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Silan Semiconductors TONE / PULSE SWITCHABLE DIALER WITH HANDFREE FUNCTION DESCRIPTION The SC91710A/B are Tone/Pulse switchable dialer which are fabricated in COMS technology with wide operating voltage for both tone and pulse mode, and consumes very low memory retention current in ON-HOOK state. SC91710A/B DIP-16 FEATURES *Tone/Pulse switchable dialer *One 32-digit last number redial memory *Pulse-to-tone (PT) is provided for PBX operation *Flash key is available *Minimum tone duration is 98ms or 83ms *Minimum intertone pause is 98ms or 83ms *Redial Pause time (0ms) *Uses 3.579549MHz crystal or ceramic resonator *Many options can be selected Mode (10PPS; 20PPS; Tone) M/B ratio (40:60;33:66) Pause time (3.6s) *Flash function (RESET) (PT) pause time (3.6s) Flash time (600ms; 300ms; 100ms; or 80ms) *Mixed dialing *Power on reset circuit is provided *Handfree function is provided for speaker phone application *Packaged in 16-DIP or 18-DIP DIP-18 ORDERING INFORMATION SC91710A SC91710B DIP-16 Packaged DIP-18 Packaged PIN CONFIGURATION C2 C2 C3 C4 C1 OSCI OSCO XMUTE VSS 1 2 3 4 5 6 7 8 9 SC91710B 18 17 16 15 14 13 12 11 10 R3 R2 R1 R4 TONE PO HKS VDD HFO 1 2 3 4 5 6 7 8 SC91710A 16 15 14 13 12 11 10 9 R3 C3 R2 C4 R1 C1 R4 OSCI TONE OSCO PO XMUTE HKS VSS VDD HFI HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 1 Silan Semiconductors BLOCK DIAGRAM XMUTE HFO SC91710A/B VDD PULSE GENERATOR COLUMN INTERFACE CKT. COL1 COL2 COL3 COL4 INPUT INTERFACE CKT. PO KERNEL CONTROL CKT. DECODER & DATA LATCH OSCI OSC. OSCO DIVIDER LNB MEMORY ROW/COLUMN PROGRAMMING COUNTER ROW1 ROW2 ROW3 ROW4 ROW INTERFACE CKT. D/A CONVERTER INPUT INTERFACE CKT. TONE HKS KEYBOARD ASSIGNMENT C1 R1 R2 R3 R4 1 4 7 *or */T C2 2 5 8 0 C3 3 6 9 # C4 PT F P RD 1) PT: In pulse mode, execute PT function. 2) P: Pause key. 3) F: Flash key 4) RD: Redial key 5) In pulse mode, execute PT function. In tone mode, execte "*" key DIALING SIGNAL OPTION A: Flash time Row3 Row4 B: Flash time(ms) 600 300 100 80 Row1 R R NR NR UR UR Row2 NR R NR R NR R MODE TONE TONE PULSE PULSE PULSE PULSE VSS HFI PULSE RATE --20PPS 20PPS 10PPS 10PPS M/B --40:60 33:66 40:60 33:66 NR NR R R NR R NR R HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 2 Silan Semiconductors C: Tone function SC91710A/B D: Key type select Col1 NR R Note: R: Tone Duration 98ms 83ms NR: no resistance Inter-Tone Pause 98ms 83ms Col2 NR R *or */T select * */T A resistance connect to VSS (820k typically) UR: A resistance connect to VDD ABSOLUTE MAXIMUM RATINGS (Tamb=25C, All voltage referenced to VSS, unless otherwise specified) Characteristic Power Supply Voltage Input Voltage Power Dissipation Operating Temperature Storage Temperature Symbol VDD VIN PD Topr Tstg Value 6.0 -0.3~VDD+0.3 500 -25~+70 -55~+150 Unit V V mW C C ELECTRICAL CHARACTERISTICS (Tamb=25C, VDD=2.5V, fosc=3.579545MHz, unless otherwise specified) Parameter DC Characteristics Symbol Tone Conditions Min 2.5 2.0 1.0 ----VSS 0.7VDD -0.2 -4 200 -- Typ --0.6 0.2 0.1 0.1 Max 5.5 5.5 5.5 2 0.5 1 0.2 0.3VDD VDD Unit Operating Voltage VDD Pulse Memory retention Tone Pulse OFF-HOOK, Keypad entry V Operating Current