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| MICROWAVE CORPORATION v03.0304 HMC158 Features Conversion Loss: 15 dB Fo, 3Fo, 4Fo Isolation: 40 dB Input Drive Level: 10 to 20 dBm GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 1.3 - 4.0 GHz INPUT Typical Applications The HMC158 is suitable for: * Wireless Local Loop * LMDS, VSAT, and Pt to Pt Radios * UNII & HiperLAN * Test Equipment 4 FREQ. MULTIPLIERS - CHIP Functional Diagram General Description The HMC158 is a miniature frequency doubler in a MMIC die. Suppression of undesired fundamental and higher order harmonics is 40 dB typical with respect to input signal level. The doubler uses the same diode/balun technology used in Hittite MMIC mixers, features small size and requires no DC bias. Electrical Specifications, TA = +25 C, As a Function of Drive Level Input = +10 dBm Parameter Frequency Range, Input Frequency Range, Output Conversion Loss FO Isolation (with respect to input level) 3FO Isolation (with respect to input level) 4FO Isolation (with respect to input level) Min. Typ. 1.7 - 4.0 3.4 - 8.0 18 22 37 Max. Min. Input = +15 dBm Typ. 1.7 - 3.5 3.4 - 7.0 15 45 18 Max. Min. Input = +20 dBm Typ. 1.3 - 4.0 2.6 - 8.0 15 18 Max. Units GHz GHz dB dB 40 50 dB 32 40 dB 4-6 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com v03.0304 MICROWAVE CORPORATION HMC158 GaAs MMIC FREQUENCY DOUBLER, 1.3 - 4.0 GHz INPUT GaAs Gain vs. Drive Level PUMPED MIXER 17 - 25 GHz Conversion MMIC SUB-HARMONICALLY Isolation @ +15 dBm Drive Level* CONVERSION GAIN (dB) 4 Output Return Loss vs. Drive Level Input Return Loss vs. Drive Level For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 4-7 FREQ. MULTIPLIERS - CHIP *With respect to input level v03.0304 MICROWAVE CORPORATION HMC158 GaAs MMIC FREQUENCY DOUBLER, 1.3 - 4.0 GHz INPUT Absolute Maximum Ratings Input Drive Storage Temperature Operating Temperature +27 dBm -65 to +150 C -55 to +85 C 4 FREQ. MULTIPLIERS - CHIP Outline Drawing NOTES: 1. THREE PADS ON EACH CORNER MUST BE BONDED TO GROUND (12 TOTAL). 2. ALL DIMENSIONS IN INCHES [MILLIMETERS] 3. ALL TOLERANCES ARE 0.025 [0.001] 4. DIE THICKNESS IS 0.254 [0.010] 5. BOND PADS ARE 0.100 [0.004] SQUARE 6. EQUALLY SPACED AT 0.150 [0.006] CENTERS 7. BACKSIDE METALLIZATION: NONE 8. BOND PAD METALLIZATION: GOLD 4-8 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com v03.0304 MICROWAVE CORPORATION HMC158 GaAs MMIC FREQUENCY DOUBLER, 1.3 - 4.0 GHz INPUT Handling Precautions Follow these precautions to avoid permanent damage. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against > 250V ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. 4 FREQ. MULTIPLIERS - CHIP 4-9 Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding wiht a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energry to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package. RF bonds should be as short as possible. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com |
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