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Provisional Data Sheet No. PD-9.1564
REPETITIVE AVALANCHE AND dv/dt RATED
HEXFET(R) TRANSISTOR
IRHM7064 IRHM8064
N-CHANNEL
MEGA RAD HARD
60 Volt, 0.021, MEGA RAD HARD HEXFET
International Rectifier's RAD HARD technology HEXFETs demonstrate virtual immunity to SEE failure. Additionally, under identical pre- and post-radiation test conditions, International Rectifier's RAD HARD HEXFETs retain identical electrical specifications up to 1 x 105 Rads (Si) total dose. No compensation in gate drive circuitry is required. These devices are also capable of surviving transient ionization pulses as high as 1 x 1012 Rads (Si)/ Sec, and return to normal operation within a few microseconds. Since the RAD HARD process utilizes International Rectifier's patented HEXFET technology, the user can expect the highest quality and reliability in the industry. RAD HARD HEXFET transistors also feature all of the wellestablished advantages of MOSFETs, such as voltage control, very fast switching, ease of paralleling and temperature stability of the electrical parameters. They are well-suited for applications such as switching power supplies, motor controls, inverters, choppers, audio amplifiers and high-energy pulse circuits in space and weapons environments.
Product Summary
Part Number IRHM7064 IRHM8064 BVDSS 60V 60V RDS(on) 0.021 0.021 ID 35A* 35A*
Features:
s s s s s s s s s s s s s
Radiation Hardened up to 1 x 10 6 Rads (Si) Single Event Burnout (SEB) Hardened Single Event Gate Rupture (SEGR) Hardened Gamma Dot (Flash X-Ray) Hardened Neutron Tolerant Identical Pre- and Post-Electrical Test Conditions Repetitive Avalanche Rating Dynamic dv/dt Rating Simple Drive Requirements Ease of Paralleling Hermetically Sealed Electrically Isolated Ceramic Eyelets
Absolute Maximum Ratings
Parameter
ID @ VGS = 12V, TC = 25C I D @ VGS = 12V, TC = 100C IDM PD @ TC = 25C VGS EAS IAR EAR dv/dt TJ TSTG Continuous Drain Current Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Lead Temperature Weight
Notes: See page 4
Pre-Radiation
IRHM7064, IRHM8064
35* 35* 284 250 2.0 20 500 35 25 4.5 -55 to 150 300 (0.063 in (1.6mm) from case for 10 sec.) 9.3 (typical)
Units A
W W/K V mJ A mJ V/ns
oC
g
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*Current is limited by pin diameter
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Pre-Radiation
Electrical Characteristics @ Tj = 25C (Unless Otherwise Specified)
Parameter
BVDSS Drain-to-Source Breakdown Voltage BVDSS/TJ Temperature Coefficient of Breakdown Voltage RDS(on) Static Drain-to-Source On-State Resistance VGS(th) Gate Threshold Voltage gfs Forward Transconductance IDSS Zero Gate Voltage Drain Current
Min.
60 -- -- 2.0 18 -- -- -- -- -- -- -- -- -- -- -- --
Typ. Max. Units
-- 0.048 -- -- -- -- -- -- -- -- -- -- -- -- -- -- 8.7 -- -- 0.021 4.0 -- 25 250 100 -100 260 60 86 27 120 76 93 -- V S( ) A nA nC V V/C
Test Conditions
VGS = 0V, ID = 1.0 mA Reference to 25C, ID = 1.0 mA VGS = 12V, ID = 35A VDS = VGS, ID = 1.0 mA VDS > 15V, IDS = 35A V DS = 0.8 x Max Rating,VGS = 0V VDS = 0.8 x Max Rating VGS = 0V, TJ = 125C VGS = 20V VGS = -20V VGS =12V, ID = 35A VDS = Max. Rating x 0.5 VDD = 30V, ID = 35A, RG = 2.35
IGSS IGSS Qg Qgs Qgd td(on) tr td(off) tf LD
Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance
ns
LS
Internal Source Inductance
--
8.7
--
nH
Measured from the Modified MOSFET drain lead, 6mm (0.25 symbol showing the in.) from package to internal inductances. center of die. Measured from the source lead, 6mm (0.25 in.) from package to source bonding pad.
Ciss Coss Crss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
-- -- --
7400 3200 540
-- -- --
pF
VGS = 0V, VDS = 25V f = 1.0 MHz
Source-Drain Diode Ratings and Characteristics
Parameter
IS I SM Continuous Source Current (Body Diode) Pulse Source Current (Body Diode)
Min. Typ. Max. Units
-- -- -- -- 35 284
Test Conditions
Modified MOSFET symbol showing the integral reverse p-n junction rectifier.