Standby Current Memory Retention Current Control Pin Input Low Voltage Control Pin Input High Voltage IOP IS Imr Vil Vih Imth Imtl Ihks Ikbd Ikbs tDB mA A A V A mA A A ms ON-HOOK No keypad entry ON-HOOK VDD=1.0V --V XMUTE =6.0V V XMUTE =0.5V Vhks=2.5V Vn=0V note1 Vn=2.5 -note1 XMUTE Pin Leakage Current -0.5 -10 400 20 1 -0.1 30 800 -- XMUTE Pin Sink Current HKS Pin Input Current Keyboard Scanning Pin Drive Current Sink Current Key-in Debounce Time (to be continued) HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 3 Silan Semiconductors (continued) SC91710A/B Conditions VDD=2.5 Vhfo=2.0V Vhfo=2.5V Vpo=2.5V Vpo=0.5V Parameter HFI pin input resistor HFO pin drive current HFO pin sink current Pulse Mode Pulse Output Pin Leakage Current Pulse Output Pin Sink Current Pulse Rate Make/Break Ratio Pre-digit Pause Inter-digit Pause Tone Mode DC Level Tone Output Pin Sink Current AC level Load Resistor DTMF Signal Pre-emphasis Distortion(note 2) Minimum tone duration Time Minimum Intertone Pause Time Symbol Rhfi Ihdoh Ihdol Ipoh Ipol fpr tM tB Min -0.5 0.5 0.1 0.5 ----- Typ 200 ----10 20 40:60 33:66 40 33 800 500 --155 -2 -30 98/83 98/83 Max -------------0.7VDD -170 -3 -23 --- Unit k mA mA A mA pps % ms ms tPDP tIDP M/B ratio=40:60 M/B ratio=33:66 Pulse rate=10pps Pulse rate=20pps VDD=2.0V~5.5V Vdtmf=0.5V Row group Dist. -23dB VDD=2.0~5.5 V, Column-Row group RL=10K Auto redial Auto redial RL=10K ----0.5VDD 0.2 130 10 1 ---- Vdc Itl Vdtmf RI twist Dist. tTD tITP V mA mVrms K dB dB ms ms Note: 1. Vn: Input voltage of any keyboard scanning pin (Row group, Column group) 2 Distortion (dB) = 20log{[V12+V22+V32+...Vn2)1/2]/[(VL2+VH2)1/2]} VL,VH: Row group and Column group signal , V1 V2... Vn: Harmonic signal (BW = 300Hz~3500Hz ACTUAL FREQUENCY OUTPUT (fosc=3.579545MHz) Keyboard Scanning Pin R1 R2 R3 R4 C1 C2 C3 f1 f2 f3 f4 f5 f6 f7 Standard(Hz) 697 770 852 941 1209 1336 1477 Output 699 766 848 948 1216 1332 1472 Deviation(%) +0.28 -0.52 -0.47 +0.74 +0.57 -0.30 -0.34 HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 4 Silan Semiconductors PIN DESCRIPTION Pin No. SC91710A SC91710B 4 4 SC91710A/B Description Pin Name C1 *Provides keyboard scanning. * HKS pin is LOW, the column group stays in "HIGH" state and row group stays in "LOW" state. *The keypad is compatible with the standard dual contact matrix keyboard 1 1 C2 (as figure1b), the inexpensive single contact keyboard (as figure 1a), and electronic input (as figure 1c). *When HKS is "LOW", a valid key entry is defined by related Row & 2 2 C3 Column connection or by electronic input (as shown in figure 1c). *Activation of two or more keys will result in no response, except for single key. *To avoid keyboard-bouncing error, this chip provides built-in debounce circuit. (The debounce time = 20ms) 3 3 C4 14 16 R1 Row Column Row Column 15 17 R2 Figure1a: Single contact form keyboard configuration Row Figure1b: Dual contact form keyboard configuration VDD VSS 16 18 R3 Column VDD VSS 13 15 R4 Figure1c: Electronic signal input keyboard configuration *Oscillator input & output pins. 5 5 OSCI *The 3.579545MHz oscillator is formed by a built-in inverter inside of this chip and by connecting a 