A max. 1.60 A1 0.15 0.05 A2 1.5 1.3 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 5.1 4.9 E (1) 5.1 4.9 e 0.5 HD 7.15 6.85 HE 7.15 6.85 L 1.0 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 0.95 0.55 0.95 0.55 7 0o
o
ISSUE DATE 95-12-19 97-08-04
1999 Oct 06
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
TDA8793
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Oct 06
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable suitable suitable suitable suitable suitable
TDA8793
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
NOTES
TDA8793
1999 Oct 06
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Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
NOTES
TDA8793
1999 Oct 06
18
Philips Semiconductors
Preliminary specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
NOTES
TDA8793
1999 Oct 06
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/02/pp20
Date of release: 1999
Oct 06
Document order number:
9397 750 06028

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