A
VSD t rr QRR t on
Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time
Tj = 25C, IS = 35A, VGS = 0V Tj = 25C, IF = 35A, di/dt 100A/s VDD 50V Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD. -- -- -- -- -- -- 3.0 220 1.1 V ns C
Thermal Resistance
Parameter
RthJC RthJ-PCB RthCS Junction-to-Case Junction-to-PC board Case-to-Sink
Min. Typ. Max. Units
-- -- -- -- -- 0.21 0.50 K/W 48 --
Test Conditions
typical socket mount
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Radiation Characteristics
Radiation Performance of Rad Hard HEXFETs
International Rectifier Radiation Hardened HEX-FETs are tested to verify their hardness capability. The hardness assurance program at International Rectifier uses two radiation environments. Every manufacturing lot is tested in a low dose rate (total dose) environment per MlL-STD-750, test method 1019. International Rectifier has imposed a standard gate voltage of 12 volts per note 6 and a VDSS bias condition equal to 80% of the device rated voltage per note 7. Pre- and post-radiation limits of the devices irradiated to 1 x 105 Rads (Si) are identical and are presented in Table 1, column 1, IRHM7064. The values in Table 1 will be met for either of the two low dose rate test circuits that are used. Both pre- and post-radiation performance are tested and specified using the same drive circuitry and test conditions in order to provide a direct comparison. It should be noted that at a radiation level of 1 x 105 Rads (Si), no change in limits are specified in DC parameters. High dose rate testing may be done on a special request basis, using a dose rate up to 1 x 1012 Rads (Si)/Sec. International Rectifier radiation hardened HEXFETs have been characterized in neutron and heavy ion Single Event Effects (SEE) environments. Single Event Effects characterization is shown in Table 3.
Table 1. Low Dose Rate
Parameter
BVDSS VGS(th) IGSS IGSS IDSS RDS(on)1 VSD Drain-to-Source Breakdown Voltage Gate Threshold Voltage Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Zero Gate Voltage Drain Current Static Drain-to-Source On-State Resistance One Diode Forward Voltage
IRHM7064
min. 100 2.0 -- -- -- -- -- max. -- 4.0 100 -100 25 0.021 3.0
IRHM8064 Test Conditions
min. 100 1.25 -- -- -- -- -- max. -- 4.5 100 -100 50 0.029 3.0 VGS = 0V, I D = 1.0 mA VGS = VDS , ID = 1.0 mA VGS = 20V nA VGS = -20V A VDS = 0.8 x Max Rating, VGS = 0V VGS = 12V, ID = 35A V V TC = 25C, IS = 35A,VGS = 0V
100K Rads (Si) 1000K Rads (Si) Units
Table 2. High Dose Rate
1011 Rads (Si)/sec 1012 Rads (Si)/sec
Parameter
VDSS IPP di/dt L1 Drain-to-Source Voltage
Min. Typ Max. Min. Typ. Max. Units Test Conditions -- -- 48 -- -- 48 V Applied drain-to-source voltage during gamma-dot -- 140 -- -- 140 -- A Peak radiation induced photo-current -- 800 -- -- 160 -- A/sec Rate of rise of photo-current 0.1 -- -- 0.8 -- -- H Circuit inductance required to limit di/dt
Table 3. Single Event Effects
Parameter
BV DSS
Typ.
60
Units
V
Ion
Ni
LET (Si) (MeV/mg/cm2)
28
Fluence (ions/cm2)
1 x 105
Range (m)
~41
VDS Bias (V)
60
VGS Bias (V)
-5
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IRHM7064, IRHM8064 Devices
Repetitive Rating; Pulse width limited by
maximum junction temperature. Refer to current HEXFET reliability report. @ VDD = 25V, Starting T J = 25C, EAS = [0.5 * L * (IL2) * [BV DSS/(BV DSS-VDD)] Peak IL = 35A, VGS = 12V, 25 RG 200 ISD 35A, di/dt 170 A/s, VDD BV DSS, TJ 150C Suggested RG = 2.35 Pulse width 300 s; Duty Cycle 2% K/W = C/W W/K = W/C
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Radiation Characteristics
Total Dose Irradiation with VGS Bias.
+12 volt VGS applied and VDS = 0 during irradiation per MIL-STD-750, method 1019. Total Dose Irradiation with VDS Bias. VDS = 0.8 rated BVDSS (pre-radiation) applied and V GS = 0 during irradiation per MlL-STD-750, method 1019. This test is performed using a flash x-ray source operated in the e-beam mode (energy ~2.5 MeV), 30 nsec pulse. Process characterized by independent laboratory. All Pre-Radiation and Post-Radiation test conditions are identical to facilitate direct comparison for circuit applications.

Case Outline and Dimensions - TO-254AA
3 2 1
Conforms to JEDEC Outline TO-254AA Legend: 1 - Drain 2 - Source 3 - Gate Notes: 1. Dimensioning and Tolerancing per ANSI Y14.5M-1982 2. All dimensions are shown in millimeters (inches). 3. Leadform is available in either orientation. Optional leadforms for outline TO-254
CAUTION
BERYLLIA WARNING PER MIL-PRF-19500 Packages containing beryllia shall not be ground, sandblasted, machined, or have other operations performed on them which will produce beryllia or beryllium dust. Furthermore, beryllium oxides packages shall not be placed in acids that will produce fumes containing beryllium.
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