3.579545MHz crystal or a ceramic resonator across the OSCI and OSCO pins. (built-in feedback resistor and capacitor) 6 6 OSCO *When HKS is "LOW", a valid key-in may turn on this oscillator and generates a 3.579545 MHz clock. (to be continued) HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 5 Silan Semiconductors ( continued ) SC91710A/B Description *Mute output pins. *NMOS open drain output structure. Pin No. Pin Name SC91710 SC91710B A 7 7 XMUTE *The output is in "LOW" state during dialing sequence (both Pulse and Tone mode) otherwise this pin is "high-impedance". *Long (continue) Mute. 8 9 8 11 VSS VDD *Negative power supply pin. *Positive power supply pin. *Hook switch input pin. *When the handset is in ON-HOOK state, this pin must be pulled "high" in order to disable the dialing operation and decrease the power consumption. *When in OFF-HOOK state, the HKS pin must be pulled "low" state for all function operation. *Pulse output signal pin. *NMOS open drain output structure. *The output is "LOW" during pulse dialing and Flash operation, otherwise this output is "floating". *Dual Tone Multi-frequency output pin. *In TONE mode, when an entry of digit key (include *, # key), this pin will send out a corresponding DTMF signal. 10 12 HKS 11 13 PO 12 14 TONE *The TONE pin provides minimum tone duration and minimum intertone pause time to support rapid key-in. If key-in time is less than 100ms, DTMF signal will last for 100ms; otherwise the tone duration will last as long as the key is pressed. * Handfree input control pin. * Toggle input structure, falling edge trigger. * It is used to enable and disable Handfree function. * With waveshaped by a built-in Schmit trigger, the bounce of input can be eliminated by external R, C debounce circuit. * A built-in pull down resistor is 200k typical. * Handfree output control pin. * Inverter output structure (normally `low', active `high'). * When a HFI pin is active, Handfree function will be enabled (HFO=1) or disable (HFO=0). * When the Handfree function is enable (HFO=1), after OFF-HOOK action, it can reset Handfree function and HFO pin return to `low' state. 9 HFI 10 HFO HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 6 Silan Semiconductors KEYBOARD OPERATION Symbol definitions: a) b) c) d) e) f) g) h) i) j) k) l) m) D1~Dn Dp1~Dpn Dt1~Dtn tF tP tPT tFP tRP LNB : : : : : : : : : : : : : OFF-HOOK or enable Hand Free function. ON-HOOK or disable Hand Free function. Input level from low to high. Input level from high to low. SC91710A/B Digit key 1, 2, 3, 4, 5, 6, 7, 8, 9, 0, *, #, (C1~Cn is same as D1~Dn). Pulse digit Tone digit Flash time. Pause time. Pulse to Tone wait time. Pause time for flash. Pause time for redial. Last number redial buffer. 1, 2, 3, 4, 5, 6, 7, 8, 9, 0, (Cp1~Cpn is same as Dp1~Dpn). 