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Agilent HSMx-C265 Surface Mount Chip LEDs Data Sheet Description The HSMx-C265 is a reverse mountable chip-type LED for lighting the non-component side of a PCB board. In this reverse mounting configuration, this LED is designed to emit light through a small cut-out hole in the PC board. The HSMx-C265 is available in four colors. The small size, narrow footprint, and low profile make this series of LEDs excellent for backlighting, status indication, and front panel illumination application. Features * Reverse mountable * Undiffused optics * Small 3.4 x 1.25 mm footprint * Operating temperature range of -30C to +85C * Compatible with IR solder reflow * Four colors available: red, orange, yellow, and green * Available in 8 mm tape on 7" (178 mm) diameter reels Applications * Keypad backlighting * Symbol backlighting * LCD backlighting * Status indication * Front panel indicator Device Selection Guide Part Number HSMS-C265 HSMD-C265 HSMY-C265 HSMG-C265 HSMH-C265 Color High Efficiency Red Orange Yellow Green AlGaAs Red Parts Per Reel 3000 3000 3000 3000 3000 Package Dimensions 3.4 (0.134) LED DIE CATHODE MARK (ETCHED) [ANODE MARK FOR HSMH-C265] 1.25 (0.049) 2 - 0.6 (0.028) (GREEN SOLDER MASK) UNDIFFUSED EPOXY 1.1 (0.043) PC BOARD 1.2 (0.047) POLARITY [3] 1.1 (0.043) 0.3 (0.012) CATHODE LINE 0.50 0.15 (0.020 0.006) 0.50 0.15 (0.020 0.006) SOLDERING TERMINAL NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 3. POLARITY OF HSMH-C265 WILL BE THE OPPOSITE OF WHAT IS SHOWN ON ABOVE DRAWING. Absolute Maximum Ratings TA = 25C Parameter DC Forward Current [1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR = 100 A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature Notes: 1. Derate linearly as shown in Figure 4. 2. Pulse condition of 1/10 duty and 0.1 ms width. HSMD/G/S/Y-C265 25 100 65 5 95 -30 to +85 -40 to +85 HSMH-C265 25 100 65 5 95 -30 to +85 -40 to +85 Units mA mA mW V C C C See IR soldering profile (Figure 6) 2 Electrical Characteristics TA = 25C Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 2.1 2.2 2.1 2.2 1.8 2.6 2.6 2.6 2.6 2.6 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 5 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ.[1] 8 6 7 6 18 Thermal Resistance RJ-PIN (C/W) Typ. 250 250 250 250 300 Part Number HSMS-C265 HSMD-C265 HSMY-C265 HSMG-C265 HSMH-C265 Optical Characteristics TA = 25C Luminous Intensity Iv (mcd) @ 20 mA[1] Min. Typ. 2.5 2.5 2.5 4.0 6.3 10.0 8.0 8.0 15.0 17.0 Peak Wavelength peak (nm) Typ. 630 605 589 570 660 Dominant Wavelength d (nm)[2] Typ. 626 604 586 572 639 Viewing Angle 21/2 Degrees [3] Typ. 170 170 170 170 170 Part Number HSMS-C265 HSMD-C265 HSMY-C265 HSMG-C265 HSMH-C265 Color HER Orange Yellow Green AlGaAs Notes: 1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, d, is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3 Color Bin Limits Green Color Bins[1] Bin ID A B C D E Tolerance: 0.5 nm Dom. Wavelength (nm) Min. Max. 561.5 564.5 564.5 567.5 567.5 570.5 570.5 573.5 573.5 576.5 Yellow/Amber Color Bins[1] Dom. Wavelength (nm) Bin ID Min. A 582.0 B 584.5 C 587.0 D 589.5 E 592.0 F 594.5 Tolerance: 0.5 nm Max. 584.5 587.0 589.5 592.0 594.5 597.0 Orange Color Bins[1] Dom. Wavelength (nm) Bin ID Min. A 597.0 B 600.0 C 603.0 D 606.0 E 609.0 F 612.0 Tolerance: 1 nm Max. 600.0 603.0 606.0 609.0 612.0 615.0 Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Bin ID Min. Max. A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 Tolerance: 15% Bin ID N P Q R S T U V W X Y Intensity (mcd) Min. Max. 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00 715.00 1125.00 1125.00 1800.00 1800.00 2850.00 2850.00 4500.00 Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 4 1.0 GREEN RELATIVE INTENSITY YELLOW 0.5 ORANGE HER 0 500 550 600 650 700 750 WAVELENGTH - nm Figure 1. Relative intensity vs. wavelength. IF MAX. - MAXIMUM FORWARD CURRENT - mA 35 30 25 20 15 10 5 0 0 20 40 60 80 100 RJ-A = 600C/W RJ-A = 800C/W 100 IF - FORWARD CURRENT - mA 1.6 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) HER 10 GREEN 1.2 0.8 1 YELLOW 0.1 ORANGE 1.5 1.7 1.9 2.1 2.3 0.4 0 0 10 20 30 40 VF - FORWARD VOLTAGE - V IF - FORWARD CURRENT - mA TA - AMBIENT TEMPERATURE - C Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward current. Figure 4. Maximum forward current vs. ambient temperature. 1.00 0.90 RELATIVE INTENSITY - % 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle. Note: 1. All dimensions in millimeters (inches). 5 2.2 (0.087) DIA. PCB HOLE 10 SEC. MAX. TEMPERATURE 230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. 3C/SEC. MAX. 1.25 (0.049) 1.4 (0.055) 2.3 (0.091) 1.4 (0.055) Figure 6. Recommended reflow soldering profile. Figure 7. Recommended soldering pad pattern. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 8. Reeling orientation. 8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) O 20.20 MIN. (O 0.795 MIN.) O 13.1 0.5 (O 0.516 0.020) 3.0 0.5 (0.118 0.020) 178.40 1.00 (7.024 0.039) 59.60 1.00 (2.346 0.039) 4.0 0.5 (0.157 0.020) 6 PS 5.0 0.5 (0.197 0.020) Figure 9. Reel dimensions. Note: 1. All dimensions in millimeters (inches). 6 4.00 (0.157) 1.50 (0.059) CATHODE DIM. C (SEE TABLE 1) 0.20 0.05 (0.008 0.002) 1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012) DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.00 (0.157) CARRIER TAPE USER FEED DIRECTION COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) 1.30 (0.051) HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) Figure 10. Tape dimensions. END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 11. Tape leader and trailer dimensions. Storage Condition: 5 to 30C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been open for more than 1 week Baking recommended condition: 60 5C for 20 hours. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm (0.004 in.) unless otherwise specified. 7 www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright (c) 2002 Agilent Technologies, Inc. Obsoletes 5988-4568EN April 18, 2002 5988-6270EN |
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