1, 2, 3, 4, 5, 6, 7, 8, 9, 0, *, #, (Ct1~Ctn is same as Dt1~Dtn). A Normal Dialing 1. Digit Dialing Procedure Dial out Dial out LNB D1, D2..., Dn Dtn (in Tone mode) Dt1, Dp1, D1, Dt2..., Dp2,..., Dpn (in Pulse mode) D2..., Dn 2. Dialing with flash key Procedure Dial out Dial out LNB t F, t F, D1, F, D1, D2..., Dn tFP, tFP, Dt1, Dp1, Dn Dtn (in Tone mode) ..., Dpn (in Pulse mode) Dt2..., Dp2, D2..., 3. Dialing with PT key Procedure Dial out LNB D1, D1, D2 ..., PT , ..., Dn Dp1, Dp2, ..., D2 ..., tPT, ..., Dpn (in Pulse mode) Dn PT , ..., Note: If key in digit over maximum digit stored in LNB, then RD is inhibit even after on/off hook. HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 7 Silan Semiconductors B Mixed dialing Procedure Dial out LNB D1, Dp1, D1, D2..., Dp2, ..., PT , tPT, D9, Dt9, D10 ..., Dt10..., Dn SC91710A/B Dn Dtn D2..., PT , D9, D10 ..., C Redial LNB Procedure Dial out Dial out D1, tRP, tRP, D2..., RD Dt2..., Dp2,..., Dtn (in Tone mode) (in Pulse mode) Dpn Dn Dt1, Dp1, Note: If key in digit over maximum digit stored in LNB, then RD is inhibit. D Pause Function Procedure Dial out Dial out LNB D1, D2..., Dn, P, C1 ..., Dtn, tP, Ct1, Cn Ctn (in Tone mode) Cpn (in Pulse mode) Dt1, Dp1, Dt2 ,..., Dp2, ... Dpn , tP, Cp1 ..., D1, D2..., Dn, P , C1, C2 ..., Cn E Flash Function 1. Reset Procedure Dial out Dial out LNB D1, D2..., Dn, F, C1 ..., Cn (in Tone mode) (in Pulse mode) Dt1, Dp1, C1, Dt2,..., Dtn , t F, Dp2,..., Dpn , C2 ..., Cn tFP, t F, Ct1 ..., Ctn tFP, Cp1 ..., Cpn Handfree Function operation: A) To execute Handfree function: When HFO = 'low', HFI pin is active, the Handfree function will be enabled (HFO = 'high') B) Reset Handfree function: a. OFF-HOOK action. b. When HFO = 'high', a HFI pin is active again, the Handfree function will be reset (HFO='low'). HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 8 Silan Semiconductors Operating flow chart of Handfree ON HKS (0) INITIAL HF ON HKS (1) HF LINE HF OFF HF ON HF OFF HKS (3) HF LINE Note: OFF SC91710A/B ON OFF HKS (2) LINE ON: ON HKS; OFF: OFF HKS; HF: Pressed HF key STATE NO. (0) INITIAL STATE (1) ON HKS HF LINE (2) OFF HKS LINE (3) OFF HKS HF LINE PO XMUTE HFO 0 1 0 1 * F: Floating (Hi-impedance) F F F F F F F F HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 9 Silan Semiconductors TEST CIRCUIT 1 SC91710A/B 2 Operation current V+ A Standby current V+ A VDD keyboard HKS MODE VSS DP DP DT VDD HKS VSS 3 Tone output voltage V+ 4 counter and AC meter TONE Tone distortion V+ VDD VDD keyboard VSS Spectrum analyzer TONE HKS keyboard 10K VSS HKS V 10K 5 Pulse output sink current (open drain structure) V+ 6 Pulse output sink current (inverter structure) V+ Flash key VDD PO HKS A V VEXT VDD HKS PO VSS A V VEXT VSS 7 Keypad input current (row group) V+ 8 keypad input current (column group) V+ A ROW VDD R* C* VDD COLUMN R* C* HKS VSS MODE A HKS VSS MODE Note: 1. Dist. (dB)=20log{[V12+V22+V32+...Vn2)1/2]/[(VL2+VH2)1/2]} a. V1...Vn are extraneous frequencies (ie, inter modulation and harmonic), components in the 500Hz to 3400Hz band. b. VL,VH are the individual frequency components of DTMF signal. c. Whether keyboard is pushed refer to the TONE mode time diagram. 2. Sink current Isink=I/(1-Duty Cycle), I is the net DC current measured from ampere meter. 3. R*, C* mean other column and row. HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 10 Silan Semiconductors TIMING DIAGRAMS HKS 3 KEY IN tDB SC91710A/B 2 3 XMUTE PO TONE tTD tITP tITP tITP OSCO Normal dialing Tone Mode Timming Diagram ......High impedance HKS 3 KEY IN tDB 2 3 XMUTE tPDP tB tTD tIDP tM PO TONE OSCO tIDP tIDP Normal dialing ......High impedance Pusle Mode Timming Diagram HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 11 Silan Semiconductors TIMING DIAGRAMS (continued) HKS 3 KEY IN tDB SC91710A/B 2 PT 3 XMUTE tPDP PO TONE OSCO ......High impedance Timming Waveform for mixed dialing Operation (by PT key entry) tIDP tIDP tPT tITP HKS KEY IN F tDB XMUTE PO TONE OSCO ......High impedance Flash key operating timming tF HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 12 Silan Semiconductors TIMING DIAGRAMS(continued) HKS 3 KEY IN tDB SC91710A/B 2 RD XMUTE PO tITP tITP tD tITP tITP TONE OSCO ......High impedance Tone Mode Redial Timming Diagram HKS 3 KEY IN tDB 2 RD XMUTE tRP tIDP tIDP PO tIDP tIDP TONE OSCO ......High impedance Pulse Mode Redial Timming Diagram HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 13 Silan Semiconductors TIMING DIAGRAMS(continued) HKS KEY IN *PULSE MODE SC91710A/B 3 tDB 2 P 3 XMUTE PO TONE OSCO *TONE MODE tPDP tIDP tIDP tP tIDP tDB XMUTE PO tITP tITP tP tITP TONE OSCO ......High impendance Pause key operating timming HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 14 SC91710A/B 1N4004x4 Tip MPSA92 1N4148 ON/OFF HOOK 1N4148x2 240k Ring ZNR 120V MPSA42 100k 2.2k 330k 2k 5.1V 100F 16V C945 100F 16V 1F 1F 470k 100k 11 1 4 7 * 0 # R/P 8 9 P 5 6 F 2 3 PT 9 14 R1 15 R2 16 R3 13 R4 C4 C3 C2 C1 3 2 1 4 OSCI 5 PO VDD 10 HKS TONE 12 SC91710A XMUTE 7 TYPACAL APPLICATION CIRCUIT OSCO VSS 6 8 TO HANDSET Silan Semiconductors 3.579545MHz VDD 820k x5 15 TONE 20pps 10pps 2 wrie to 4 wire Speech network Rev: 2.0 22M 100k HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD 2001-11-13 SC91710A/B 22M 1N4004x4 HOOK ON/OFF 100k MPSA92 240k Tip 1N4148 HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD 330k 200k ZNR 120V 3.3k C954 100k 47k 1F C945 470k 5.1V 47k 1F C954 200k 100F 16V 0.2F 2.7k Ring 13 1 4 7 * 0 # R/P 8 9 P 5 6 F 2 3 PT 12 14 R1 PO 15 R2 16 R3 13 R4 C4 C3 C2 C1 3 2 1 4 OSCI 5 HKS 11 14 VDD TONE HFO 10 SC91710B XMUTE 7 TYPACAL APPLICATION CIRCUIT HFI OSCO VSS 6 8 9 1F TO HANDSET HF KEY Silan Semiconductors 3.579545MHz VDD 820k x6 16 TONE 20pps 10pps 2 wrie to 4 wire Speech network & Audio amplifier Rev: 2.0 2001-11-13 Silan Semiconductors CHIP TOPOGRAPHY SC91710A/B Size: 1.45 x 1.54 mm 2 PAD COORDINATES (Unit: m) No. 1 2 3 4 5 6 7 8 9 Symbol P1 P2 P3 P4 P5 P6 P7 P8 P9 X -542.6 -542.6 -542.6 -315.0 -134.8 85.5 562.4 562.4 562.4 Y -238.0 -468.1 -602.5 -602.5 -602.5 -602.5 -439.1 -277.6 -93.6 No. 10 11 12 13 14 15 16 17 18 Symbol P10 P11 P12 P13 P14 P15 P16 P17 P18 X 562.4 562.4 562.4 562.4 148.6 -22.4 -251.0 -542.6 -542.6 Y 88.5 252.4 445.8 603.8 603.8 603.8 603.8 124.7 -102.9 Note: The original point of the coordinate is the die center. HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 17 Silan Semiconductors PACKAGE OUTLINE SC91710A/B UNIT: mm 2.54 DIP-16-300-2.54 6.40 1.50 19.4 7.62 15 degree 3.51 0.46 DIP-18-300-2.54 2.54 3.30 5.08 0.25 UNIT: mm 6.40 1.50 22.95 7.62 15 degree 3.51 0.46 HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 2.0 2001-11-13 18 3.30 5.08 0.25 |
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